connectivity solutions featuring chxunda XD-MX5023-T 2.00mm pitch connector series for wire gauges AWG 22 to 26
Product Overview
The 2.00mm pitch MX5023 connector series offers reliable connectivity solutions with a focus on performance and durability. Designed for a variety of applications, these connectors are suitable for use with wire gauges from AWG #22 to #26 and PC board thicknesses of 0.8mm to 1.6mm. They are manufactured by Shenzhen Xunda Technology Co., Ltd. and are compliant with relevant GB/T standards for electrical connectors.
Product Attributes
- Brand: Xunda ()
- Origin: Shenzhen, China
- Certifications: UL94V-O (for housing materials)
- RoHS Compliant
Technical Specifications
| Category | Specification | Details |
|---|---|---|
| Series | MX5023 | 2.00mm Pitch, Single Row, Double Row Type |
| Product Part Number Prefix | XD-MX5023 | |
| Materials | Terminal Contact | Phosphor bronze (0.2mm thick), Tin plating (2-4m) |
| Housing Plastic | LCP UL94V-O (Nature color) | |
| Wafer (SMT) | PBT UL94V-O(2) (White color) | |
| Wafer (Through-hole) | LCP UL94V-O (Nature color) | |
| Electrical Performance | Rated Current | 3A AC/DC |
| Rated Voltage | 125V AC/DC | |
| Contact Resistance | Initial value 20m | |
| Environmental Performance | Operating Temperature Range | -25 to +85 |
| Humidity | 90-95% RH at 40 (96 hours) | |
| Salt Spray | 5% NaCl solution at 353 (48-8 hours) | |
| Mechanical Performance | Pin Retention Force | 10N (per contact) |
| Terminal Crimping Wire Strength | 30N (AWG#24 wire) | |
| Single Contact Withdrawal Force | 0.3N | |
| Durability | 30 cycles | |
| Applicable Wire Sizes | AWG #22 ~ #26 | |
| Applicable PC Board Thickness | 0.8mm ~ 1.6mm | |
| Appearance | Product surface without defects, dirt, cracks, or mechanical damage. Contacts without rust, plating oxidation, or peeling. | |
| Interchangeability | Exchangeable with same specification products. | |
| Storage Conditions | -20 to +40, 80% RH, no corrosive gases. Re-qualification test after 6 months. | |
| Transportation Temperature | -20 to +50 |
Available Models (Examples)
| Part Number | Type | Circuit | Dimensions (mm) |
|---|---|---|---|
| XD-MX5023-2Y | Housing () | 2 Pin | 8.00 |
| XD-MX5023-15Y | Housing () | 15 Pin | 32.10 |
| XD-MX5023-2AWT | Wafer () | 2 Pin | 8.00 |
| XD-MX5023-15AWT | Wafer () | 15 Pin | 34.00 |
| XD-MX5023-2ALT | Wafer () | 2 Pin | 10.90 |
| XD-MX5023-15ALT | Wafer () | 15 Pin | 36.60 |
Reflow Soldering Temperature Curve
Refer to Section 9.1 for SMT lead-free process temperature curve.
Cautions
Plastic parts are hygroscopic. Avoid exposure to temperatures >30 and humidity >60% RH before reflow soldering. Use within 24 hours after opening packaging to prevent foaming and deformation during soldering.
2410121632_chxunda-XD-MX5023-T_C20608189.pdf
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