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2 millimeter pitch double row PHB connector insulation resistance 1000 megaohms HCTL HC-PHB-2*7EY-05

Manufacturer:
HCTL
Description:
Connector Housing 14 Position 2mm Pitch Dual Row PA66 -25℃~+85℃
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Rectangular Connector Housings
Specifications
Flame Retardant Rating:
-
Pitch:
2mm
Colour:
白色
Number Of Rows:
2
With Wings:
不带翅
Reference Series:
-
Operating Temperature:
-25℃~+85℃
Plastic Material:
PA66
Number Of PINs Per Row:
7
Number Of Positions Or Pins:
2x7P
With Locker:
不带锁扣
Row Spacing:
2mm
Mfr. Part #:
HC-PHB-2*7EY-05
Package:
P=2mm
Model Number:
HC-PHB-2*7EY-05
Introduction

Product Overview

This specification document outlines the requirements for the 2.00MM PITCH PHB CONNECTOR DOUBLE ROW TYPE, part number HC-PHB - ****. It covers product performance, test methods, and inspection requirements for this series of connectors.

Product Attributes

  • Brand: (HCTLDZ)
  • Origin: Shenzhen, China
  • Certifications: UL94V-O (for Housing Plastic)
  • Color: Nature (for Housing Plastic and Plastic Wafer)

Technical Specifications

ItemRequirementTest Mode
Electrical PerformanceRated Voltage: 250V AC/DC
Rated Current: 2A AC/DC
Withstand Voltage: No breakdown or flashoverApply 500V DC(rms) for 1 minute between adjacent contacts to measure the insulation resistance
Contact Resistance: 20m (Initial value)A maximum voltage of 20mV and maximum current of 100mA are applied to the Mate connector. Does not include wire resistance.
Insulation Resistance: 1000 MApply 800V AC(rms) for 1 minute and the leakage current shall not exceed 0.5mA to the adjacent terminal and ground of the mate connectors.
Electrical Performance (Continued)
Contact Resistance: 40m (after Durability, Thermal Aging, Temperature Rise, Humidity, Thermal Shock, Salt Spray, Soldering Heat tests)
Mechanical PerformanceTerminal crimping Wire strength: 50N (AWG#22), 30N (AWG#24), 20N (AWG#26), 13N (AWG#28)Axial pullout force per contact at a rate of 25 3mm per minute
Single contact Withdrawal force: 12NThe terminal and the hole seat at a rate per minute to 25 3mm along the write direction are pulled out from the hole in the seat capacity.
Fixed terminals And hole seat: 12N
Single contact insertion force: 5NThe housing together with the terminal ends with wafer matched at a rate per minute to 25 3mm inserting force test.
Seat pull-out force: 15NExerts a force on the pin end at a rate per minute 253mm until the needle exit Seat pull-out force.
Pin Retention Force:
Durability: 30 cyclesMate connectors up 30 cycles at a Maximum rate of 10 cycles per minute prior to environmental test. Contact Resistance 40m.
VibrationAmplitude: 1.5mm p-p, Frequency: 10-55-10Hz/minute, Duration: 2 hours for each direction (X, Y, Z axes). Current discontinuity 1 sec. Contact Resistance 40m.Mate connector combination state of the welding circuit board as test samples, resistance to vibration test.
Mechanical Performance (Continued)
Environmental PerformanceThermal Aging: Appearance: No damage, Contact Resistance 40mConnector combination condition is placed in the accordance with the following specifications high temperature aging test after the test and measurement of contact resistance. Temperature: 852, Period: 96 hours continuously.
Temperature Rise: Measure contact temperature rise when maximum rated current is passed.
Humidity (Constant Humidity): Appearance: No damage, Contact Resistance 40m, Insulation Resistance 1000mConnector combination under the condition of constant temperature of the following specifications constant temperature and humidity test after the experiment measuring contact resistance insulation resistance and withstand voltage test. Relative humidity: 90-95% (RH), Period: 96 hours continuously. Temperature: 402 C.
Thermal Shock: Appearance: No damage, Contact Resistance 40m, Insulation Resistance 1000m, Withstand Voltage: No breakdown or flashoverOne cycle consists of -553C 30min, room temp 10-15min. Total cycle: 5 cycles. 853C 30min, room temp 10-15min.
Salt Spray: Appearance: No damage, Contact Resistance 40mTemperature: 353C, Concentration: 51%, Period: Stamping before tin plated for 24 hours, Stamping after tin plated for 8 hours.
Solder Ability: Soldering area: 90%Solder temperature: 2455C, Immersion period: 3 0.5S.
Soldering Heat ResistanceManual Soldering: Resistance 40mSoldering time: 30.5S, Soldering pot: 350 5C. Position DIP type needle solder conductor or a fixed piece at the end of the 1.5mm distance.
Wave Soldering: Resistance 40mSoldering time: 50.5S, Soldering pot: 260 5C.

2310171743_HCTL-HC-PHB-2-7EY-05_C18548026.pdf

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