Durable 2.50MM Pitch XHB Connector Double Row Type HCTL HC XHB 3Y with Brass Contacts and Nylon Housing
Manufacturer:
HCTL
Description:
Connector Housing 3 Position 2.5mm Pitch Single Row XHB Series PA66 -25℃~+85℃
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Rectangular Connector Housings
Specifications
Flame Retardant Rating:
UL94V-0
Pitch:
2.5mm
Colour:
白色
Number Of Rows:
1
With Wings:
不带翅
Reference Series:
XHB
Operating Temperature:
-
Plastic Material:
PA66
Number Of PINs Per Row:
3
Number Of Positions Or Pins:
1x3P
With Locker:
带锁扣
Row Spacing:
-
Mfr. Part #:
HC-XHB-3Y
Package:
P=2.5mm
Model Number:
HC-XHB-3Y
Introduction
Product Overview
This specification document outlines the details for the 2.50MM PITCH XHB CONNECTOR DOUBLE ROW TYPE. It covers product performance, test methods, and inspection requirements for this series of connectors.
Product Attributes
- Brand: HCTLDZ ()
- Origin: Shenzhen, China
- Material (Contact): Brass (Tin plating), Phosphor bronze (Tin plating)
- Material (Housing): Nylon66 UL94V-O
- Color: Nature
- Certifications: ROHS
Technical Specifications
| Item | Requirement | Test Mode |
| 3. USE CONDITION | ||
| Ambient temperature | -40 105 | |
| Applicable Wire Sizes | AWG #2228 | |
| Applicable PC board thickness | 1.6mm | |
| Appearance | Product surface without defect, dirt, crack, and mechanical damage; contact parts without rust, plating oxidation, or peeling. | |
| Exchangeable | Exchangeable with same specification products. | |
| 6. Electrical Performance | ||
| Contact Resistance | Initial value 20m | Mate connector combination state, apply 20mV max voltage and 100mA max current to adjacent conductors (does not include wire resistance). |
| Insulation Resistance | 1000 M | Apply 500V DC (rms) for 1 minute between adjacent contacts. |
| Withstand voltage | No breakdown or flashover | Apply 1000V AC (rms) for 1 minute between adjacent terminals and ground of mate connectors, leakage current 0.5mA. |
| Rated Voltage | 250V AC/DC | |
| Rated Current | 3A AC/DC | |
| 7. Mechanical Performance | ||
| Single contact insertion force | 5.5N | Housing together with terminal ends with wafer matched at a rate of 253mm/min. |
| Single contact Withdrawal force | 1.5N | Housing together with terminal ends with wafer matched at a rate of 253mm/min. |
| Terminal crimping Wire strength | 10N (AWG#22), 13N (AWG#24), 20N (AWG#26), 30N (AWG#28) | Axial pullout force at a rate of 253mm/min. |
| Pin Retention Force | 15N | Exerts a force on the pin end at a rate of 253mm/min until the needle exits the seat. |
| Fixed terminals And hole seat | 50N | |
| Durability | Contact Resistance 30m, Appearance: No damage | Mate connectors up to 30 cycles at a maximum rate of 10 cycles/min prior to environmental test. |
| Vibration | Contact Resistance 30m, Current interruption 1 sec, Appearance: No damage | Amplitude: 1.5mm p-p, Frequency: 10-55-10 Hz/min, Period: 2 hours for each direction (X, Y, Z axes). |
| 8. Endurance Characteristics | ||
| Thermal Aging | Contact Resistance 30m, Appearance: No damage | Connector combination condition placed in a heating oven at 852C for 96 hours continuously. |
| Temperature Rise | Measure temperature rise of contact when maximum rated current is passed. | |
| Humidity | Contact Resistance 30m, Insulation Resistance 1000 M, Appearance: No damage | Connector combination condition placed in a constant temperature and humidity chamber at 402C and 90-95% RH for 96 hours continuously. |
| Temperature cycling | No breakdown or flashover | One cycle: -403C (30min) -> room temp (10-15min) -> 1053C (30min) -> room temp (10-15min). Total 5 cycles. |
| Salt spray | Contact Resistance 30m, Appearance: No damage | Solution: 51% NaCl. Stamping before tin plated for 24 hours. After test, rinse with water and dry naturally. |
| Solder ability | Soldering area 90% | DIP type: Soldering temperature 3505C, Immersion period 30.5S. SMT type: Soldering temperature 2603C, Immersion period 30.5S. Stamping after tin plated for 8 hours. |
| Resistance to soldering heat | Appearance: No damage | Manual soldering: Soldering time 30.5S, Soldering pot 3505C. Wave soldering: Soldering time 30.5S, Soldering pot 2603C. Position: DIP 1.5mm from conductor/fixed piece, SMT 0.5mm from conductor/fixed piece. |
2512100932_HCTL-HC-XHB-3Y_C5124196.pdf
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