HMTCONN NANO SIM 7P 1.4H Connector Featuring High Temperature Thermoplastic Housing and Gold Plated Contacts
Product Overview
This product is a Micro SIM and Nano SIM card connector designed for electronic devices. It features a durable construction with high-temperature thermoplastic housing and copper alloy terminals, plated with gold for reliable contact. The connector is designed for easy insertion and secure retention of SIM cards, suitable for various applications requiring SIM card connectivity.
Product Attributes
- Brand: Shenzhen Huamingtong Electronics Co., Ltd
- Origin: China
- Housing Material: High Temperature Thermoplastic UL94V-0
- Terminal Material: Copper Alloy
- Shell Material: Stainless Steel
- Color: Black
Technical Specifications
| Part Name | Description | Material | Thickness | Plating | Rated Current | Rated Voltage | Contact Resistance (MAX) | Insulation Resistance (MIN) | Dielectric Withstanding Voltage | Solder Ability | Operating Temperature | Operating Humidity |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| INSULATOR | BASE | LCP+GF30% | ||||||||||
| TERMINAL | C5210-EH | 0.12mm | Gold on Contact Area and Solder Tails | 0.5A | 50V | 80m | 100M (100V DC) | 100V AC | 2455C, 50.5s | -40C~+85C | 80% R.H MAX | |
| SHELL | SUS304-H | 0.15mm | AU/Ni | |||||||||
| Peg | Gold on Solder Tails |
2512121540_HMTCONN-NANO-SIM-7P-1-4H_C53121338.pdf