Home > Products > Arrays, Edge Type, Mezzanine (Board to Board) >Arrays, Edge Type, Mezzanine (Board to Board) > Connector with UL 94 V0 Rated LCP Housing and Gold Nickel Plated Contacts HOAUC HYCW60M-BTB2X15-047B

Connector with UL 94 V0 Rated LCP Housing and Gold Nickel Plated Contacts HOAUC HYCW60M-BTB2X15-047B

Manufacturer:
HOAUC
Description:
0.35mm 2 30P -40℃~+85℃ 7A Surface Mount,Vertical SMD,P=0.35mm Arrays, Edge Type, Mezzanine (Board to Board) RoHS
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Arrays, Edge Type, Mezzanine (Board to Board)
Specifications
Voltage Rating:
30V
Pitch:
0.35mm
Number Of Rows:
2
Number Of Pins:
30P
Operating Temperature:
-40℃~+85℃
Current Rating:
7A
Mounting Type:
立贴
Contact Material:
铜合金
Mfr. Part #:
HYCW60M-BTB2X15-047B
Package:
SMD,P=0.35mm
Model Number:
HYCW60M-BTB2X15-047B
Introduction

Product Overview

This product is a high-performance connector designed for various electronic applications. It features robust construction with LCP housing and copper alloy contacts plated with gold and nickel for superior conductivity and durability. Suitable for reflow soldering processes, it offers reliable signal and power connections.

Product Attributes

  • Housing Material: LCP, Black, UL 94 V-0
  • Contact Material: Copper Alloy
  • Contact Plating: Au4u" Min On Contact Area, Au1u" Min On Solder Area, Ni 50u"Min All Over
  • Carrier Tape: Embossed PS
  • Cover Tape: Polyester
  • Reel: Plastic
  • Certifications: UL 94 V-0

Technical Specifications

SpecificationValue
Voltage30V AC/DC
Current0.3A/Signal Contact, 7A/Power Contact
Temperature-40C to +85C
Contact Resistance90m /Signal Contact, 30m /Power Contact
Insulation Resistance50M MIN Initial
Dielectric Withstanding Voltage100V AC for one minute
Durability30 Cycles
IR Reflow Cycle2 Cycles Max.
Pitch (P)0.35"
Reel Quantity15000 Connectors

2511281600_HOAUC-HYCW60M-BTB2X15-047B_C53058941.pdf

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