Compact and HMTCONN MICRO SIM 7P 1.35H connector suitable for integration in communication devices
Manufacturer:
HMTCONN
Description:
SMD PC Card Sockets RoHS
Category:
PC Card Sockets/PC Card Sockets
Specifications
Mfr. Part #:
MICRO SIM 7P 1.35H
Package:
SMD
Model Number:
MICRO SIM 7P 1.35H
Introduction
Product Overview
This product is a Micro SIM and Nano SIM card connector manufactured by Shenzhen Huamingtong Electronics Co., Ltd. It is designed for electronic devices requiring SIM card functionality. The connector offers various models with different dimensions and features, suitable for a range of applications.
Product Attributes
- Brand: Shenzhen Huamingtong Electronics Co., Ltd
- Origin: China
- Certifications: RoHS
Technical Specifications
| Model | Type | Dimensions (mm) | Push Stroke (mm) | Mating Cycles | Salt Spray Time (H) |
| Micro SIM | 12.00 | 6.35 | 1.27(5X) | 5000MIN | 24 |
| Micro SIM | 15.00 | 6.35 | 1.35(6X) | 5000MIN | 24 |
| Micro SIM | 8.80 | 6.35 | 3.10 | 5000MIN | 24 |
| Nano SIM | 12.30 | 6.35 | 12.68 | 5000MIN | 24 |
| Nano SIM | 0.68 | 6.35 | 1.10(4X) | 5000MIN | 24 |
| Micro SIM | 1.52 | 6.35 | 2.60 | 5000MIN | 24 |
| Micro SIM | 2.90 | 6.35 | 0.90(6X) | 5000MIN | 24 |
| Micro SIM | 2.90 | 6.35 | 2.60 | 5000MIN | 24 |
| Micro SIM | 15.35 | 6.35 | 15.35 | 5000MIN | 24 |
| Micro SIM | 12.68 | 6.35 | 12.68 | 5000MIN | 24 |
| Micro SIM | 8.25 | 6.35 | 8.25 | 5000MIN | 24 |
| Nano SIM | 0.55 | 6.35 | 0.55 | 5000MIN | 24 |
| Nano SIM | 16.45 | 6.35 | 16.45 | 5000MIN | 24 |
| Nano SIM | 15.30 | 6.35 | 15.30 | 5000MIN | 24 |
| Nano SIM | 16.36 | 6.35 | 16.36 | 5000MIN | 24 |
| Nano SIM | 0.37 | 6.35 | 0.37 | 5000MIN | 24 |
| Nano SIM | 1.22 | 6.35 | 1.22 | 5000MIN | 24 |
| Nano SIM | 1.38 | 6.35 | 1.38 | 5000MIN | 24 |
| Nano SIM | 12.15 | 6.35 | 12.15 | 5000MIN | 24 |
| Micro SIM | 15.40 | 6.35 | 1.27 | 5000MIN | 24 |
| Nano SIM | 16.37 | 6.35 | 1.20 | 5000MIN | 24 |
| Micro SIM | 1.35 | 6.35 | 1.35 | 5000MIN | 24 |
| Micro SIM | 15.60 | 6.35 | 15.60 | 5000MIN | 24 |
| Micro SIM | 16.95 | 6.35 | 16.95 | 5000MIN | 24 |
| Micro SIM | 17.20 | 6.35 | 17.20 | 5000MIN | 24 |
| SIM Card Eject Position | 3.750.2 |
Material and Electrical Specifications
| Specification | Details |
| Insulator Material | High Temperature Thermoplastic, UL 94V-0 |
| Contact Material | Copper Alloy |
| Shell Material | SUS |
| Contact Plating | Plated 50u" Ni over all, Contact Au 1u, Selective Contact Area |
| Shell Plating | Plated 50u" Ni over all, Plated 1u" Au |
| Current Rating | 0.5mA |
| Voltage Rating | 5V AC/DC |
| Ambient Temperature Range | -40 ~ +85 |
| Storage Temperature Range | -40 ~ +85 |
| Ambient Humidity Range | 95% R.H. MAX. |
| Contact Resistance | 100M MAX. |
| Insulation Resistance | 1000M MIN./500VDC |
| Reflow Peak Temp | 260 |
2512081620_HMTCONN-MICRO-SIM-7P-1-35H_C53121335.pdf
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