Connector Featuring 7 Amp Power Contact and 0.3 Amp Signal Contact HOAUC HYCW60M-BTB2X12-047B for SMT
Manufacturer:
HOAUC
Description:
0.35mm 2 24P -40℃~+85℃ 7A Surface Mount,Vertical SMD,P=0.35mm Arrays, Edge Type, Mezzanine (Board to Board) RoHS
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Arrays, Edge Type, Mezzanine (Board to Board)
Specifications
Voltage Rating:
30V
Pitch:
0.35mm
Number Of Rows:
2
Number Of Pins:
24P
Operating Temperature:
-40℃~+85℃
Current Rating:
7A
Mounting Type:
立贴
Contact Material:
铜合金
Mfr. Part #:
HYCW60M-BTB2X12-047B
Package:
SMD,P=0.35mm
Model Number:
HYCW60M-BTB2X12-047B
Introduction
Product Overview
This product is a connector designed for high-reliability applications, featuring separate power and signal contacts. It is suitable for surface mount technology (SMT) with support for IR reflow soldering. The connector is provided on embossed carrier tape and reel for automated assembly.
Product Attributes
- Housing Material: LCP, UL 94 V-0
- Housing Color: Black
- Contact Material: Copper Alloy
- Contact Plating: Gold (Au)
- Carrier Tape Material: Polyester
- Reel Material: Plastic
- Certifications: UL 94 V-0
Technical Specifications
| Specification | Value |
|---|---|
| Voltage Rating | 30V AC/DC |
| Current Rating (Signal Contact) | 0.3A |
| Current Rating (Power Contact) | 7A |
| Operating Temperature | -25C to +85C |
| Contact Resistance (Signal Contact) | 90m |
| Contact Resistance (Power Contact) | 30m |
| Insulation Resistance | 50M (Initial) |
| Dielectric Withstanding Voltage | 100V AC (for 1 minute) |
| Durability | 30 Cycles |
| IR Reflow Cycle Capability | 2 Cycles Max. |
| Recommended Reflow Profile | Refer to Lead-Free Solder Paste Profile |
| PCB Layout Pitch | 0.35mm |
| Metal Thickness | 0.08 mm |
| Reel Quantity | 15000 Connectors |
2511281600_HOAUC-HYCW60M-BTB2X12-047B_C53058939.pdf
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