Durable board to wire connector HRS DF57H-2S-1.2C15 with reinforced lock and improved plug retention
Product Overview
The DF57 Series is a low-profile "Swing-Lock" board-to-wire connector designed for power applications. It features a reinforced lock structure with a unique swing-lock mechanism for enhanced cable retention and disengagement resistance. The connector offers improved plug retention, a highly reliable two-point contact structure, and an insert guide key to prevent misalignment. It is compliant with UL and C-UL standards.
Product Attributes
- Brand: HIROSE ELECTRIC CO., LTD.
- Series: DF57
- Type: Low Profile "Swing-Lock" Board to Wire Connector for Power
- Certifications: UL, C-UL
- Material/Finish: Header Insulator: LCP (Black, UL94V-0), Contact: Brass (Tin plating or gold plating), Crimp socket Insulator: PBT (White, UL94V-0) or LCP (Beige/Black, UL94V-0), Crimp contacts: Phosphor bronze (Tin plating or gold plating)
- Color: Black, Beige, White
Technical Specifications
| Item | Specification | Conditions |
| Insulation resistance | 100M min. | 100V DC |
| Withstanding voltage | No flashover or insulation breakdown | 500V AC / 1 minute |
| Contact resistance | 10m max. | 20mV max., at 1mA. |
| Vibration | No electrical discontinuity of 1s or longer; No damage, cracks or parts dislocation. | Frequency: 10 to 55Hz, single amplitude of 0.75mm, 10 cycles, 3 direction |
| Shock | No electrical discontinuity of 1s or longer; No damage, cracks or parts dislocation. | Acceleration of 490m/s, 11ms duration, sine half-wave, 3 cycles in each of the 3 axis |
| Humidity | Contact resistance: 20m max., Insulation resistance: 500M min.; No damage, cracks or parts dislocation. | 96 hours at 40 2, and humidity of 90 to 95% |
| Temperature cycle | Contact resistance: 20m max., Insulation resistance: 500M min.; No damage, cracks or parts dislocation. | -55C 5 to 35C 85C 5 to 35C (Times: 30 min. 2 min. to 3 min. 30 min. 2 min. to 3 min.) 5 cycles |
| Durability | Contact resistance: 20m max.; No damage, cracks or parts dislocation. | 30 cycles |
| Resistance to soldering heat | No deformation of components affecting performance | Reflow: At the recommended temperature profile; Manual soldering: 350C for 3 seconds |
| Series | No. of Contacts | Current Rating (AWG#26) | Current Rating (AWG#28) | Current Rating (AWG#30) | Current Rating (AWG#32) | Current Rating (AWG#34) | Voltage Rating | Operating Temperature Range | Operating Humidity Range |
| DF57 | 2 pos. | 3.0A | 2.5A | 1.5A | 1.0A | 0.8A | 2 to 6 pos. : 50V AC/DC; 2 pos. (Middle pin removed) : 100V AC/DC | -35 to 85 | 20% to 80% |
| DF57 | 3 pos. | _ | 2.0A | 1.0A | 0.8A | 0.5A | 2 to 6 pos. : 50V AC/DC | ||
| DF57 | 4 pos. | _ | 1.5A | 1.0A | 0.8A | 0.5A | |||
| DF57 | 5,6 pos. | 1.5A | 1.5A | 1.0A | 0.8A | 0.5A | |||
| DF57AH | 2 pos. | _ | _ | _ | _ | _ | 100V AC/DC | ||
| DF57AH | 5,6 pos. | _ | _ | _ | _ | _ | 50V AC/DC |
2410121810_HRS-DF57H-2S-1-2C-15_C2972431.pdf