Durable JST 16CZ-6H Connector Suitable for High Density Packaging and Wire to Board Connections
Manufacturer:
JST
Description:
Connector IDC Connectorector Free Hanging 16 position 1.5mm
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Free Hanging, Panel Mount
Specifications
Row Spacing:
-
Operating Temperature:
-25℃~+85℃
Current Rating:
2A
Number Of Positions Or Pins:
1x16P
Voltage Rating (Max):
100V
Number Of PINs Per Row:
16
Number Of Rows:
1
Connector Type:
IDC连接器
Pitch:
1.5mm
Mounting Type:
自由悬挂
Mfr. Part #:
16CZ-6H
Package:
P=1.5mm
Model Number:
16CZ-6H
Introduction
CZ FAMILY SERIES: CZ, CZW, CZH, CZHW, TZ, TZW Connectors
The CZ family of connectors, based on the 1.5mm pitch CZ connectors, is designed for high-density packaging applications. This series includes disconnectable insulation displacement connectors (IDCs) suitable for wire-to-board and wire-to-wire connections. The CZW connector holder enables dual-row wire-to-board connections using CZ sockets, while the TZ (single-row) and TZW (dual-row) connectors facilitate wire-to-wire connections, also utilizing CZ sockets. The CZ connectors offer distortion-resistant and compact construction with low-profile options. The CZW connectors feature low insertion force and locking construction. CZH connectors include a housing lance and are interchangeable. TZ/TZW connectors are applicable to a wide range of panel thicknesses, with a panel lock design that prevents wire snagging during mounting. The series is RoHS compliant.
Product Attributes
- Brand: JST
- Certifications: UL Recognized E60389, Certified LR20812
- RoHS Compliance: Yes
Technical Specifications
| Series | Type | Current Rating | Voltage Rating | Temperature Range | Contact Resistance (Initial/After Env. Tests) | Insulation Resistance | Withstanding Voltage | Applicable Wire | Applicable PC Board Thickness | Applicable Panel Thickness | Material (Contact) | Material (Housing) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| CZ / CZW | Through-hole / SMT | 2 A (AWG #26) | 100 V AC, DC | -25C to +85C | 10 m max. / 20 m max. | 500 M min. | 500 VAC/minute | AWG #28 to #26 (Conductor / 7-strands, tin-coated annealed copper; Insulation O.D. / 0.7 to 0.83 mm) | 1.6 mm | - | Phosphor bronze, tin-plated (reflow treatment) | Glass-filled PA 66, UL94V-0 |
| CZH / CZHW | Through-hole / SMT | 2 A (AWG #26) | 100 V AC, DC | -25C to +85C | 20 m max. / 40 m max. | 500 M min. | 500 VAC/minute | UL10272 (Contact JST for other UL style wires.) | - | 0.5 to 2 mm | Phosphor bronze, tin-plated (reflow treatment) | PBT, UL94V-0, natural (white) |
| TZ / TZW | Wire-to-wire | - | - | - | - | - | - | - | - | 0.5 to 2 mm | - | - |
Product Models and Dimensions (Partial List)
| Model No. | Circuits | Dimension A (mm) | Dimension B (mm) | Material | Qty/Box or Reel |
|---|---|---|---|---|---|
| 02CZ-6H to 20CZ-6H | 2 to 20 | 1.5 to 28.5 | 4.5 to 31.5 | Contact: Phosphor bronze, tin-plated; Housing: Glass-filled PA 66, UL94V-0 | 2,000 (for 2-15 circuits), 1,000 (for 16-20 circuits) |
| CZHR-02V-S to CZHR-20V-S | 2 to 20 (excluding 18) | 1.5 to 28.5 | 3.5 to 30.5 | Housing: PBT, UL94V-0, natural (white) | 1,000 |
| B02B-CZHK-B-1 to B20B-CZHK-B-1 (Top entry) | 2 to 20 | 1.5 to 28.5 | 6.0 to 33.0 | Pin: Copper alloy, tin-plated; Wafer: Glass-filled PA 66, UL94V-0 | 2,072 (for 2 circuits), 1,624 (for 4 circuits), etc. |
| S02B-CZHK-B-1 to S20B-CZHK-B-1 (Side entry) | 2 to 20 | 1.5 to 28.5 | 4.5 to 31.5 | Pin: Copper alloy, tin-plated; Wafer: Glass-filled PA 66, UL94V-0 | 1,480 (for 2 circuits), 1,160 (for 4 circuits), etc. |
| BM02B-CZSS-1-TF to BM20B-CZSS-1-TF (Top entry) | 2, 4-6, 8, 10, 13-17, 20 | 1.5 | - | Pin: Copper alloy, tin-plated; Wafer: PA, UL94V-0; Solder tab: Copper alloy, tin-plated | - |
| SM02B-CZSS-1-TF to SM20B-CZSS-1-TF (Side entry) | 2, 4-6, 8, 10, 13-17, 20 | 1.5 | - | Pin: Copper alloy, tin-plated; Wafer: PA, UL94V-0; Solder tab: Copper alloy, tin-plated | - |
| SCZH-002T-P0.5 | - | 3.7 | - | Contact: Phosphor bronze, tin-plated; Housing: PBT, UL94V-0 | 13,000 / reel |
2008261906_JST-16CZ-6H_C567333.pdf
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