Home > Products > Arrays, Edge Type, Mezzanine (Board to Board) >Free Hanging, Panel Mount > wire to board connector JST 05SUR 32S featuring twin U slot insulation displacement and 3 point grip

wire to board connector JST 05SUR 32S featuring twin U slot insulation displacement and 3 point grip

Manufacturer:
JST
Description:
Connector IDC Housing Free Hanging 5 position 0.8mm
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Free Hanging, Panel Mount
Specifications
Row Spacing:
-
Color:
白色
Operating Temperature:
-25℃~+85℃
Current Rating:
500mA
Contact Plating:
Contact Material:
铜合金
Voltage Rating (Max):
30V
Number Of Positions Or Pins:
1x5P
Number Of PINs Per Row:
5
Number Of Rows:
1
Connector Type:
IDC胶壳
Pitch:
0.8mm
Mounting Type:
自由悬挂
Mfr. Part #:
05SUR-32S
Package:
P=0.8mm
Model Number:
05SUR-32S
Introduction

Product Overview

The SUR CONNECTOR is a revolutionary 0.8 mm pitch disconnectable insulation displacement connector designed for wire-to-board applications. It features a 3-point grip construction and is applicable for super fine wires. The connector offers both top and side entry types, with the side entry type boasting an ultra-low profile of only 3.9 mm depth and 1.75 mm height when mounted on a PC board. This significantly reduces board space by 34% compared to conventional 1.0 mm pitch connectors. The twin U-slot insulation displacement section ensures reliable connections.

Product Attributes

  • Brand: JST
  • Certifications: Standards Recognized E60389, Certified LR20812
  • RoHS Compliance: Yes
  • Packaging: Emboss Tape

Technical Specifications

FeatureSpecification
Pitch0.8 mm
Current Rating0.5 A AC, DC (AWG #32); 0.2 A AC, DC (AWG #36)
Voltage Rating30 V DC
Temperature Range-25 to +85 (including temperature rise in applying electrical current)
Contact ResistanceInitial value: 20 m max.; After environmental tests: 40 m max.
Insulation Resistance100 M min.
Withstanding Voltage200 VAC/minute
Applicable Wire Conductor SizeAWG #32, #36
Applicable Wire Conductor Structure7 strands, tin-coated copper alloy
Applicable Wire Insulation O.D.0.39 mm
Contact MaterialCopper alloy, tin-plated (reow treatment)
Housing MaterialPA, UL94V-0
Wafer MaterialPA, UL94V-0, natural
Solder Tab MaterialBrass, copper-undercoated, tin-plated (reow treatment)
Side Entry Type Dimensions (mounted on PC board)Depth: 3.9 mm; Height: 1.75 mm
Top Entry Type Dimensions (mounted on PC board)Depth: 2.2 mm; Height: 3.9 mm

2401301420_JST-05SUR-32S_C593626.pdf

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