Vacuum pick and place compatible connector JST 02SR-3S with twin U-slot insulation displacement design
Manufacturer:
JST
Description:
Connector IDC Connectorector 1mm
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Free Hanging, Panel Mount
Specifications
Row Spacing:
-
Contact Plating:
锡
Contact Material:
磷青铜
Number Of Rows:
1
Connector Type:
IDC连接器
Pitch:
1mm
Mounting Type:
-
Mfr. Part #:
02SR-3S
Package:
P=1mm
Model Number:
02SR-3S
Introduction
Product Overview
The SR/SZ Connector series offers compact, disconnectable insulation displacement connectors designed for automated assembly. Featuring a twin U-slot insulation displacement section and 3-point grip construction, these connectors are ideal for vacuum pick and place robotics. Available in through-hole and SMT types, they provide reliable connections for various applications.
Product Attributes
- Brand: JST
- Certifications: UL Recognized (E60389), LR Certified (LR20812)
- RoHS Compliance: Yes
Technical Specifications
| Model No. | Circuits | Type | Q'ty / Box | Dimensions (mm) (A x B) | Material and Finish |
|---|---|---|---|---|---|
| B03B-SZ | 3 | Through-hole | 9,405 | 5.2 x 3.0 | Contact: Phosphor bronze, tin-plated (reflow treatment) Housing: PA, UL94V-0, natural |
| B04B-SZ | 4 | Through-hole | 7,920 | 6.2 x 4.0 | Contact: Phosphor bronze, tin-plated (reflow treatment) Housing: PA, UL94V-0, natural |
| B05B-SZ | 5 | Through-hole | 6,765 | 7.2 x 5.0 | Contact: Phosphor bronze, tin-plated (reflow treatment) Housing: PA, UL94V-0, natural |
| B06B-SZ | 6 | Through-hole | 5,940 | 8.2 x 6.0 | Contact: Phosphor bronze, tin-plated (reflow treatment) Housing: PA, UL94V-0, natural |
| B07B-SZ | 7 | Through-hole | 5,280 | 9.2 x 7.0 | Contact: Phosphor bronze, tin-plated (reflow treatment) Housing: PA, UL94V-0, natural |
| B08B-SZ | 8 | Through-hole | 10.2 x 8.0 | Contact: Phosphor bronze, tin-plated (reflow treatment) Housing: PA, UL94V-0, natural | |
| B09B-SZ | 9 | Through-hole | 11.2 x 9.0 | Contact: Phosphor bronze, tin-plated (reflow treatment) Housing: PA, UL94V-0, natural | |
| B11B-SZ | 11 | Through-hole | 13.2 x 11.0 | Contact: Phosphor bronze, tin-plated (reflow treatment) Housing: PA, UL94V-0, natural | |
| B14B-SZ | 14 | Through-hole | 16.2 x 14.0 | Contact: Phosphor bronze, tin-plated (reflow treatment) Housing: PA, UL94V-0, natural | |
| S03B-SZ | 3 | SMT | 3.0 x 2.0 | Contact: Brass, tin-plated (reflow treatment) Housing: Glass-filled PBT, UL94V-0, natural (white) | |
| S04B-SZ | 4 | SMT | 4.0 x 3.0 | Contact: Brass, tin-plated (reflow treatment) Housing: Glass-filled PBT, UL94V-0, natural (white) | |
| S05B-SZ | 5 | SMT | 5.0 x 4.0 | Contact: Brass, tin-plated (reflow treatment) Housing: Glass-filled PBT, UL94V-0, natural (white) | |
| S06B-SZ | 6 | SMT | 6.0 x 5.0 | Contact: Brass, tin-plated (reflow treatment) Housing: Glass-filled PBT, UL94V-0, natural (white) | |
| S07B-SZ | 7 | SMT | 7.0 x 6.0 | Contact: Brass, tin-plated (reflow treatment) Housing: Glass-filled PBT, UL94V-0, natural (white) | |
| BM02B-SRSS-TB | 2 | Through-hole | 3,000 | 4.0 x 1.0 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) |
| BM03B-SRSS-TB | 3 | Through-hole | 3,000 | 5.0 x 2.0 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) |
| BM04B-SRSS-TB | 4 | Through-hole | 3,000 | 6.0 x 3.0 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) |
| BM05B-SRSS-TB | 5 | Through-hole | 3,000 | 7.0 x 4.0 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) |
| BM06B-SRSS-TB | 6 | Through-hole | 3,000 | 8.0 x 5.0 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) |
| BM07B-SRSS-TB | 7 | Through-hole | 3,000 | 9.0 x 6.0 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) |
| BM08B-SRSS-TB | 8 | Through-hole | 3,000 | 10.0 x 7.0 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) |
| BM09B-SRSS-TB | 9 | Through-hole | 3,000 | 11.0 x 8.0 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) |
| BM10B-SRSS-TB | 10 | Through-hole | 3,000 | 12.0 x 9.0 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) |
| BM11B-SRSS-TB | 11 | Through-hole | 3,000 | 13.0 x 10.0 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) |
| BM12B-SRSS-TB | 12 | Through-hole | 3,000 | 14.0 x 11.0 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) |
| BM13B-SRSS-TB | 13 | Through-hole | 3,000 | 15.0 x 12.0 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) |
| BM14B-SRSS-TB | 14 | Through-hole | 1,500 | 16.0 x 13.0 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) |
| SM02B-SRSS-TB | 2 | SMT | 2,000 | 4.0 x 1.0 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) |
| SM03B-SRSS-TB | 3 | SMT | 2,000 | 5.0 x 2.0 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) |
| SM04B-SRSS-TB | 4 | SMT | 2,000 | 6.0 x 3.0 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) |
| SM05B-SRSS-TB | 5 | SMT | 2,000 | 7.0 x 4.0 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) |
| SM06B-SRSS-TB | 6 | SMT | 2,000 | 8.0 x 5.0 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) |
| SM07B-SRSS-TB | 7 | SMT | 2,000 | 9.0 x 6.0 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) |
| SM08B-SRSS-TB | 8 | SMT | 2,000 | 10.0 x 7.0 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) |
| SM09B-SRSS-TB | 9 | SMT | 2,000 | 11.0 x 8.0 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) |
| SM10B-SRSS-TB | 10 | SMT | 2,000 | 12.0 x 9.0 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) |
| SM11B-SRSS-TB | 11 | SMT | 2,000 | 13.0 x 10.0 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) |
| SM12B-SRSS-TB | 12 | SMT | 2,000 | 14.0 x 11.0 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) |
| SM13B-SRSS-TB | 13 | SMT | 2,000 | 15.0 x 12.0 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) |
| SM14B-SRSS-TB | 14 | SMT | 1,500 | 16.0 x 13.0 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) |
General Specifications
| Parameter | Value |
|---|---|
| Current Rating | 0.7A DC |
| Voltage Rating | 50V DC |
| Temperature Range | -25C to +85C (including temperature rise) |
| Contact Resistance | Initial: 20m max. / After environmental testing: 40m max. |
| Insulation Resistance | 100M min. |
| Withstanding Voltage | 500V AC/minute |
| Applicable Wire | Conductor size: AWG #30 / 7 strands, tin-coated annealed copper Insulation O.D.: 0.54 to 0.58mm |
2304140030_JST-02SR-3S_C82373.pdf
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