Pin Header Connector 2.54mm Pitch Single Double Row Solder Type OUPIIN 2011-1X04G00S-2.9-7B-HT-P5.08
Manufacturer:
OUPIIN
Description:
Headers, Male Pins RoHS
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Headers, Male Pins
Specifications
Mfr. Part #:
2011-1X04G00S-2.9-7B-HT-P5.08
Model Number:
2011-1X04G00S-2.9-7B-HT-P5.08
Introduction
Product Overview
The OUPIIN 2011 Series Pin Header is a 2.54mm pitch connector designed for single and double row configurations. It is available in straight and right-angle orientations and is suitable for solder type applications. This series is manufactured by Oupiin Electronic Co.,Ltd. and is designed to meet stringent electrical, mechanical, and environmental performance requirements.
Product Attributes
- Brand: OUPIIN ()
- Certifications: RoHS
- Origin: Manufactured by Oupiin Electronic Co.,Ltd.
Technical Specifications
| Product Name | Part No. | Drawing No. | Description | Rating Current | Rating Voltage | Operating Temperature |
|---|---|---|---|---|---|---|
| 2011 Series Pin Header 2.54mm Single Row Straight Solder Type-HT | 2011-1XxxG00RB-HT | 2011D01113 | Single Row Straight Solder Type-HT | 3A | 110V AC | -40~+105 |
| 2011 Series Pin Header 2.54mm Double Row Straight Solder Type-HT | 2011-2XxxG00RB-HT | 2011D01104 | Double Row Straight Solder Type-HT | |||
| 2011 Series Pin Header 2.54mm Single Row Right Angle Solder Type-HT | 2011-1XxxG00SU-P-HT | 2011D01087 | Single Row Right Angle Solder Type-HT | 3A | 110V AC | -40~+105 |
| 2011 Series Pin Header 2.54mm Double Row Right Angle Solder Type-HT | 2011-2XxxG00ST-P-HT | 2011D01082 | Double Row Right Angle Solder Type-HT |
Performance and Test Requirements
| Item | Requirement | Test Method |
|---|---|---|
| Contact Resistance | 20 m Max. | EIA-364-06 |
| Insulation Resistance | 1000 M Min. | EIA-364-21 (500V DC) |
| Dielectric Withstanding Voltage | No breakdown after test. Withstand 1000V AC for 1 minute. | EIA-364-20 |
| Retention Force | 0.8 Kg/pin. Min. | EIA-364-29 (25.4 mm/minute) |
| Solderability | 95% minimum solder coverage. | EIA-364-52 (3-5 seconds, 260+0/-5) |
Reflow Soldering Profile
| Parameter | Specification |
|---|---|
| Ramp-up (25 ~150) | 3 /S Max |
| Pre-heating (150 ~200) | 60~120 sec |
| Time maintained above 217 | 60-150 sec |
| Peak Temperature | 260+0/-5 (10 sec) |
2504101957_OUPIIN-2011-1X04G00S-2-9-7B-HT-P5-08_C22116945.pdf
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