Electrical mechanical SOFNG SIM-001 product with contact resistance terminal strength and durability
Manufacturer:
SOFNG
Description:
Card Connector MICRO SIM Push-Pull Surface Mount
Category:
PC Card Sockets/PC Card Sockets
Specifications
Operating Temperature:
-10℃~+60℃
Card Connection Mode:
拔插式
Height Above Board:
17.4mm
Card Detection:
无插卡检测
Connector Type:
卡座
Card Type:
MicroSIM卡
Mfr. Part #:
SIM-001
Package:
SMD
Model Number:
SIM-001
Introduction
Product Overview
This product offers reliable electrical and mechanical performance across different grades (A, B, C). It is designed for applications requiring specific contact resistance, insulation resistance, and voltage withstand capabilities. The product features robust terminal and operational strength, with resistance to vibration and various soldering conditions. It is rated for specific electrical loads and operates within a defined temperature range, offering durability through mechanical and load life cycles. Environmental resistance to cold, heat, and humidity is also a key feature.
Product Attributes
- Product Grades: A, B, C
Technical Specifications
| Specification | A Class [Product] | B Class [Product] | C Class [Product] |
|---|---|---|---|
| Electrical Performance | |||
| Initial Contact Resistance | 100m max. | 100m max. | 100m max. |
| Insulation Resistance | 100m min. 100V DC | Skey/PD: 50m min. 100V DC | Skey/PD: 50m min. 100V DC |
| Withstand Voltage | 150V AC for 1min | 100 V AC for 1min | 100 V AC for 1min |
| Mechanical Performance | |||
| Terminal Strength | 3N for 1 min. | 2N for 1min. | 2N for 1min. |
| Operational Strength | |||
| Working Direction | 500gf.1.0N. | ||
| Pull Direction | 500gf.1.0N. | ||
| Vibration Resistance | 10N | 6N | 6N |
| Condition | Full amplitude 1.5mm X, Y, Z directions 2H | ||
| Soldering Heat Resistance | |||
| Manual Soldering | 35010 3+1S | 30010 3+1S | 30010 3+1S |
| Dip Soldering | 27010 10+3S | 2605 10+3S | 2605 10+3S |
| Reflow | 260 max 20S max | 255 max 10S max | 255 max 10S max |
| Max. Rating [Resistive Load] | |||
| Rating | 50V 2.0A | 30V 1.0A | 30V 1.0A |
| Usage Temperature Range | -10 to +60 | ||
| Durability | |||
| No Load Life | 8,000 Cycles | 6,500 Cycles | 5,000 Cycles |
| Load Life [Rated Load] | 6,500 Cycles | 5,000 Cycles | 3,500 Cycles |
| Contact Resistance (Load Life) | 50m max. | 30m max. | 30m max. |
| Environmental Performance | |||
| Cold Resistance | -402 for 96h | -202 for 96h | -202 for 96h |
| Heat Resistance | 855 for 96h | 755 for 96h | 755 for 96h |
| Humidity Resistance | 402, 90 to 95% RH for 96h | ||
Soldering Conditions (Applicable to Surface Mount Products)
- Manual Soldering
- Reflow Soldering
Details for Reflow Soldering:
- Heating Method: Top and bottom far-infrared heating.
- Temperature Measurement: Measured at the solder connection (solder/copper foil surface) using 0.1~0.2 CA (K) or CC (T).
- Fixing Method: Use of heat-resistant tape.
- Temperature Distribution: (Refer to Figure 2.15)
1810121713_SOFNG-SIM-001_C183628.pdf
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