Push-Pull Operation Memory Card Socket with Surface Mount (SMT) and Precision Design for SD Cards
Manufacturer:
SOFNG
Description:
Micro SD card (TF card) Connector and Ejector Push-Pull Surface Mount
Category:
PC Card Sockets/PC Card Sockets
Specifications
Operating Temperature:
-
Card Connection Mode:
拔插式
Height Above Board:
3.05mm
Card Detection:
有
Connector Type:
卡座
Card Type:
MicroSD卡(TF卡)
Mfr. Part #:
SD-002U
Package:
SMD
Highlight:
Push-Pull Operation Memory Card Socket
,Surface Mount SD Card Socket
,Precision Design MicroSD Socket
Model Number:
SD-002U
Introduction
Push Pull LTEM Memory Card Socket SOFNG SD 002U
Surface Mount SMT Lateral Insertion Precision Design
Product Overview
This Push-Pull LTEM Memory Card Socket is specifically engineered for SD CARD applications. Featuring a compact design suitable for surface mounting (SMT) and lateral insertion, the socket is constructed with durable materials for reliable performance across various project requirements. RoHS compliant for environmental safety standards.
Product Attributes
- Operation: Push-Pull
- Type: LTEM TEM
- RoHS Compliant: Yes
- Certifications: Pb
- Mounting Type: Surface Mount (SMT), Lateral Insertion
- Design: Precision Components, Stabilized, Environmentally Friendly
Technical Specifications
| Technical Parameter | LEVEL PROJECT A | LEVEL PROJECT B | LEVEL PROJECT C |
|---|---|---|---|
| Initial Contact Resistance | 30mΩ max. | 30mΩ max. | No data |
| Contact Resistance (100V DC) | 100MΩ min. | 50MΩ min. | No data |
| Withstand Voltage | 300V AC for 1min | 250V AC for 1min | No data |
| Durable Performance (No Load) | 8,000 Cycles | 7,000 Cycles | No data |
| Durable Performance (Rated Load) | 6,500 Cycles | 5,000 Cycles | No data |
| Insertion Force | 4.0Kgf MAX | ||
| Operating Force (Inward) | 6.0-9.0N (1N = 100 gram-force) | ||
| Operating Force (Exiting) | 5.0-8.0N (1N = 100 gram-force) | ||
| Solder-ability (IR Reflow) | 255°C, 5sec. (Max.) | ||
| Solder-ability (Manual) | 350°C, 3sec. (Max.) | ||
| Model Number | SD-002U | SD-002U | |
SD CARD Pin Assignment
| Pin No. | Pin NAME | Type | Description |
|---|---|---|---|
| 1 | CD/DAT3 | I/O/PP | Card Detect/Data Line [Bit 3] |
| 2 | CMD | PP | Command/Response |
| 3 | Vss1 | S | Supply voltage ground |
| 4 | VDD | S | Supply voltage |
| 5 | CLK | I | Clock |
| 6 | Vss2 | S | Supply voltage ground |
| 7 | DAT 0 | I/O/PP | Data Line [Bit 0] |
| 8 | DAT 1 | I/O/PP | Data Line [Bit 1] |
| 9 | DAT 2 | I/O/PP | Data Line [Bit 2] |
Product Material & Plating
| Component | Material | Plating |
|---|---|---|
| A (Contact Terminal) | H62 Brass (t=0.15mm) | 30μ" Tin Base / 1μ" Gold |
| B (Base) | LCP 30% Glass Fiber (Black) | |
| C (Housing) | C5191 Phosphor Copper | 1μ" Gold / Solder Area Fog Tin |
Dimensional Tolerances
| Decimal | Tolerance |
|---|---|
| .X | ±0.20 |
| .XX | ±0.10 |
| .XXX | ±0.05 |
| Angle | Tolerance |
|---|---|
| X. | ±1.5° |
| X.X | ±1.0° |
| .XXX | ±0.5° |
Handling and Storage Precautions
Products are not classified as hazardous waste and can be entrusted to recyclers for processing. During transportation, avoid direct contact with water, acidic or alkaline chemicals, and environments containing such gases. Prevent slipping, tipping, collision, or extrusion. Maintain moderate temperature and humidity conditions (normal temperature 25°C, humidity within 50%) to prevent material deformation or oxidation.
Documentation
Product Datasheet (PDF)
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