Z-PACK HM Interconnection System with Phosphor Bronze Contacts and Gold Plated Interface for Board-to-Board Connections Compliant with IEC Standards
Manufacturer:
TE Connectivity
Description:
Hard Metric, Standard RoHS
Category:
ARINC/Hard Metric, Standard
Specifications
Mfr. Part #:
2392865-1
Highlight:
Phosphor Bronze Contacts Interconnection System
,Gold Plated Interface Board-to-Board Connector
,Compliant with IEC Standards Z-PACK HM System
Model Number:
2392865-1
Introduction
Z-PACK 2 mm HM Interconnection System
Robust board-to-board connection solution designed for reliable interconnection between free boards (daughterboards, PCBs) and fixed boards (motherboards, backplanes). Facilitates signal and ground connections with flexibility through various module types and configurations.
Product Attributes
- Brand: Z-PACK
- System Type: HM Interconnection System
- Application: Board-to-Board Connections
- Certifications: Complies with IEC917, IEC 61076-4-101, DIN 41626, DIN 43356, IEEE 1301
- Housing Material: UL94V-O rated, glass-filled polyesters
- Signal Contacts: Phosphor bronze (male), Copper alloy (female), gold plated at interface, nickel underplate, tin or tin-lead plated press-fit leads
- Ground Contacts: Phosphor bronze, gold plated at interface, nickel underplate, tin or tin-lead plated press-fit leads
Module Specifications
| Module Type | Signal Contacts | Length (mm) | Features |
|---|---|---|---|
| Type A | 110 | 50 | MPC, guiding, and polarization |
| Type B | 125 | 50 / 44 / 38 | Requires pairing with modules with alignment features |
| Type C | 55 | 25 | Guiding and polarization (Extension module) |
| Type A/B | 125 / 110 / 95 | 50 / 44 / 38 | Guide and polarization |
Technical Specifications
| PC Board Thickness (Fixed) | 1.4 - 5.6 mm |
| PC Board Thickness (Free) | 1.4 - 4.2 mm |
| PC Board Material Compatibility | Glass-epoxy (NEMA G10, G11, FR 4, FR 5) corresponding to DIN 7735 Hgw-Types or DIN 40802 EP-Types |
| Default Dimension Tolerance | ±0.13 mm |
| Default Angle Tolerance | ±2° |
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