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Double Row Connector chxunda XD-43030-T 3 Millimeter Pitch Suitable for SMT and DIP Electrical Assemblies

Manufacturer:
chxunda
Description:
Rectangular Connector Contacts RoHS
Category:
Free Hanging, Panel Mount/Rectangular Connector Contacts
Specifications
Rated Voltage (Max):
250V
Contact Plating:
Contact Material:
磷青铜
Mfr. Part #:
XD-43030-T
Model Number:
XD-43030-T
Introduction

Product Overview

The 3.00mm Pitch 43045/43025 Series Double Row Connector is designed for reliable electrical connections in various applications. This series offers a pitch of 3.00 mm and is available in SMT and DIP configurations. It is engineered to meet stringent performance, testing, and inspection requirements, ensuring interchangeability with components of the same specification. The connectors are suitable for use in a wide ambient temperature range and are designed to accommodate specific wire gauges and PCB thicknesses.

Product Attributes

  • Brand: Shenzhen XunDa Technology Co., Ltd.
  • Series: 43045/43025 (3.00mm Pitch)
  • Type: Double Row, WTB SMT / DIP Connector
  • Certifications: RoHS
  • Housing Material: Nylon66 UL94V-0 (Color: Black)
  • Contact Material: Brass with Tin plating (0.45mm or 0.64mm thickness) or Phosphor bronze (0.2mm thickness)
  • Wafer Material: LCP UL94V-0 (Color: Black)

Technical Specifications

Category Specification Details
General Pitch 3.00 mm
Applicable Standards GB/T2421, GB/T2423, GB/T2424, GB/T5095
Applicable Wire Sizes AWG #20#28
Operating Conditions Ambient Temperature Range -25 to +85
Applicable PC Board Thickness 1.6mm
Electrical Performance Rated Voltage 250V AC, DC
Rated Current 5A AC, DC
Contact Resistance 20m (Initial)
Insulation Resistance 1000 M
Mechanical Performance Terminal Crimping Wire Pullout Force 30N (AWG#20), 20N (AWG#22), 13N (AWG#24)
Single Contact Withdrawal Force 2N
Durability 30 cycles (10 cycles/min)
Environmental Performance Thermal Aging 96 hours at 852
Humidity Test 96 hours at 402, 90-95% RH
Salt Spray Test 353, 51% solution (Stamping after tin plated for 8 hours / Stamping before tin plated for 48 hours)
Soldering Performance Solder Ability 2455 for 30.5S (90% solder area)
Resistance to Soldering Heat (DIP) 3505 for 30.5S
Resistance to Soldering Heat (SMT Reflow) 2555 for 20S Max.
Packaging & Storage Transportation Temperature -20 to +50
Storage Temperature -20 to +40 (Relative Humidity 80%)
Storage Duration 6 months (Re-qualification test required after 6 months)

Product Models

Part Number Base Type Description Circuit Options
XD-43045-2xN A (Straight Pin) Double Row Wafer 1 to 12 Circuits
XD-43045-2xN AW (Right Angle Pin) Double Row Wafer 1 to 12 Circuits
XD-43045-2xN ALT (Vertical Mount) Double Row Wafer 1 to 12 Circuits
XD-43045-2xN AWT (Horizontal Mount) Double Row Wafer 1 to 12 Circuits
XD-43025-2xNY Y (Female Housing) Double Row Housing 2 to 12 Circuits
XD-43020-2xNEY EY (Male Housing) Double Row Housing 2 to 12 Circuits
XD-43030-T Terminal Contact Terminal N/A
XD-43031-PT Terminal Plug Terminal N/A

2410121632_chxunda-XD-43030-T_C19193410.pdf

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