Solderless crimpless Z axis compression interconnect CINCH 3180299351 supporting speeds over 50 Gbps
Manufacturer:
CINCH
Description:
Rectangular Connector Accessories
Category:
Headers, Male Pins/Rectangular Connector Accessories
Specifications
Mfr. Part #:
3180299351
Model Number:
3180299351
Introduction
Product Overview
CIN::APSE is a high-density, solderless Z-axis compression interconnect technology designed for board-to-board, IC-to-board, flex-to-board, and component-to-board applications. This crimpless and solderless interconnect supports speeds exceeding 50 Gbps with a wide range of profiles from 0.020 (0.5mm) to 1.0 (25mm). Featuring a unique, patent-protected 2-piece design, CIN::APSE contacts are available in 0.020 (0.5mm) and 0.039 (1.0mm) diameters with standard pitches of 0.039 (1.0mm) or greater. The technology achieves solderless termination through compression, ensuring multiple points of contact per I/O for proven reliability under extreme mechanical shock and vibration. Its applications span industries including satellite & space, military & aerospace, radar & surveillance, telecommunications, transportation, and high-end computing.
Product Attributes
- Brand: CIN::APSE
- Manufacturer: Bel / Cinch Connectivity Solutions
- Technology: Solderless Compression Interconnect
- Certifications: RoHS and REACH compliant
- Contact Material: Molybdenum with 20 - 30in. gold plating
- Insulator Housing Material: Liquid Crystal Polymer / Polyetherimide / Composites / Ceramics
- Packaging Material: Anti-static ABS (example)
Technical Specifications
| Specification | Details |
|---|---|
| Contact Diameter | 0.020 (0.5mm) and 0.039 (1.0mm) |
| Standard Pitch | 0.039 (1.0mm) or greater |
| Signal Speed | 50+ Gbps |
| Profile Range | 0.020 (0.5mm) to 1.0 (25mm) |
| Maximum I/O Count (Implemented) | 7,396 I/Os |
| Typical Compression Force | 2 ounces (approx. 0.55 N) for <15 m contact resistance |
| Contact Resistance | <15 m (at 20mV open circuit @ 100mA) |
| Current-Carrying Capacity | 6.5 Amp (on 0.5mm contact, with 30C temperature rise) |
| Inductance | <0.75 nH (Up to 3.05 GHz) |
| Insulation Resistance | > 50,000 M (at 100 VDC) |
| Dielectric Withstanding Voltage | 250 VDC (No breakdown) |
| Vibration Resistance | 5.4 Gs; 10 - 500Hz; no discontinuity > 2 nanoseconds |
| Shock Resistance | 50 Gs; 11 milliseconds; no discontinuity > 2 nanoseconds |
| Temperature Life | 1,000 hours @ 105C (<5% resistance change) |
| Thermal Shock | 100 cycles -30C to +100C (<5% resistance change) |
| Humidity | 1,000 hours @ 25C to 65C, 85% RH (<20% resistance change) |
| Outgassing (ASTM E595) | 1.0% Total Mass Loss (TML), 0.1% CVCM |
| Operating Temperature (Stacking Connectors) | -55 to 125C |
| Durability (Stacking Connectors) | > 100 mating cycles |
| Stacking Connector Heights | 0.125 (3.18mm), 0.250 (6.35mm), 0.277 (7.04mm) |
| Stacking Connector Positions | 25, 51, 83, 166, 249 |
| Stacking Connector Rows | 2, 5 |
| Stacking Connector Housing Material | UL94V-O rated liquid crystal polymer |
| Stacking Connector Plunger Material | Gold-plated copper alloy |
| Stacking Jumper Thickness | 0.008 (0.203mm) |
| Stacking Jumper Width (25 Pos) | 1.10 (27.94mm) |
| Stacking Jumper Width (51 Pos) | 1.75 (44.45mm) |
| Stacking Jumper Length | 3.0 (76.2mm) |
2311152132_CINCH-3180299351_C17552475.pdf
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