solderless compression connector CINCH 3180299356 designed for military aerospace radar and telecommunications industries
Manufacturer:
CINCH
Description:
Rectangular Connector Accessories
Category:
Headers, Male Pins/Rectangular Connector Accessories
Specifications
Mfr. Part #:
3180299356
Model Number:
3180299356
Introduction
CIN::APSE Solderless Compression Connector Technology
Product Overview
CIN::APSE is a leading solderless, high-density, custom interconnect technology designed for board-to-board, IC-to-board, flex-to-board, and component-to-board applications. This crimpless interconnect enables high-speed data transmission of 50+ Gbps with a wide range of profiles from 0.020" (0.5mm) to 1.0" (25mm). Utilizing a unique 2-piece, patent-protected design, CIN::APSE contacts are available in 0.020" (0.5mm) and 0.039" (1.0mm) diameters with standard pitches of 0.039" (1.0mm) or greater. The technology achieves solderless termination through compression, ensuring multiple points of contact per I/O for proven reliability under extreme mechanical shock and vibration. Its applications span satellite & space, military & aerospace, radar & surveillance, telecommunications, transportation, and computer industries, offering advantages such as easy repairs, no risk of component damage, and excellent signal integrity.
Product Attributes
- Brand: Bel / Cinch Connectivity Solutions
- Technology: CIN::APSE Solderless Compression Interconnect
- Contact Material: Molybdenum with 20 - 30in. gold plating
- Insulator Housing Material: Liquid Crystal Polymer / Polyetherimide / Composites / Ceramics
- Packaging Material: Anti-static ABS (example)
- Certifications: RoHS and REACH compliant
- Termination: Solderless Compression
Technical Specifications
| Specification | Details |
|---|---|
| Contact Diameter | 0.020" (0.5mm) and 0.039" (1.0mm) |
| Standard Pitch | 0.039" (1.0mm) or greater |
| Signal Speed | 50+ Gbps |
| Profile Range | 0.020" (0.5mm) to 1.0" (25mm) |
| Max I/O Count (Implemented) | 7,396 I/Os |
| Contact Resistance | < 15 m (at ~2 oz / 0.55 N compression) |
| Current-Carrying Capacity ( 0.5mm contact) | 6.5 Amp (maximum 30C temperature rise) |
| Inductance | < 0.75 nH (Up to 3.05 GHz) |
| Insulation Resistance (@ 100 VDC) | > 50,000 M |
| Dielectric Withstanding | 250 VDC (No breakdown) |
| Vibration Resistance | 5.4 Gs; 10 - 500Hz; no discontinuity > 2 ns |
| Shock Resistance | 50 Gs; 11 milliseconds; no discontinuity > 2 ns |
| Temperature Range (Operating) | -55C to 125C |
| Temperature Life | 1,000 hours @ 105C (<5% resistance change) |
| Thermal Shock | 100 cycles -30C to +100C (<5% resistance change) |
| Humidity | 1,000 hours @ 25C to 65C, 85% RH (<20% resistance change) |
| Outgassing (ASTM E595) | 1.0% Total Mass Loss (TML), 0.1% CVCM |
| Durability (Stacking Connectors) | > 100 mating cycles |
| Housing Material (Stacking Connectors) | UL94V-O rated liquid crystal polymer |
| Plunger Material (Stacking Connectors) | Gold-plated copper alloy |
| Stacking Connector Heights | 0.125" (3.18mm) to 0.250" (6.35mm) standard; up to 1.5" (38mm) custom |
| Stacking Connector Pitch | 1.27mm |
| Extended Compliant Contact (ECC) Wire Range | 24 to 30 AWG Stranded Wire (Crimp) |
| Extended Compliant Contact (ECC) Solder Cup Wire Range | 26 to 30 AWG |
2311160733_CINCH-3180299356_C17625043.pdf
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