solderless interconnect CINCH 3180299353 proven under extreme mechanical shock and vibration conditions
Product Overview
CIN::APSE is a solderless, high-density, custom interconnect technology designed for board-to-board, IC-to-board, flex-to-board, and component-to-board applications. It is the industry's most widely implemented crimpless and solderless interconnect for high-speed applications, capable of supporting signals well above 50 Gbps. The unique 2-piece, patent-protected design utilizes randomly wound gold-plated molybdenum wire contacts that achieve termination through compression, ensuring multiple points of contact per I/O. CIN::APSE offers a wide range of profiles from 0.020 (0.5mm) to 1.0 (25mm) and is available in contact diameters of 0.020 (0.5mm) and 0.039 (1.0mm) with standard pitches of 0.039 (1.0mm) or greater. The technology is proven reliable under extreme mechanical shock and vibration, features quick, solderless installation, and provides low contact resistance with minimal Z-axis compression force. Key applications span satellite & space, military & aerospace, radar & surveillance, telecommunications, transportation, and computer industries.
Product Attributes
- Brand: CIN::APSE
- Technology: Solderless Compression Interconnect
- Contact Material: Molybdenum with 20 - 30in. gold plating
- Insulator Housing Materials: Liquid Crystal Polymer / Polyetherimide / Composites / Ceramics
- Packaging Material: Anti-static ABS (example)
- Certifications: RoHS and REACH compliant
- Installation: Solderless
- Design: 2-piece, patent protected
Technical Specifications
| Specification | Details |
|---|---|
| Contact Diameter | 0.020 (0.5mm) and 0.039 (1.0mm) |
| Standard Pitch | 0.039 (1.0mm) or greater |
| Signal Speed Capability | 50+ Gbps |
| Profile Range | 0.020 (0.5mm) to 1.0 (25mm) |
| Maximum I/O Count (Implemented) | 7,396 I/Os |
| Contact Resistance | <15 m (at approx. 2 oz. / 0.55 N compression force) |
| Current-Carrying Capacity ( 0.5mm contact) | 6.5 Amp (maximum current, 30C temperature rise) |
| Inductance | <0.75 nH (Up to 3.05 GHz) |
| Insulation Resistance (@ 100 VDC) | > 50,000 M |
| Dielectric Withstanding Voltage | 250 VDC |
| Vibration Resistance | 5.4 Gs; 10 - 500Hz; no discontinuity greater than 2 nanoseconds |
| Shock Resistance | 50 Gs; 11 milliseconds; no discontinuity greater than 2 nanoseconds |
| Temperature Life | 1,000 hours @ 105C (<5% resistance change) |
| Thermal Shock | 100 cycles -30C to +100C (<5% resistance change) |
| Humidity | 1,000 hours @ 25C to 65C, 85% relative humidity (<20% resistance change) |
| Outgassing (ASTM E595) | 1.0% Total Mass Loss (TML), 0.1% CVCM |
| Mechanical Durability (Stacking Connectors) | > 100 mating cycles |
| Housing Material (Stacking Connectors) | UL94V-O rated liquid crystal polymer |
| Plunger Material (Stacking Connectors) | Gold-plated copper alloy |
| Operating Temperature (Stacking Connectors) | -55 to 125C |
| Stacking Connector Heights | 0.125 (3.18mm), 0.250 (6.35mm), 0.277 (7.04mm) |
| Stacking Connector Positions | 25, 51, 83, 166, 249 |
| Stacking Connector Rows | 2, 5 |
| Stacking Jumper Thickness | 0.008 (0.203mm) |
| Stacking Jumper Length | 3.0 (76.2mm) |
| Stacking Jumper Width (25 pos) | 1.10 (27.94mm) |
| Stacking Jumper Width (51 pos) | 1.75 (44.45mm) |
| ECC Wire Gauge Termination | 24 to 30 AWG Stranded Wire |
| ECC Solder Cup Termination | 26 to 30 AWG |
2311150423_CINCH-3180299353_C17425919.pdf
solderless compression interconnect CINCH 3180299352 designed for easy installation and maintenance
solderless compression connector CINCH 3180299356 designed for military aerospace radar and telecommunications industries
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Solderless crimpless Z axis compression interconnect CINCH 3180299351 supporting speeds over 50 Gbps
sealed connector enclosures featuring CINCH 5810000101 for industrial and commercial vehicle electronic modules
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solderless compression interconnect CINCH 3180299352 designed for easy installation and maintenance |
Rectangular Connector Accessories
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solderless compression connector CINCH 3180299356 designed for military aerospace radar and telecommunications industries |
Rectangular Connector Accessories
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sealed connector enclosures featuring CINCH 5810000011 for extreme temperature ranges and rugged commercial vehicle |
Rectangular Connector Accessories RoHS
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Solderless crimpless Z axis compression interconnect CINCH 3180299351 supporting speeds over 50 Gbps |
Rectangular Connector Accessories
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sealed connector enclosures featuring CINCH 5810000101 for industrial and commercial vehicle electronic modules |
Rectangular Connector Accessories RoHS
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