DDR4 SO DIMM Connector with 260 Pin 9.2mm Height Featuring FOXCONN ASAA821-EARB0-7H SMT Mounting
Manufacturer:
FOXCONN
Description:
260P SMD,P=0.5mm,Surface Mount,Right Angle Inline Module Sockets RoHS
Category:
Inline Module Sockets/Inline Module Sockets
Specifications
DDR Type:
SO-DIMM
DDR SDRAM Standard:
DDR4
Number Of Pins:
260P
Operating Temperature:
-55℃~+85℃
Mfr. Part #:
ASAA821-EARB0-7H
Package:
SMD,P=0.5mm,Surface Mount,Right Angle
Model Number:
ASAA821-EARB0-7H
Introduction
Product Overview
This DDR4 SO DIMM connector is designed for memory module applications, featuring a 260-pin configuration with a 9.2mm height. It supports SMT (Surface Mount Technology) and is built with a LCP housing that is UL94V-0 rated, halogen-free, and black in color. The connector offers various contact plating options, including Gold Flash, 5" Gold, 10" Gold, 15" Gold, and 30" Gold, with Gold Flash plating at the tail. It is rated for 0.5 Ampere per pin and 25V AC, with an insulation resistance of 100 Megaohms minimum and a dielectric withstanding voltage of 250V AC RMS. The connector is designed for 60 mating cycles and operates within a temperature range of -55C to +85C. Recommended process conditions include a peak temperature of 260C for 10-20 seconds.
Product Attributes
- Brand: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
- Product Type: DDR4 SO DIMM Connector
- Housing Material: LCP (UL94V-0)
- Housing Color: Black
- Certifications: Halogen Free & Lead Free
- Mounting Type: SMT (Surface Mount Technology)
- Contact Plating Options: Gold Flash, 5" Gold, 10" Gold, 15" Gold, 30" Gold
- Packaging Options: Soft Tray, Tape Reel
Technical Specifications
| Specification | Details |
|---|---|
| Number of Positions | 260 POS. |
| Height | 9.2mm |
| Contact Current Rating | 0.5 Ampere MAX. per pin |
| Voltage Rating | 25V AC |
| Insulation Resistance | 100 Megaohms MIN. at 500V DC |
| Dielectric Withstanding Voltage | 250V AC RMS at 60Hz, for 1 minute |
| Initial Contact Resistance | 60 Milliohms MAX. per pin |
| Contact Resistance after Environmental Testing | 10 Milliohms MAX. per pin |
| Durability | 60 Mating Cycles |
| Operation Temperature | -55C to +85C |
| Recommended SMT Peak Temperature | 260C (10-20 seconds) |
| Contact Material | Phosphor Bronze |
| Contact Plating (Solder Pad Area) | 50" Nickel Under Plating, 100" Matte Tin Plating |
| Contact Plating (Contact Area) | Gold Flash or 5"/10"/15"/30" Gold Plating |
| Contact Plating (Tail) | Gold Flash Plating |
| Housing Material | LCP UL94V-0, Halogen Free, Black Color |
| Part Number (Example) | ASAA82*-EARB0-*H (where * indicates plating option) |
2410121840_FOXCONN-ASAA821-EARB0-7H_C225725.pdf
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