260 Pin DDR4 SO DIMM Connector Featuring FOXCONN ASAA821-H4SB5-7H with Metal Latch and Phosphor Bronze Contacts
Manufacturer:
FOXCONN
Description:
260P SMD,P=0.5mm,Surface Mount,Right Angle Inline Module Sockets RoHS
Category:
Inline Module Sockets/Inline Module Sockets
Specifications
DDR Type:
SO-DIMM
DDR SDRAM Standard:
DDR4
Number Of Pins:
260P
Operating Temperature:
-55℃~+85℃
Mfr. Part #:
ASAA821-H4SB5-7H
Package:
SMD,P=0.5mm,Surface Mount,Right Angle
Model Number:
ASAA821-H4SB5-7H
Introduction
Product Overview
This document details the FK2B00065D, a 260-pin DDR4 SO-DIMM connector designed for standard DDR4 memory modules. It features a single-row horizontal type with 2x solder pads and a metal latch for secure module insertion and retention. The connector is built for SMT (Surface Mount Technology) processes, with specific recommendations for peak temperature and process conditions. It is manufactured by Foxconn Interconnect Technology Limited and is available in a black color housing with various gold plating options for the contact area and tail.
Product Attributes
- Brand: FOXCONN
- Model Series: ASAA82*
- Product Code: FK2B00065D
- Connector Type: DDR SO DIMM Connector
- Housing Color: Black
- Certifications: Halogen Free & Lead Free (H)
- Plating Options: Gold Flash, 5u" Gold, 10u" Gold, 15u" Gold, 30u" Gold, Pd plating
- Material: LCP (Housing), Phosphor Bronze C5210 (Contact), Stainless Steel (Latch)
- RoHS Compliance: Halogen Free
Technical Specifications
| Specification | Details |
|---|---|
| Number of Positions | 260 Pin |
| Connector Type | DDR SODIMM |
| Type | Single Row Horizontal Type |
| Latch Type | Metal Latch (5) |
| Height | 4.0mm (4) |
| Contact Current Rating | 0.5 Ampere Max. per pin |
| Voltage Rating | 1.2V DC |
| Insulation Resistance | 100 Megaohms Min. at 500V DC |
| Dielectric Withstanding Voltage | 250V AC RMS at 60Hz, for 1 minute |
| Contact Resistance (Initial) | 60 Milliohms Max. per pin |
| Contact Resistance (After Testing) | 10 Milliohms Max. per pin |
| Durability | 25 Mating Cycles |
| Operation Temperature | -55C to +85C |
| SMT Process Peak Temperature | 260C |
| PCB Thickness Recommendation | 1.40mm |
| Stencil Thickness Recommendation | 0.15mm |
| Packing | Tape Reel (7), 340 PCS/Reel, 3 Reels/Box, 1020 PCS/Box |
| Part Number Suffixes | -H4SB5-7H |
2410121738_FOXCONN-ASAA821-H4SB5-7H_C2759888.pdf
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