Robust Electrical Connector FOXCONN AS0A821-H2SB-7H DDR4 SO DIMM 260 Pin 5.2mm Height Memory Module
Manufacturer:
FOXCONN
Description:
260P Inline Module Sockets RoHS
Category:
Inline Module Sockets/Inline Module Sockets
Specifications
DDR Type:
SO-DIMM
DDR SDRAM Standard:
DDR4
Number Of Pins:
260P
Operating Temperature:
-55℃~+85℃
Mfr. Part #:
AS0A821-H2SB-7H
Model Number:
AS0A821-H2SB-7H
Introduction
Product Overview
This DDR4 SO DIMM Connector is designed for memory module applications, offering a standard 5.2mm height and a 260-pin configuration. It is engineered for reliability and performance in computing systems, featuring robust electrical and mechanical characteristics suitable for demanding environments. The connector supports high-speed data transfer and is built to withstand a significant number of mating cycles, making it ideal for integration into various memory solutions.
Product Attributes
- Brand: FOXCONN INTERCONNECT TECHNOLOGY LIMITED.
- Product Series: DDR4 SO DIMM CONN.
- Part Number: AS0A82*-H2SB-7H
- Color: Black
- Material (Housing): Thermoplastic UL94V-0, Halogen Free
- Material (Contact): Copper Alloy
- Material (Metal Pad): Stainless Steel
- Material (Metal Spring): Stainless Steel
- Plating Options (Contact Area): Gold Flash, 5" Gold, 10" Gold, 15" Gold, 30" Gold
- Plating (Tail): Gold Flash
- Plating (Nickel Under): 50" (Contact), 10" (Metal Pad)
- Plating (Matte Tin): 100" (Over Solder Pad Area)
- Certifications: UL94V-0
- Compliance: Halogen Free
Technical Specifications
| Specification | Value |
|---|---|
| Number of Positions | 260 |
| Connector Type | DDR4 SO DIMM |
| Standard Height | 5.2 mm |
| Contact Current Rating | 0.5 Ampere MAX. per pin |
| Voltage Rating | 25V AC |
| Insulation Resistance | 100 Megaohms MIN. at 500V DC |
| Dielectric Withstanding Voltage | 250V AC RMS at 60Hz, for 1 minute |
| Contact Resistance (Initial) | 60 Milliohms MAX. per pin |
| Contact Resistance (After Environmental Testing) | 10 Milliohms MAX. per pin |
| Durability | 60 Mating Cycles |
| Operation Temperature | -55C to +85C |
| SMT Peak Temperature | 260C for 10~20 seconds |
| Overall Dimensions (Width) | 70.00 0.15 mm |
| Overall Dimensions (Length) | 72.1 mm |
| Overall Dimensions (Height) | 5.4 mm |
| PCB Layout Thickness (Recommended) | 1.40 mm |
| Carrier Tape Hole Pitch Cumulative Tolerance | 0.20mm |
| Cover Tape Peeling Strength | 0.01 kgf MIN. to 0.15 kgf MAX. at 300mm/min |
| Packing Capacity | 310 PCS/Reel, 3 Reels/Box (930 PCS/Box) |
2410121805_FOXCONN-AS0A821-H2SB-7H_C2832345.pdf
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