FOXCONN AS0A826 H2RB 7H horizontal single row 260 pin DDR4 SO DIMM connector with gold flash plating
Manufacturer:
FOXCONN
Description:
260P SMD,P=0.5mm,Surface Mount,Right Angle Inline Module Sockets RoHS
Category:
Inline Module Sockets/Inline Module Sockets
Specifications
DDR Type:
SO-DIMM
DDR SDRAM Standard:
DDR4
Number Of Pins:
260P
Operating Temperature:
-55℃~+85℃
Mfr. Part #:
AS0A826-H2RB-7H
Package:
SMD,P=0.5mm,Surface Mount,Right Angle
Model Number:
AS0A826-H2RB-7H
Introduction
Product Overview
This document details a 260-pin DDR4 SO-DIMM connector designed for memory module applications. It features a horizontal type, single-row configuration, and is available in various plating options for the contact area. The connector is built with a thermoplastic housing and stainless steel metal parts, ensuring durability and reliability for electronic systems.
Product Attributes
- Brand: FOXCONN
- Model Series: AS0A82*-H2RB-7H
- Housing Material: Thermoplastic UL94V-0, Halogen Free, Black Color
- Metal Spring Material: Stainless Steel
- Metal Pad Material: Stainless Steel
- Contact Material: Copper Alloy
- Plating Options: Gold Flash, 5u" Gold Plating, 10u" Gold Plating, 15u" Gold Plating, 30u" Gold Plating (at contact area); Gold Flash Plating (at tail)
- Underplating (Pad Area): 10u" Nickel
- Plating (Solder Pad Area): 100u" Matte Tin
- Underplating (Contact): 50u" Nickel
- Certifications: UL94V-0, Halogen Free & Lead Free
- Type: Horizontal
- Configuration: Single Row
- Height: 5.2mm
- Reverse Option: Available (R)
- Color: Black
Technical Specifications
| Specification | Value |
|---|---|
| Number of Positions | 260 |
| Contact Current Rating | 0.5 Ampere MAX. per pin |
| Voltage Rating | 25V AC |
| Insulation Resistance | 100 Megaohms MIN. at 500V DC |
| Dielectric Withstanding Voltage | 250V AC RMS at 60Hz, for 1 minute |
| Initial Contact Resistance | 60 Milliohms MAX. per pin |
| Contact Resistance after Environmental Testing | 10 Milliohms MAX. per pin |
| Durability | 60 mating cycles |
| Operation Temperature | -55C to +85C |
| Recommended SMT Peak Temperature | 260C |
| SMT Peak Time | 10~20 seconds |
| PCB Thickness Recommendation | 1.40mm |
| Overall Dimensions (Approximate L x W) | 72.1mm x 28.50mm (refer to drawing for detailed dimensions) |
| Pitch | 0.50mm |
2410121805_FOXCONN-AS0A826-H2RB-7H_C2761524.pdf
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