connection solution Ckmtw W-0800N06P-R000 pressure type bar connector with 0.8mm pitch and 50V rating
Manufacturer:
Ckmtw
Description:
1x6P Tin 0.8mm 50V 6 1 Surface Mount,Vertical -25℃~+85℃ SMD,P=0.8mm Headers, Male Pins RoHS
Category:
Free Hanging, Panel Mount/Headers, Male Pins
Specifications
Pins Structure:
1x6P
Contact Plating:
锡
Pitch:
0.8mm
Contact Material:
磷铜;LCP
Voltage Rating (Max):
50V
Number Of PINs Per Row:
6
Number Of Rows:
1
Z-Height Of The Board:
2.75mm
Mounting Type:
立贴
Operating Temperature:
-25℃~+85℃
Mfr. Part #:
W-0800N06P-R000
Package:
SMD,P=0.8mm
Model Number:
W-0800N06P-R000
Introduction
Product Overview
The SUH0.8 is a pressure-type bar connector with a 0.8mm pitch, designed for wire-to-board connections. It offers a rated voltage of 50V AC/DC and a rated current of 0.5A for AWG#30 and AWG#32 wires. The operating temperature range is -25 to +85. This connector is suitable for various applications requiring reliable wire-to-board termination.
Product Attributes
- Brand: SHENZHEN CANKEMENG INDUSTRIAL CO., LTD
- Product Name: Line-to-board connector / SUH0.8 / 0.8mm pitch / Vertical SMT
- Part Number: W-0800NXXP-R000
- Origin: Shenzhen, China
- Manufacturing Base: JIANGXI CANKEMENG ELECTRONICS CO., LTD
- Housing Material: LCP (Natural Color)
- Contact Material: Phosphor Copper
- Welding Slice Material: Phosphor Copper
- Surface Finish (Contact/Welding Slice): Nickel base, high tin
Technical Specifications
| Item | Specification | Requirement |
|---|---|---|
| Ratings and Applicable Wires | ||
| Rated Voltage (MAX) | 50V [AC(rms)/DC] | |
| Insulation O.D. | 0.5-0.6mm | |
| Rated Current (MAX) | AWG#30 | 0.5A |
| Rated Current (MAX) | AWG#32 | 0.5A |
| Ambient temperature Range | -25 +85 | |
| Performance - Electrical | ||
| Contact Resistance | Measure by dry circuit, 20mV MAX, 10mA | 20 milliohms MAX |
| Insulation Resistance | Apply 100V DC between adjacent terminals or ground | 100 Megohms MIN |
| Dielectric Strength | Apply 200V AC (rms) for 1 minute between adjacent terminals or ground | No Breakdown |
| Contact Resistance On Crimped Portion | Measure by dry circuit, 20mV MAX, 10mA | 5 milliohms MAX |
| Performance - Mechanical | ||
| Contact Retention Force (Min.) | Apply axial pull out force at a speed of 253mm/minute | 4-7N MIN |
| Terminal/Housing Retention Force | Apply axial pull out force at a speed of 253mm/minute | 4-7N MIN |
| Contact Insertion Force | Insert connectors with hand | 1-2N/PIN |
| Contact Withdrawal Force | Withdraw connectors with hand | 0.3N/PIN |
| Performance - Environmental and Others | ||
| Repeated Insertion and Withdrawal | Up to 20 cycles at a speed rate of < 10 cycles/minute | Contact Resistance: 60 m MAX |
| Temperature Rise | Carrying rated current load (UL 498) | 30 MAX |
| Vibration | DC 1mA, Amplitude: 5mm P-P, Sweep: 10-55-10Hz/min, Duration: 2 hours in each X,Y,Z axes | Appearance: No Damage, Contact Resistance: 60 m MAX, Discontinuity: 1 ms. MAX. |
| Shock | DC 1mA, 490m/s {50G}, 3 strokes in each X,Y,Z axes | Appearance: No Damage, Discontinuity: 1 ms. MAX. |
| Heat Resistance | 852, 96 hours, then return to room temp 1-2 hours | Appearance: No Damage, Contact Resistance: 60 m MAX |
| Cold Resistance | -402, 96 hours, then return to room temp 1-2 hours | Appearance: No Damage, Contact Resistance: 60 m MAX |
| Humidity | 402, 90-94% RH, 96 hours, then return to room temp 0.5 hours | Appearance: No Damage, Contact Resistance: 60 m MAX, Dielectric Strength: Must meet 4.1.3, Insulation Resistance: 20 M MIN |
| Temperature Cycling | 5 cycles of: -253 (30 min) -> 852 (30 min), with room temp transition | Appearance: No Damage, Contact Resistance: 60 m MAX |
| Salt Spray | 24 hours exposure to 51% salt solution at 352. Post-test rinse with water and dry at room temp. | Appearance: No Damage, Corrosion, Contact Resistance: 60 m MAX |
| SO2 Gas Resistance | 24 hours exposure to 505ppm SO2 gas at 402 | Contact Resistance: 60 m MAX |
| NH3 Gas Resistance | 40 minutes exposure to NH3 gas evaporating from 28% Ammonia solution | Appearance: No Damage, Contact Resistance: 60 m MAX |
| Solderability | Soldering Time: 20.5 sec, Soldering Temperature: 2355, 0.2 mm from terminal tip | Solder Wetting: Touch Apply Area More Than 95% |
| Resistance to Soldering Heat | Soldering Time: 50.5 sec, Soldering Temperature: 2555, 0.2 mm from terminal tip | Appearance: No Damage, Deformation |
| Conditions for Soldering (Pb-free) | ||
| Pre-heating Average temperature gradient | 2.5C/s | |
| Soak time (tsoak) | Time above 150C (T1) | 2-3 minutes |
| Time above 180C (T2) | 60s | |
| Time above 250C (T3) | 50s | |
| Peak temperature (Tpeak) | 2-5s | |
| Cooling Temperature gradient | 255C (0/+5C) | |
| Time above 230C | Max -5C/s | |
| Pre-Heat time | 2010sec | |
2508121550_Ckmtw-W-0800N06P-R000_C50314168.pdf
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