Surface Mount Wire to Board Connector SUH0.8 Series 0.8mm Pitch Rated Voltage 50V Ckmtw W 0800N02P R000
Manufacturer:
Ckmtw
Description:
1x2P Tin 0.8mm 50V 2 1 Surface Mount,Vertical -25℃~+85℃ SMD,P=0.8mm Headers, Male Pins RoHS
Category:
Free Hanging, Panel Mount/Headers, Male Pins
Specifications
Pins Structure:
1x2P
Contact Plating:
锡
Pitch:
0.8mm
Contact Material:
磷铜;LCP
Voltage Rating (Max):
50V
Number Of PINs Per Row:
2
Number Of Rows:
1
Z-Height Of The Board:
2.75mm
Mounting Type:
立贴
Operating Temperature:
-25℃~+85℃
Mfr. Part #:
W-0800N02P-R000
Package:
SMD,P=0.8mm
Model Number:
W-0800N02P-R000
Introduction
Product Overview
This specification covers the SUH0.8 series of pressure-type bar connectors with a 0.8mm pitch, designed for wire-to-board connections. These connectors are suitable for applications requiring a rated voltage of up to 50V AC/DC and a rated current of 0.5A, with an operating temperature range of -25 to +85. They are manufactured by Shenzhen Cankemeng Industrial Co., Ltd.
Product Attributes
- Brand: Cankemeng
- Origin: Shenzhen, China
- Product Name: Wire-to-Board Connector
- Series: SUH0.8
- Pitch: 0.8mm
- Mounting Type: Surface Mount ()
- Housing Material: LCP (Natural Color)
- Contact Material: Phosphor Bronze
- Welding Slice Material: Phosphor Bronze
- Plating: Nickel base, Tin plating
Technical Specifications
| Item | Specification/Requirement | Test Condition |
|---|---|---|
| Ratings and Applicable Wires | ||
| Rated Voltage (MAX) | 50V [AC(rms)/DC] | |
| Rated Current (MAX) | 0.5A (AWG#30, AWG#32) | |
| Insulation O.D. | 0.5-0.6mm | |
| Ambient Temperature Range | -25 +85 | |
| Performance - Electrical | ||
| Contact Resistance | 20 milliohms MAX | Dry circuit, 20mV MAX, 10mA |
| Insulation Resistance | 100 Megohms MIN | 100V DC between adjacent terminals or ground |
| Dielectric Strength | No Breakdown | 200V AC (rms) for 1 minute between adjacent terminals or ground |
| Contact Resistance On Crimped Portion | 5 milliohms MAX | Dry circuit, 20mV MAX, 10mA |
| Performance - Mechanical | ||
| Contact Retention Force (Min.) | 4-7N MIN | Axial pull out at 253mm/minute |
| Terminal/Housing Retention Force | 4-7N MIN | Axial pull out at 253mm/minute |
| Contact Insertion Force | 1-2N/PIN | Manual insertion |
| Contact Withdrawal Force | 0.3N/PIN | Manual withdrawal |
| Performance - Environmental and Others | ||
| Repeated Insertion and Withdrawal | Contact Resistance: 60 mMAX | 20 cycles at < 10 cycle/minute, no power |
| Temperature Rise | 30 MAX | Carrying rated current load (UL 498) |
| Vibration | Appearance: No Damage Contact Resistance: 60 mMAX Discontinuity: 1 ms.MAX. | DC 1mA, Amplitude: 5mm P-P, Sweep time: 10-55-10Hz/min, 2 hours in each X,Y,Z axes |
| Shock | Appearance: No Damage Discontinuity: 1 ms.MAX. | 490m/s{50G}, 3 strokes in each X,Y,Z axes, DC 1mA |
| Heat Resistance | Appearance: No Damage Contact Resistance: 60 mMAX | 852, 96 hours, then return to room temp 1-2 hours |
| Cold Resistance | Appearance: No Damage Contact Resistance: 60 mMAX | -402, 96 hours, then return to room temp 1-2 hours |
| Humidity | Appearance: No Damage Contact Resistance: 60 mMAX Dielectric Strength: Must meet 4.1.3 Insulation Resistance: 20 M MIN | 402, 90-94% RH, 96 hours, then return to room temp 0.5 hours |
| Temperature Cycling | Appearance: No Damage Contact Resistance: 60 mMAX | 5 cycles: -253 (30 min) -> 852 (30 min), with room temp transition |
| Salt Spray | Appearance: No Damage, Corrosion Contact Resistance: 60 mMAX | 352, 51% salt solution, 24 hours, followed by water wash and drying |
| SO2 Gas Resistance | Contact Resistance: 60 mMAX | 505ppm SO2 gas at 402, 24 hours |
| NH3 Gas Resistance | Appearance: No Damage Contact Resistance: 60 mMAX | 40 minutes exposure to NH3 gas from 28% Ammonia solution |
| Solderability | Solder Wetting: More Than 95% Apply Area | Immersion in 2355 tin bath for 20.5 sec, 0.2 mm from terminal tip |
| Resistance to Soldering Heat | Appearance: No Damage, Deformation | Immersion in 2555 tin bath for 50.5 sec, 0.2 mm from terminal tip |
| Conditions for Soldering (Pb-free) | ||
| Preheating Average Temperature Gradient | 2.5C/s | |
| Soak Time (tsoak) | 2-3 minutes | Time above 150C (T1) |
| Time above 150C (T1) | 60s | |
| Time above 180C (T2) | 50s | |
| Time above 250C (T3) | 2-5s | |
| Peak Temperature (Tpeak) | 255C (0/+5C) | |
| Cooling Temperature Gradient | Max -5C/s | |
| Time above 230C | 2010 sec | |
| Pre-Heat Time | 9030 sec | |
2508121550_Ckmtw-W-0800N02P-R000_C50314164.pdf
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