Durable Wire to Board Connector Ckmtw W-0800M05P-R000 Featuring 0.8mm Pitch Pressure Type Bar Design
Manufacturer:
Ckmtw
Description:
1x5P Tin 0.8mm 50V 5 1 Surface Mount, Right Angle -25℃~+85℃ SMD,P=0.8mm,Surface Mount,Right Angle Headers, Male Pins RoHS
Category:
Free Hanging, Panel Mount/Headers, Male Pins
Specifications
Pins Structure:
1x5P
Contact Plating:
锡
Pitch:
0.8mm
Contact Material:
磷铜;LCP
Voltage Rating (Max):
50V
Number Of PINs Per Row:
5
Number Of Rows:
1
X-Length Of Bottom Edge On Board (Spacing Line):
6.26mm
Mounting Type:
卧贴
Operating Temperature:
-25℃~+85℃
Mfr. Part #:
W-0800M05P-R000
Package:
SMD,P=0.8mm,Surface Mount,Right Angle
Model Number:
W-0800M05P-R000
Introduction
Product Overview
The SUH0.8 is a 0.8mm pitch pressure-type bar connector designed for wire-to-board connections. It offers a compact solution for applications requiring reliable electrical connectivity.
Product Attributes
- Brand: SHENZHEN CANKEMENG INDUSTRAIAL CO.LTD
- Origin: Shenzhen, China
- Manufacturing Base: JIANGXI CANKEMENG ELECTRONICS CO.LTD
- Materials: Housing: LCP (Natural Color); Contact: Phosphor Copper; Welding Slice: Phosphor Copper (Nickel Plated, High Tin)
Technical Specifications
| Item | Specification | Requirement |
| Ratings and Applicable Wires | ||
| Rated Voltage (MAX) | 50V [AC (rms)/DC] | |
| Insulation O.D. | 0.5-0.6mm | |
| Rated Current (MAX) | AWG#30: 0.5A; AWG#32: 0.5A | |
| Ambient Temperature Range | -25 +85 | |
| Performance | ||
| Contact Resistance | Measure by dry circuit, 20mV MAX, 10mA | 20 milliohms MAX |
| On Crimped Portion (measure by dry circuit, 20mV MAX, 10mA) | 5 milliohms MAX | |
| Insulation Resistance | Apply 100V DC between adjacent terminal or ground | 100 Megohms MIN |
| Dielectric Strength | Apply 200V AC (min) for 1 minute between adjacent terminal or ground | No Breakdown |
| Mechanical Performance | ||
| Contact Retention Force (Min.) | Apply axial pull out force at a speed of 253mm/minute | 4-7N MIN |
| Terminal/Housing Retention Force | Apply axial pull out force at a speed of 253mm/minute | 4-7N MIN |
| Contact Insertion and Withdrawal Force | Insert force | 1-2N/PIN |
| Pull output | 0.3N/PIN | |
| Environmental Performance and Others | ||
| Repeated Insertion and Withdrawal | Up to 20 cycles at a speed rate of less than 10 cycles/minute | Contact Resistance: 60 mMAX |
| Temperature Rise | Carrying rated current load (UL 498) | 30 MAX |
| Vibration | DC 1mA under energized state; Amplitude: 5mm P-P; Sweep time: 10-55-10Hz/min; Duration: 2 hours in each X, Y, Z axes | Appearance: No Damage |
| Contact Resistance: 60 mMAX | ||
| Discontinuity: 1 ms.MAX. | ||
| Shock | 490m/s{50G}, 3 strokes in each X, Y, Z axes | Appearance: No Damage |
| Discontinuity: 1 ms.MAX. | ||
| Heat Resistance | 852 in air for 96 hours; then return to room temperature for 1-2 hours | Appearance: No Damage |
| Contact Resistance: 60 mMAX | ||
| Cold Resistance | -402 in air for 96 hours; then return to room temperature for 1-2 hours | Appearance: No Damage |
| Contact Resistance: 60 mMAX | ||
| Humidity | 402, 90-94% RH for 96 hours; then return to room temperature for 0.5 hours | Appearance: No Damage |
| Contact Resistance: 60 mMAX; Dielectric Strength: Must meet 4.1.3; Insulation Resistance: 20 M MIN | ||
| Temperature Cycling | 5 cycles of: -253 for 30 minutes; 852 for 30 minutes | Appearance: No Damage |
| Contact Resistance: 60 mMAX | ||
| Salt Spray | 24 hours exposure to a salt spray from 51% solution at 352. Post-test wash with room temperature water and dry at room temperature. | Appearance: No Damage, Corrosion |
| Contact Resistance: 60 mMAX | ||
| SO2 Gas Resistance | 24 hours exposure to 505ppm SO2 gas at 402. | Contact Resistance: 60 mMAX |
| NH3 Gas Resistance | 40 minutes exposure to NH3 gas evaporating from 28% Ammonia solution. | Appearance: No Damage |
| Contact Resistance: 60 mMAX | ||
| Solderability | Soldering Time: 20.5 sec; Soldering Temperature: 2355; 0.2 mm from terminal tip | Solder Wetting: More Than 95% Apply Area |
| Resistance to Soldering Heat | Soldering Time: 50.5 sec; Soldering Temperature: 2555; 0.2 mm from terminal tip | Appearance: No Damage, Deformation |
| Conditions for soldering (Pb-free) | ||
| Pre-heating Average Temperature Gradient | 2.5C/s | |
| Soak Time (tsoak) | Time above 150C (T1) | 2-3 minutes (60s) |
| Time above 180C (T2) | 50s | |
| Time above 250C (T3) | 2-5s | |
| Peak Temperature (Tpeak) | 255C (-0/+5C) | |
| Cooling Temperature Gradient | Max -5C/s | |
| Time above 230C | 2010 sec | |
| Pre-Heat Time | 9030 sec | |
2508121550_Ckmtw-W-0800M05P-R000_C50314156.pdf
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