Secure 0.5mm Pitch Dual Contact Side Connector DIANWEI 8.01A0.015200 for Flexible Printed Circuits
Manufacturer:
DIANWEI
Description:
FFC/FPC Connector 15 Position 0.5mm Pitch Double-Sided Contacts, Top and Bottom Entry -40℃~+80℃
Category:
FFC, FPC (Flat Flexible) Connector Assemblies/FFC, FPC (Flat Flexible) Connector Assemblies
Specifications
Operating Temperature:
-40℃~+80℃
Number Of Contacts:
15P
Pitch:
0.5mm
Contact Type:
双侧触点/上下接
FFC, FCB Thickness:
0.3mm
Contact Plating:
金
Contact Material:
铜合金
Mfr. Part #:
8.01A0.015200
Package:
SMD,P=0.5mm,Surface Mount,Right Angle
Model Number:
8.01A0.015200
Introduction
Product Overview
The DIANWEI 0.5mm FFC/FPC Dual Contact Side Connector (H=2.0mm) is a high-reliability connector designed for applications requiring a secure and stable connection for flexible flat cables (FFC) and flexible printed circuits (FPC). Featuring a dual-contact design and a rear-locking mechanism, this connector ensures robust electrical performance and mechanical integrity. It is suitable for 0.3mm thick cables and supports a wide range of pin counts from 4 to 60.
Product Attributes
- Brand: DIANWEI
- Origin: DONGGUAN DIANWEI ELECTRONIC TECHNOLOGY CO.,LTD, China
- Certifications: IATF16949, ISO9001:2015, ISO14001, National High-tech Enterprise
- Housing Material: LCP Nature Color (UL 94V-0)
- Cover Material: LCP Black (UL 94V-0)
- Terminal Material: Copper Alloy
- Stator Material: Copper Alloy
Technical Specifications
| Specification | Details |
|---|---|
| Product Series | 8.01A |
| Connector Type | 0.5mm FFC/FPC Dual Contact Side Connector (H=2.0mm) |
| Pitch | 0.5mm |
| Height (H) | 2.0mm |
| Applicable Cable Thickness | 0.3mm |
| Pin Count | 4-60pin |
| Contact Type | Dual sides contact |
| Soldering Type | SMT |
| PCB Thickness Compatibility | T=0.30.02mm |
| Plating Specification | Contact area and solder area gold plating 1~3u" |
| Coplanarity | 0.10mm MAX |
| Operation Temperature | -40 ~ +85 (Without ice or dew) |
| Operation Humidity | 20-85RH |
| Storage Temperature | -10+50 (Without ice or dew) |
| Storage Humidity | 2085%RH |
| Rating Voltage | 50V (AC/DC) at 20 ambient temperature |
| Rating Current | 0.5A / PIN at 20 ambient temperature |
| Contact Resistance (Max) | 30m (mated) / 50m (after tests) |
| Insulation Resistance (Min) | 500M (at 250V DC for 1 minute) |
| Dielectric Strength | 250V AC for 1 minute (between adjacent terminals) |
| Retention Force of Single Pin (Min) | 0.2N / PIN |
| Retention Force of GND Pin (Min) | 0.3N / PIN |
| Retention Force of FFC/FPC (Min) | 0.3N Min/Pin (or PIN Count X 0.3N Min) |
| Shock Test (Acceleration) | 490m/s, 11ms, 3 times per direction (6 directions) |
| Vibration Test | 1.52mm Amplitude, 10~55~10Hz Frequency, 2 hours per axis (3 axes) |
| Durability (Lock/Dis-lock Cycles) | 20 times |
| Heat Resistance Test | 852 for 96H |
| Humidity Test | 403, 90~95% RH for 96H |
| High/Low Temperature Cycle Test | 5 cycles |
| Salt Spray Test (Gold Plating) | 5% salt water, 351, 48H |
| Solderability Test | Dip soldering at 2455 for 3sec. (90% wetting) |
| Resistance to Soldering Heat | Peak Temp: 2505, over 230 for 305Sec. |
| Recommended Soldering Profile | Pre-heating: 150180 (60~120s), Peak Temp: 2505, over 225 for 305Sec. (Lock cover must be open during IR reflow) |
2410121336_DIANWEI-8-01A0-015200_C19188796.pdf
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