Dual Contact Side Connector SMT Soldering 0.5mm Pitch for 0.3mm FFC FPC Cables DIANWEI 8.01A0.024200
Manufacturer:
DIANWEI
Description:
FFC/FPC Connector 24 Position 0.5mm Pitch Double-Sided Contacts, Top and Bottom Entry -40℃~+80℃
Category:
FFC, FPC (Flat Flexible) Connector Assemblies/FFC, FPC (Flat Flexible) Connector Assemblies
Specifications
Operating Temperature:
-40℃~+80℃
Number Of Contacts:
24P
Pitch:
0.5mm
Contact Type:
双侧触点/上下接
FFC, FCB Thickness:
0.3mm
Contact Plating:
金
Contact Material:
铜合金
Mfr. Part #:
8.01A0.024200
Package:
SMD,P=0.5mm,Surface Mount,Right Angle
Model Number:
8.01A0.024200
Introduction
Product Overview
0.5mm pitch dual contact side connector (H=2.0mm) for 0.3mm thick FFC/FPC cables (4-60 pins). This connector features a back-lock mechanism and is designed for SMT soldering. It offers dual-sided contact for reliable connections.
Product Attributes
- Brand: DIANWEI
- Origin: DONGGUAN DIANWEI ELECTRONIC TECHNOLOGY CO.,LTD
- Certifications: IATF16949, ISO9001:2015, ISO14001, National High-Tech Enterprise
Technical Specifications
| Specification | Details |
| Series | 8.01A, 0.5mm FFC/FPC DUAL CONTACT SIDE CONNECTOR(H=2.0mm) |
| Applicable FFC/FPC Thickness | 0.3mm 0.02mm |
| Housing Material | LCP Nature Color (UL 94V-0) |
| Cover Material | LCP Black (UL 94V-0) |
| Terminal Material | Copper Alloy |
| Stator Material | Copper Alloy |
| Contact Type | Dual sides contact |
| Soldering Type | SMT |
| Plating Specification | Contact area and solder area gold plating 1~3u |
| Coplanarity | 0.10mm MAX |
| Operation Temperature | -40 ~ +85 (without ice or dew) |
| Operation Humidity | 20-85RH |
| Storage Temperature | -10 ~ +50 (without ice or dew) |
| Storage Humidity | 20 ~ 85%RH |
| Rating Voltage | 50V (AC/DC) at 20 ambient |
| Rating Current | 0.5A / PIN at 20 ambient |
| Contact Resistance (Max) | 30m (mated) |
| Insulation Resistance (Min) | 500M (between adjacent terminals) |
| Dielectric Strength | 250V AC for 1 minute (between adjacent terminals) |
| Retention Force of Single Pin (Min) | 0.2N / PIN |
| Retention Force of GND Pin (Min) | 0.3N / PIN |
| Retention Force of FFC/FPC (Min) | 0.3N Min/Pin (or PIN Count X 0.3N Min) |
| Shock Resistance | 490m/s, 11ms, 3 times in 6 directions. Contact resistance 50m MAX after test. |
| Vibration Resistance | Amplitude: 1.52mm, Frequency: 10~55~10Hz for 2 hours in 3 axes. Contact resistance 50m MAX after test. |
| Durability (Lock/Dis-lock Cycles) | 20 times. Contact resistance 50m MAX after test. |
| Heat Resistance | 852 for 96H. Contact resistance 50m MAX after test. |
| Humidity Resistance | 403, 90~95% RH for 96H. Contact resistance 50m Max, Insulation Resistance 500 M Min after test. |
| High/Low Temperature Cycle | 5 cycles. Contact resistance 50 m Max after test. |
| Salt Spray (Gold Plating) | 5% salt water, 351 for 48H. No corrosion. |
| Solderability | Dip in 2455 tin for 3 sec. Wetting 90%. |
| Resistance to Soldering Heat | Preheat: 150~180 for 60~120s. Peak temp: 2505, over 230 for 305s. Contact resistance 50m Max after test. |
| Recommended Soldering Profile | Preheat: 150~180 for 60~120s. Peak temp: 2505, over 225 for 305s. Lock cover must be opened during IR reflow. |
2410121336_DIANWEI-8-01A0-024200_C19188801.pdf
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