0.5mm Pitch Dual Contact Side Connector for FFC FPC Cable Applications DIANWEI 8.01A0.054200 Series
Manufacturer:
DIANWEI
Description:
FFC/FPC Connector 54 Position 0.5mm Pitch Double-Sided Contacts, Top and Bottom Entry -40℃~+80℃
Category:
FFC, FPC (Flat Flexible) Connector Assemblies/FFC, FPC (Flat Flexible) Connector Assemblies
Specifications
Operating Temperature:
-40℃~+80℃
Number Of Contacts:
54P
Pitch:
0.5mm
Contact Type:
双侧触点/上下接
FFC, FCB Thickness:
0.3mm
Contact Plating:
金
Contact Material:
铜合金
Mfr. Part #:
8.01A0.054200
Package:
SMD,P=0.5mm,Surface Mount,Right Angle
Model Number:
8.01A0.054200
Introduction
0.5mm FFC/FPC Dual Contact Side Connector (H=2.0mm)
This product is a 0.5mm pitch dual contact side connector designed for FFC/FPC cables with a thickness of 0.3mm. It features a rear-locking mechanism and a height of 2.0mm, offering a reliable connection solution for various electronic applications. The connector is suitable for cable configurations ranging from 4 to 60 pins.
Product Attributes
- Brand: DIANWEI
- Origin: DONGGUAN DIANWEI ELECTRONIC TECHNOLOGY CO.,LTD, China
- Certifications: IATF16949, ISO9001:2015, ISO14001, National High-tech Enterprise
Technical Specifications
| Specification | Details |
|---|---|
| Product Series | 8.01A |
| Pitch | 0.5mm |
| Connector Type | Dual Contact Side Connector |
| Height (H) | 2.0mm |
| Applicable FFC/FPC Thickness | 0.3mm (0.02mm) |
| Applicable Pin Count | 4-60pin |
| Locking Mechanism | Rear Lock |
| Housing Material | LCP Nature Color (UL 94V-0) |
| Cover Material | LCP Black (UL 94V-0) |
| Terminal Material | Copper Alloy |
| Stator Material | Copper Alloy |
| Contact Type | Double sides contact |
| Soldering Type | SMT |
| Plating Specification | Contact area and solder area gold plating 1~3u" |
| Coplanarity | 0.10mm MAX |
| Operation Temperature | -40 ~ +85 |
| Operation Humidity | 20-85RH |
| Storage Temperature | -10 ~ +50 |
| Storage Humidity | 20 ~ 85%RH |
| Rating Voltage | 50V (AC/DC) at 20 ambient temperature |
| Rating Current | 0.5A / PIN at 20 ambient temperature |
| Contact Resistance | 30m Max |
| Insulation Resistance | 500M MIN |
| Dielectric Strength | 250V AC 1Minute between adjacent terminals (No Damage/Shorting) |
| Retention Force of Single Pin | 0.2N / PIN MIN |
| Retention Force of GND Pin | 0.3N / PIN MIN |
| Retention Force of FFC/FPC | 0.3N Min/Pin (PIN Count X 0.3N Min) |
| Shock Test | Acceleration 490m/s, 11ms, 3 times per 6 directions. Contact resistance 50m MAX after test. |
| Vibration Test | 1.52mm Amplitude, 10~55~10Hz Frequency for 2 hours per axis (X/Y/Z). Contact resistance 50m MAX after test. |
| Durability (Lock/Dis-lock) | 20 times. Contact resistance 50m MAX after test. |
| Heat Resistance Test | 852 for 96H. Contact resistance 50m MAX, Retention force above 0.3N/Pin after test. |
| Humidity Test | 403, 90~95% RH for 96H. Contact resistance 50m Max, Insulation Resistance 500 M Min after test. |
| High/Low Temperature Cycle Test | 5 cycles. Contact Resistance 50 m Max, Retention force above 0.3N/Pin after test. |
| Salt Spray Test (Gold Plating) | 5% salt water, 351 for 48H. No Corrosion after test. |
| Solderability | Dip soldering tail into Tin oven at 2455 for 3sec. Wetting over 90% of dipping area. |
| Resistance to Soldering Heat | Preheating: 150~180 (60~120s), Peak temp: 2505. Contact resistance 50m Max, Retention force above 0.3N/Pin after test. |
| Recommended Soldering Profile | Preheating: 150~180 (60~120s), Peak temp: 2505, over 225 last 305s. Lock cover shall be opened during IR reflow. |
2410121336_DIANWEI-8-01A0-054200_C19188814.pdf
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