Compact NGFF Memory Module Socket Horizontal Mounting SMT FOXCONN AS0BC21-S20BM-7H 05mm Pitch
Specifications
Number Of Pins:
67P
Connector Type:
母
Interface Form:
M.2-M Key
Operating Temperature:
-40℃~+80℃
Mounting Type:
卧贴
Mfr. Part #:
AS0BC21-S20BM-7H
Package:
SMD,P=0.5mm,Surface Mount,Right Angle
Model Number:
AS0BC21-S20BM-7H
Introduction
Product Overview
The AS0BC2*-S20B*-7H is a NGFF (Next Generation Form Factor) memory module socket designed for horizontal mounting on a PCB. It features a 0.5mm pitch and supports SMT (Surface Mount Technology) processes. Available with various keying options, this connector is suitable for memory module applications requiring reliable and compact connectivity.
Product Attributes
- Brand: HON HAI PRECISION IND. CO., LTD.
- Origin: TAIPEI, TAIWAN, R.O.C.
- Housing Material: THERMOPLASTIC 1 UL94V-0, HALOGEN FREE, BLACK COLOR
- Contact Material: COPPER ALLOY
- Board Lock Material: STAINLESS STEEL
- Certifications: HALOGEN/LEAD FREE
Technical Specifications
| Part Number Suffix | Key Name | Contact Plating (Contact Area) | Contact Plating (Tail Area) | Height | Color | Packing | Dimensions (DIM.A) | Dimensions (DIM.B) | Dimensions (DIM.C) | Dimensions (DIM.D) | Dimensions (DIM.E) | Dimensions (DIM.F) | Dimensions (DIM.G) | Length (mm) | Width (mm) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| AS0BC2*-S20B*-7H | A | 10u" GOLD PLATING OR GOLD FLASH | GOLD FLASH PLATING | 2.0mm | BLACK | TAPE&REEL | 6.625 | 1.5 | 14.50 | 1.0 | 14.5 | 1.375 | 1.125 | 14.5 | 22.0 |
| AS0BC2*-S20B*-7H | B | 10u" GOLD PLATING OR GOLD FLASH | GOLD FLASH PLATING | 2.0mm | BLACK | TAPE&REEL | 5.625 | 2.5 | 13.50 | 2.0 | 13.5 | 1.375 | 1.125 | 13.5 | 22.0 |
| AS0BC2*-S20B*-7H | C | 10u" GOLD PLATING OR GOLD FLASH | GOLD FLASH PLATING | 2.0mm | BLACK | TAPE&REEL | 4.625 | 3.5 | 12.50 | 3.0 | 12.5 | 1.375 | 1.125 | 12.5 | 22.0 |
| AS0BC2*-S20B*-7H | D | 10u" GOLD PLATING OR GOLD FLASH | GOLD FLASH PLATING | 2.0mm | BLACK | TAPE&REEL | 3.625 | 4.5 | 11.50 | 4.0 | 11.5 | 1.375 | 1.125 | 11.5 | 22.0 |
| AS0BC2*-S20B*-7H | E | 10u" GOLD PLATING OR GOLD FLASH | GOLD FLASH PLATING | 2.0mm | BLACK | TAPE&REEL | 2.625 | 5.5 | 10.50 | 5.0 | 10.5 | 1.375 | 1.125 | 10.5 | 22.0 |
| AS0BC2*-S20B*-7H | F | 10u" GOLD PLATING OR GOLD FLASH | GOLD FLASH PLATING | 2.0mm | BLACK | TAPE&REEL | 1.625 | 6.5 | 9.50 | 6.0 | 9.5 | 1.375 | 1.125 | 9.5 | 22.0 |
| AS0BC2*-S20B*-7H | G | 10u" GOLD PLATING OR GOLD FLASH | GOLD FLASH PLATING | 2.0mm | BLACK | TAPE&REEL | -1.125 | 9.0 | 7.0 | 9.0 | 6.5 | 1.125 | 1.375 | 9.0 | 30.0 |
| AS0BC2*-S20B*-7H | H | 10u" GOLD PLATING OR GOLD FLASH | GOLD FLASH PLATING | 2.0mm | BLACK | TAPE&REEL | -2.125 | 10.0 | 6.0 | 10.0 | 5.5 | 1.125 | 1.375 | 10.0 | 30.0 |
| AS0BC2*-S20B*-7H | J | 10u" GOLD PLATING OR GOLD FLASH | GOLD FLASH PLATING | 2.0mm | BLACK | TAPE&REEL | -3.125 | 11.0 | 5.0 | 11.0 | 4.5 | 1.125 | 1.375 | 11.0 | 30.0 |
| AS0BC2*-S20B*-7H | K | 10u" GOLD PLATING OR GOLD FLASH | GOLD FLASH PLATING | 2.0mm | BLACK | TAPE&REEL | -4.125 | 12.0 | 4.0 | 12.0 | 3.5 | 1.125 | 1.375 | 12.0 | 30.0 |
| AS0BC2*-S20B*-7H | L | 10u" GOLD PLATING OR GOLD FLASH | GOLD FLASH PLATING | 2.0mm | BLACK | TAPE&REEL | -5.125 | 13.0 | 3.0 | 13.0 | 2.5 | 1.125 | 1.375 | 13.0 | 30.0 |
| AS0BC2*-S20B*-7H | M | 10u" GOLD PLATING OR GOLD FLASH | GOLD FLASH PLATING | 2.0mm | BLACK | TAPE&REEL | -6.125 | 14.0 | 2.0 | 14.0 | 1.5 | 1.125 | 1.375 | 14.0 | 30.0 |
| Specification | Value |
|---|---|
| Contact Current Rating | 0.5 Ampere Max. Per Pin |
| Voltage Rating | 50V AC |
| Insulation Resistance | 500 Megaohms Min. At 500V DC |
| Dielectric Withstanding Voltage | 300V AC RMS At 60Hz, For 1 Minute |
| Contact Resistance (Initial) | 55 Milliohms Max. Per Pin |
| Contact Resistance (After Environment Testing) | 20 Milliohms Max. Per Pin |
| Durability | 60 Mating Cycles |
| Operation Temperature | -40 C To +80 C |
| SMT Process Peak Temperature | 260 C |
| SMT Process Dwell Time | 10~20s |
| Pitch | 0.5P |
| Number of Contacts | 67 |
| Board Locks | 2 |
2411201846_FOXCONN-AS0BC21-S20BM-7H_C2761342.pdf
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