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Compact NGFF Memory Module Socket Horizontal Mounting SMT FOXCONN AS0BC21-S20BM-7H 05mm Pitch

Manufacturer:
FOXCONN
Description:
67P Surface Mount, Right Angle SMD,P=0.5mm,Surface Mount,Right Angle Centronics Connectors RoHS
Category:
Centronics Connectors/Centronics Connectors
Specifications
Number Of Pins:
67P
Connector Type:
Interface Form:
M.2-M Key
Operating Temperature:
-40℃~+80℃
Mounting Type:
卧贴
Mfr. Part #:
AS0BC21-S20BM-7H
Package:
SMD,P=0.5mm,Surface Mount,Right Angle
Model Number:
AS0BC21-S20BM-7H
Introduction

Product Overview

The AS0BC2*-S20B*-7H is a NGFF (Next Generation Form Factor) memory module socket designed for horizontal mounting on a PCB. It features a 0.5mm pitch and supports SMT (Surface Mount Technology) processes. Available with various keying options, this connector is suitable for memory module applications requiring reliable and compact connectivity.

Product Attributes

  • Brand: HON HAI PRECISION IND. CO., LTD.
  • Origin: TAIPEI, TAIWAN, R.O.C.
  • Housing Material: THERMOPLASTIC 1 UL94V-0, HALOGEN FREE, BLACK COLOR
  • Contact Material: COPPER ALLOY
  • Board Lock Material: STAINLESS STEEL
  • Certifications: HALOGEN/LEAD FREE

Technical Specifications

Part Number SuffixKey NameContact Plating (Contact Area)Contact Plating (Tail Area)HeightColorPackingDimensions (DIM.A)Dimensions (DIM.B)Dimensions (DIM.C)Dimensions (DIM.D)Dimensions (DIM.E)Dimensions (DIM.F)Dimensions (DIM.G)Length (mm)Width (mm)
AS0BC2*-S20B*-7HA10u" GOLD PLATING OR GOLD FLASHGOLD FLASH PLATING2.0mmBLACKTAPE&REEL6.6251.514.501.014.51.3751.12514.522.0
AS0BC2*-S20B*-7HB10u" GOLD PLATING OR GOLD FLASHGOLD FLASH PLATING2.0mmBLACKTAPE&REEL5.6252.513.502.013.51.3751.12513.522.0
AS0BC2*-S20B*-7HC10u" GOLD PLATING OR GOLD FLASHGOLD FLASH PLATING2.0mmBLACKTAPE&REEL4.6253.512.503.012.51.3751.12512.522.0
AS0BC2*-S20B*-7HD10u" GOLD PLATING OR GOLD FLASHGOLD FLASH PLATING2.0mmBLACKTAPE&REEL3.6254.511.504.011.51.3751.12511.522.0
AS0BC2*-S20B*-7HE10u" GOLD PLATING OR GOLD FLASHGOLD FLASH PLATING2.0mmBLACKTAPE&REEL2.6255.510.505.010.51.3751.12510.522.0
AS0BC2*-S20B*-7HF10u" GOLD PLATING OR GOLD FLASHGOLD FLASH PLATING2.0mmBLACKTAPE&REEL1.6256.59.506.09.51.3751.1259.522.0
AS0BC2*-S20B*-7HG10u" GOLD PLATING OR GOLD FLASHGOLD FLASH PLATING2.0mmBLACKTAPE&REEL-1.1259.07.09.06.51.1251.3759.030.0
AS0BC2*-S20B*-7HH10u" GOLD PLATING OR GOLD FLASHGOLD FLASH PLATING2.0mmBLACKTAPE&REEL-2.12510.06.010.05.51.1251.37510.030.0
AS0BC2*-S20B*-7HJ10u" GOLD PLATING OR GOLD FLASHGOLD FLASH PLATING2.0mmBLACKTAPE&REEL-3.12511.05.011.04.51.1251.37511.030.0
AS0BC2*-S20B*-7HK10u" GOLD PLATING OR GOLD FLASHGOLD FLASH PLATING2.0mmBLACKTAPE&REEL-4.12512.04.012.03.51.1251.37512.030.0
AS0BC2*-S20B*-7HL10u" GOLD PLATING OR GOLD FLASHGOLD FLASH PLATING2.0mmBLACKTAPE&REEL-5.12513.03.013.02.51.1251.37513.030.0
AS0BC2*-S20B*-7HM10u" GOLD PLATING OR GOLD FLASHGOLD FLASH PLATING2.0mmBLACKTAPE&REEL-6.12514.02.014.01.51.1251.37514.030.0
SpecificationValue
Contact Current Rating0.5 Ampere Max. Per Pin
Voltage Rating50V AC
Insulation Resistance500 Megaohms Min. At 500V DC
Dielectric Withstanding Voltage300V AC RMS At 60Hz, For 1 Minute
Contact Resistance (Initial)55 Milliohms Max. Per Pin
Contact Resistance (After Environment Testing)20 Milliohms Max. Per Pin
Durability60 Mating Cycles
Operation Temperature-40 C To +80 C
SMT Process Peak Temperature260 C
SMT Process Dwell Time10~20s
Pitch0.5P
Number of Contacts67
Board Locks2

2411201846_FOXCONN-AS0BC21-S20BM-7H_C2761342.pdf

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