connection 75 pin M2 NGFF edge card connector FOXCONN 2E0BC27 S85BM 7H designed for long term operation
Manufacturer:
FOXCONN
Description:
75P Surface Mount, Right Angle SMD Centronics Connectors RoHS
Category:
Centronics Connectors/Centronics Connectors
Specifications
Number Of Pins:
75P
Interface Form:
M.2-M Key
Operating Temperature:
-40℃~+80℃
Mounting Type:
卧贴
Mfr. Part #:
2E0BC27-S85BM-7H
Package:
SMD
Model Number:
2E0BC27-S85BM-7H
Introduction
Product Overview
The M.2 (NGFF) Connector Series, specifically the 2E0BC2*-S85BM-*H model, is a high-performance edge card connector designed for modern computing applications. It features a 75-pin configuration and supports SMT (Surface Mount Technology) for efficient integration. This connector is engineered for reliability and durability, offering robust electrical and mechanical characteristics suitable for demanding environments. It is also Halogen Free & Lead Free, aligning with environmental standards.
Product Attributes
- Brand: FOXCONN
- Series: M.2 (NGFF) CONNECTOR SERIES EDGE CARD 2E 0 BC 2 * - S 85 M - * H
- Color: BLACK
- Certifications: HALOGEN FREE & LEAD FREE, UL94V-0 (Housing)
- Origin: CHINA (Implied by manufacturer)
Technical Specifications
| Part Number | Description | Key | Contact Area Plating | Height (mm) | Width (mm) | Contact Current Rating (Max. per Pin) | Dielectric Withstanding Voltage (AC RMS) | Contact Resistance (Max. per Pin Initial) | Insulation Resistance (Min. at 500V DC) | Durability (Mating Cycles) | Operation Temperature (C) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 2E0BC2*-S85BM-*H | 75PIN M.2(NGFF) CONNECTOR SERIES EDGE CARD | M | GOLD FLASH / 5u" GOLD PLATING / 10u" GOLD PLATING / 15u" GOLD PLATING / 30u" GOLD PLATING | 8.5 | 44 (Tape&Reel&OUTWARD) / 44 (Tape&Reel&INWARD) | 0.5 Ampere | 300V | 55 Milliohms | 500 Megaohms | 60 | -40 to +80 |
| Part Number | Module Type | Dim.Z Max(mm) | Housing Material | Metal Tab Material | Contact Material | Contact Plating (Tail Area) | Contact Plating (Under Plating) | Contact Plating (Contact Area) | Voltage Rating |
|---|---|---|---|---|---|---|---|---|---|
| 2E0BC2*-S85BM-*H | S1&D1: 8.85, S2&D2: 9.00, S3&D3&D4&D5: 9.15, S4: 9.40, S5: 9.65 | 2.40 | LCP (UL94V-0, Halogen Free, Black Color) | STAINLESS STEEL (SUS301) | PHOSPHOR BRONZE (C5210R-SH) | GOLD FLASH OR 5u" GOLD PLATING OR 10u" GOLD PLATING OR 15u" GOLD PLATING OR 30u" GOLD PLATING | 10u" NICKEL UNDER PLATING (for 10u" Gold Flash/5u"/10u"/15u"/30u" Gold Plating) / 50u" NICKEL UNDER PLATING (for Gold Flash) | 10u" NICKEL UNDER PLATING 100u"MATTE TIN PLATING OVER ALL CONTACT | 50V AC |
| Part Number | Recommended Process Condition (SMT Peak Temp) | Date Code Format | Tape & Reel Width (mm) | Carrier Tape Material | Cover Tape Material | Cover Tape Peeling Strength (kgf) | Hole Pitch Cumulative Tolerance (mm) |
|---|---|---|---|---|---|---|---|
| 2E0BC2*-S85BM-*H | 260C, 10~20s | YEAR MONTH (YYYYMMDD) | 32mm (Outward) / 44mm (Inward) | POLYESTER | POLYSTYRENE | 0.01 MIN & 0.13 MAX | 0.20 |
2501091644_FOXCONN-2E0BC27-S85BM-7H_C42432923.pdf
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