75 Position NGFF Socket AS Series SMT Horizontal Mount FOXCONN AS0BC26-S30BB-7H Memory Module Socket
Product Overview
This NGFF Socket AS Series is a vertically oriented, SMT-type memory module socket designed for horizontal mounting. It features a 0.50mm pitch and 75 positions, with available heights of 3.0mm and 4.0mm. This socket is suitable for various memory module applications.
Product Attributes
- Brand: Foxconn
- Socket Type: NGFF Socket AS Series
- Mounting Type: SMT Type, Horizontal
- Housing Material: Thermoplastic, UL 94V-0 rated
- Housing Color: Ivory
- Contact Material: Copper alloy
- Metal Spring Material: Copper alloy
- Certifications: UL 94V-0 rated
Technical Specifications
| Part Number Component | Description | Value |
| Socket Type | NGFF Socket | AS Series |
| Mounting Type | SMT | Horizontal |
| Pitch | 0.50mm | |
| Positions | 75 | |
| Height Options | 3.0mm, 4.0mm | |
| Mechanical - Contact Retention Force | min. | 0.10kg |
| Durability | Cycles | 60 |
| Electrical - Voltage Rating | V | 50V |
| Electrical - Current Rating | A | 0.5A |
| Electrical - Contact Resistance | max. | 55m |
| Electrical - Dielectric Withstanding Voltage | AC/1 min. | 300V |
| Electrical - Insulation Resistance | M | 500M |
| Operating Temperature | -40 to +80 |
Ordering Information
PART NO. : SMT STANDARD TYPE
KEY NAME: A S 0 BC 2 * S ** * 7 H B
Socket Type: NGFF SINGLE ROW HORIZONTAL TYPE MEMORY MODULE SOCKET
Height Options: 30=3.0mm HEIGHT, 40=4.0mm HEIGHT
Color: B=BLACK COLOR
Packaging: 7=TAPE&REEL
Lead Free: H=HALOGEN/LEAD FREE
Pitch: BC=0.5P
Contact Area Plating: 1=GOLD FLASH, 6=10u" GOLD PLATING, Y=5u" GOLD PLATING, 7=15u" GOLD PLATING, 3=30u" GOLD PLATING
Dimensions (DIM.P): 3030=28.25, 3042=40.25, 2230=28.25, 2242=40.25, 2260=58.25, 2280=78.25, 22110=108.25
2501161109_FOXCONN-AS0BC26-S30BB-7H_C42432926.pdf