Ckmtw 2008S-2 8P wire to board connector providing electrical connections for 2008 PHD 2.0mm spacing
Manufacturer:
Ckmtw
Description:
2x8P Tin 2mm 250V 8 2 -25℃~+85℃ Through Hole Through Hole,P=2mm Headers, Male Pins RoHS
Category:
Free Hanging, Panel Mount/Headers, Male Pins
Specifications
Y-Width Of Bottom Edge On Board:
5.2mm
Pins Structure:
2x8P
Contact Plating:
锡
Contact Material:
黄铜;PA66
Pitch:
2mm
Voltage Rating (Max):
250V
Number Of PINs Per Row:
8
Number Of Rows:
2
X-Length Of Bottom Edge On Board (Spacing Line):
18mm
Z-Height Of The Board:
6.6mm
Operating Temperature:
-25℃~+85℃
Mounting Type:
直插
Mfr. Part #:
2008S-2*8P
Package:
Through Hole,P=2mm
Model Number:
2008S-2*8P
Introduction
Product Overview
This specification covers the 2008 (PHD 2.0mm spacing) wire-to-board connector series. It is designed for applications requiring reliable electrical connections.
Product Attributes
- Brand: SHENZHEN CANKEMENG INDUSTRIAL CO., LTD
- Origin: China
- Color: Beige ()
Technical Specifications
| Product Name | Part Number | Rated Voltage (Max) | Rated Current (Max) | Applicable Wires | Applicable P.C.B. Hole Diameter | Ambient Temperature | Contact Resistance (Max) | Insulation Resistance (Min) | Dielectric Strength | Insertion Force and Withdrawal Force | Crimping Pull Out Force | Terminal Insertion Force (Max) | Terminal/Housing Retention Force (Min) | Pin Retention Force (Min) | Repeated Insertion/Withdrawal Contact Resistance (Max) | Salt Spray | Solderability | Resistance to Soldering Heat |
| Terminal | 2008-T | 250V DC/AC (rms) | 2.0A | #28-#22 | 0.8~1.6mm | -25-+85 | 0.02 | 1000 M | 800V AC for 1 minute (No breakdown/flashover) | Insertion force: 0.4 kgf/PIN (MAX) Retention force: 0.1 kgf/PIN (MIN) | #24: 2.3kg min #26: 1.4kg min #28: 0.9kg min | 1.0 kgf MAX | 0.8 kgf MIN | 1.0 kgf MIN | 40 m | Appearance: No Damage Contact Resistance: 40 m MAX | 95% above tinned area | No Damage |
| Housing | 2008H-XP | |||||||||||||||||
| Wafer Assembly (180) | 2008S-XP | |||||||||||||||||
| Wafer Assembly (90) | 2008R-XP | 250V DC/AC (rms) | 2.0A | #28-#22 | 0.8~1.6mm | -25-+85 | 0.02 | 1000 M | 800V AC for 1 minute (No breakdown/flashover) | Insertion force: 0.4 kgf/PIN (MAX) Retention force: 0.1 kgf/PIN (MIN) | #24: 2.3kg min #26: 1.4kg min #28: 0.9kg min | 1.0 kgf MAX | 0.8 kgf MIN | 1.0 kgf MIN | 40 m MAX | 12 hours exposure to salt spray (51% solution at 352) | Soldering time: 30.5 sec, solder temp: 2305 (95% above tinned area) | Soldering time: 51 sec, solder temp: 2605 (No Damage) |
2512011509_Ckmtw-2008S-2-8P_C524873.pdf
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