Home > Products > Free Hanging, Panel Mount >Headers, Male Pins > Ckmtw W 0800N10P R000 connector featuring 0.8mm pitch designed for wire to board electrical connections

Ckmtw W 0800N10P R000 connector featuring 0.8mm pitch designed for wire to board electrical connections

Manufacturer:
Ckmtw
Description:
1x10P Tin 0.8mm 50V 10 -25℃~+85℃ Surface Mount,Vertical SMD,P=0.8mm Headers, Male Pins RoHS
Category:
Free Hanging, Panel Mount/Headers, Male Pins
Specifications
Pins Structure:
1x10P
Contact Plating:
Pitch:
0.8mm
Contact Material:
磷铜;LCP
Voltage Rating (Max):
50V
Number Of PINs Per Row:
10
Operating Temperature:
-25℃~+85℃
Mounting Type:
立贴
Mfr. Part #:
W-0800N10P-R000
Package:
SMD,P=0.8mm
Model Number:
W-0800N10P-R000
Introduction

Product Overview

This specification applies to the SUH0.8 series of pressure-type bar connectors with a 0.8mm pitch. Designed for wire-to-board connections, these connectors offer reliable electrical performance and mechanical durability for various applications.

Product Attributes

  • Brand: SHENZHEN CANKEMENG INDUSTRIAL CO. LTD
  • Product Name: Wire-to-Board Connector / SUH0.8 / 0.8mm Pitch / Vertical Surface Mount
  • Part Number: W-0800NXXP-R000
  • Origin: Shenzhen, China
  • Manufacturing Base: JIANGXI CANKEMENG ELECTRONICS CO. LTD
  • Housing Material: LCP (Natural Color)
  • Contact Material: Phosphor Bronze
  • Welding Slice Material: Phosphor Bronze
  • Plating: Nickel Base, High Tin

Technical Specifications

ItemSpecificationRequirement
Ratings and Applicable Wires
Rated Voltage (MAX)50V [AC (rms) / DC]
Insulation O.D.0.5-0.6mm
Rated Current (MAX)AWG#30: 0.5A, AWG#32: 0.5A
Ambient Temperature Range-25 +85
Performance
Electrical Performance
Contact ResistanceMeasured by dry circuit, 20mV MAX, 10mA20 milliohms MAX
Insulation ResistanceApply 100V DC between adjacent terminals or ground100 Megohms MIN
Dielectric StrengthApply 200V AC (rms) for 1 minute between adjacent terminals or groundNo Breakdown
Contact Resistance On Crimped PortionMeasured by dry circuit, 20mV MAX, 10mA5 milliohms MAX
Mechanical Performance
Contact Retention Force (Min.)Apply axial pull out force at a speed of 253mm/minute4-7N MIN
Terminal / Housing Retention ForceApply axial pull out force at a speed of 253mm/minute4-7N MIN
Contact Insertion ForceInsert connectors with hand1-2N/PIN
Contact Withdrawal ForceWithdraw connectors with hand0.3N/PIN
Environmental and Other Performance
Repeated Insertion and Withdrawal20 cycles at a speed rate of less than 10 cycles/minute (no power)Contact Resistance: 60 m MAX
Temperature RiseCarrying rated current load (UL 498)30 MAX
VibrationDC 1mA, Amplitude: 5mm P-P, Sweep time: 10-55-10Hz/min, Duration: 2 hours in each X,Y,Z axesAppearance: No Damage, Contact Resistance: 60 m MAX, Discontinuity: 1 ms.MAX.
ShockDC 1mA, 490m/s {50G}, 3 strokes in each X,Y,Z axesAppearance: No Damage, Discontinuity: 1 ms.MAX.
Heat Resistance852 for 96 hours, then return to room temp for 1-2 hoursAppearance: No Damage, Contact Resistance: 60 m MAX
Cold Resistance-402 for 96 hours, then return to room temp for 1-2 hoursAppearance: No Damage, Contact Resistance: 60 m MAX
Humidity402, 90-94% RH for 96 hours, then return to room temp for 0.5 hoursAppearance: No Damage, Contact Resistance: 60 m MAX, Dielectric Strength: Must meet 4.1.3, Insulation Resistance: 20 M MIN
Temperature Cycling5 cycles of: -253 for 30 minutes, then 852 for 30 minutesAppearance: No Damage, Contact Resistance: 60 m MAX
Salt Spray24 hours exposure to salt spray (51% solution at 352), then wash with water and dryAppearance: No Damage, Corrosion, Contact Resistance: 60 m MAX
SO2 Gas Resistance24 hours exposure to 505ppm SO2 gas at 402Contact Resistance: 60 m MAX
NH3 Gas Resistance40 minutes exposure to NH3 gas from 28% Ammonia solutionAppearance: No Damage, Contact Resistance: 60 m MAX
SolderabilityImmersion in 2355 tin bath for 20.5 sec at 0.2 mm from terminal tipSolder Wetting: Apply Area More Than 95%
Resistance to Soldering HeatImmersion in 2555 tin bath for 50.5 sec at 0.2 mm from terminal tipAppearance: No Damage, Deformation
Conditions for Soldering (Pb-free)
Preheating Average Temperature Gradient2.5C/s
Soak Time (tsoak)Time above 150C (T1)2-3 minutes (60s)
Time above 180C (T2)50s
Time above 250C (T3)2-5s
Peak Temperature (Tpeak)255C (0/+5C)
Cooling Temperature GradientMax -5C/s
Time above 230C2010sec
Pre-Heat Time9030sec

2508121550_Ckmtw-W-0800N10P-R000_C50314172.pdf

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