Home > Products > Free Hanging, Panel Mount >Headers, Male Pins > Ckmtw W 1253M08P 0420 wafer connector strip ultra thin 1.25 series right angle gold plated for electrical

Ckmtw W 1253M08P 0420 wafer connector strip ultra thin 1.25 series right angle gold plated for electrical

Manufacturer:
Ckmtw
Description:
SMD,P=1.25mm,Surface Mount,Right Angle Headers, Male Pins RoHS
Category:
Free Hanging, Panel Mount/Headers, Male Pins
Specifications
Mfr. Part #:
W-1253M08P-0420
Package:
SMD,P=1.25mm,Surface Mount,Right Angle
Model Number:
W-1253M08P-0420
Introduction

Product Overview

This specification outlines the requirements for the 1.25 series ultra-thin wafer connector strip, designed for various electrical applications. It covers product performance, testing methods, and inspection criteria, ensuring reliable connectivity in specified environmental and operational conditions.

Product Attributes

  • Brand: SHENZHEN CANKEMENG INDUSTRIAL CO., LTD ()
  • Origin: China
  • Product Name: Wafer/1.25mm Pitch/Right Angle/Ultra-thin/Gold Plated
  • Customer Part No: W-1253MXXP-0420
  • Certifications: UL94V-0 (for PBT and Nylon6T housing)
  • RoHS Compliant: Yes

Technical Specifications

ItemDescriptionSpecification
ScopeApplicable Range1.25 series connector strip (product performance, test methods, inspection requirements)
Applicable StandardsEnvironmental TestingGB/T2421, GB/T2423, GB/T2424
Applicable StandardsComponent TestingGB/T5095
Use ConditionAmbient Temperature-25+85
Use ConditionApplicable Wire SizesAWG#28#32
Use ConditionApplicable PC Board Thickness0.6~1.2mm
AppearanceSurface ConditionNo defects, dirt, cracks, mechanical damage; contacts free from rust, plating oxidation, or peeling.
AppearanceDimensionsAccording to drawings
AppearanceInterchangeabilitySame specifications should be interchangeable.
MaterialTerminalPhosphor bronze, 0.15mm thick, Gold Plating: Fu~3"
MaterialHousingPBT, UL94V-0, Color: White
MaterialHousingNylon6T, UL94V-0, Color: Beige
MaterialContact (Pin)Phosphor bronze, 0.30mm thick, Gold Plating: Fu~3"
MaterialWaferSolder tab, Phosphor bronze, 0.20mm thick, Gold Plating: Fu~3"
Electrical PerformanceRated Current1A AC/DC
Electrical PerformanceRated Voltage125V AC/DC
Electrical PerformanceContact Resistance (Initial)20 m (Max voltage 20mV, Max current 100mA)
Electrical PerformanceWithstand Voltage500V AC (rms) for 1 min, leakage current < 0.5mA (No breakdown/flashover)
Electrical PerformanceInsulation Resistance100 M (500V DC for 1 min between adjacent contacts)
Mechanical PerformanceTerminal crimping wire strengthAWG#28: >13N, AWG#30: >8N, AWG#32: >6N (Pullout force at 253mm/min)
Mechanical PerformanceFixed terminals and hole seat>8N per contact (Pullout force at 253mm/min)
Mechanical PerformanceSingle contact insertion force3N (Mate connector at 253mm/min)
Mechanical PerformanceSingle contact withdrawal force0.3N (Mate connector at 253mm/min)
Mechanical PerformancePin Retention force10N per contact (Pullout force at 253mm/min)
Mechanical PerformanceDurability30 cycles (Max 10 cycles/min), Contact Resistance 30 m
Mechanical PerformanceVibrationFrequency: 10-55-10 Hz/min, Amplitude: 1.5mm p-p, 2 hours per axis (X, Y, Z). Appearance: No damage. Contact Resistance 30 m, Current Discontinuity: 1sec Max.
Environmental PerformanceThermal Aging852 for 96 hours. Appearance: No damage. Contact Resistance 30 m.
Environmental PerformanceTemperature RiseMax 30 (at max rated current)
Environmental PerformanceHumidity (Constant)402, 90-95%RH for 96 hours. Appearance: No damage. Contact Resistance 30m, Insulation Resistance 50M, No breakdown/flashover.
Environmental PerformanceTemperature Cycling5 cycles (-553 30min -> Room temp. 10-15min -> 853 30min -> Room temp. 10-15min). Same requirements as Humidity test.
Environmental PerformanceSalt Spray353, 51% solution. Stamping then plating: 48 hours. Plating then stamping: 8 hours. Appearance: No damage. Contact Resistance 30 m.
Environmental PerformanceSolderabilitySolder Temp: 2455, Immersion: 30.5S. Soldering Area: 90%.
Environmental PerformanceResistance to soldering heatManual: 3055, 30.5S. SMT Reflow: Max 2555, 20S Max. Appearance: No damage.
Reflow Temperature CurveSMT Lead-free ProcessRefer to 9.1
PackagingTerminalReel packaging
PackagingHousingPlastic bag packaging
PackagingWaferReel packaging
PackagingExteriorCarton with packing list
TransportationConditionsMoisture-proof, no mechanical damage. Temperature: -20~+50.
StorageConditionsTemperature: -20~+40, RH 80%. No corrosive gases. Re-qualification test required if stored > 6 months.

2512161445_Ckmtw-W-1253M08P-0420_C53184487.pdf

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