electrical connectors Ckmtw W 1253M07P 0420 with 125 millimeter pitch and withstand voltage 500 volts AC
Product Overview
This specification covers the 1.25 series ultra-thin wafer connectors, designed for applications requiring reliable electrical connections. These connectors feature a 1.25mm pitch and are suitable for wire sizes AWG#28 to #32, with a PC board thickness range of 0.6 to 1.2mm. They are built to withstand various environmental conditions and mechanical stresses, ensuring consistent performance in demanding applications.
Product Attributes
- Brand: SHENZHEN CANKEMENG INDUSTRIAL CO. LTD
- Origin: China
- Material (Terminal): Phosphor bronze with Gold Plating
- Material (Housing): PBT (White) or Nylon6T (Beige)
- Material (Contact): Phosphor bronze with Gold Plating
- Certifications: UL94V-0
Technical Specifications
| Item | Test Mode/Requirement | Specifications |
| Electrical Performance | Rated Current | 1A AC/DC |
| Rated Voltage | 125V AC/DC | |
| Contact Resistance (Initial) | 20m (Max 20mV, 100mA) | |
| Withstand Voltage | 500V AC (rms) for 1 min, < 0.5mA leakage | |
| Insulation Resistance | 100 M (500V DC for 1 min) | |
| Mechanical Performance | Terminal Crimping Wire Strength | AWG#28: >13N; AWG#30: >8N; AWG#32: >6N |
| Fixed Terminals and Hole Seat Force | > 8N per contact | |
| Single Contact Insertion Force | < 3N | |
| Single Contact Withdrawal Force | > 0.3N | |
| Pin Retention Force | > 10N per contact | |
| Durability | 30 cycles, Contact Resistance 30m | |
| Vibration | Frequency: 10-55-10 Hz/min, Amplitude: 1.5mm p-p, 2 hrs per axis. Contact Resistance 30m, Current Discontinuity: 1sec Max. | |
| Environmental Performance | Thermal Aging | 852 for 96 hours. Contact Resistance 30m. |
| Temperature Rise | 30 Max (at rated current) | |
| Humidity (Constant) | 402, 90-95%RH for 96 hours. Contact Resistance 30m, Insulation Resistance 50M. | |
| Temperature Cycling | -55 to 85, 5 cycles. Meets requirements of paragraph 8.3. | |
| Salt Spray | 353, 51% solution. 8 hrs (post-plate) or 48 hrs (pre-plate). Contact Resistance 30m. | |
| Solderability | Solder Temp: 2455, Immersion: 30.5s. Soldering Area: 90%. | |
| Resistance to Soldering Heat | Manual: 3055 for 30.5s. Reflow: 2555 for 20s Max (See 9.1 curve). |
2512161445_Ckmtw-W-1253M07P-0420_C53184486.pdf