Wafer Connector Strip Needle Seat Ultra Thin 125 Millimeter Pitch Gold Plated Ckmtw W 1253M03P 0420
Specifications
Mfr. Part #:
W-1253M03P-0420
Package:
SMD,P=1.25mm,Surface Mount,Right Angle
Model Number:
W-1253M03P-0420
Introduction
Product Overview
This specification outlines the requirements for the 1.25 series ultra-thin wafer connector strip, designed for various electrical applications. It details product performance, testing methods, and inspection criteria to ensure reliability and compatibility.
Product Attributes
- Brand: SHENZHEN CANKEMENG INDUSTRIAL CO., LTD
- Origin: China
- Certifications: RoHS
- Material (Housing): PBT (UL94V-0, White), Nylon6T (UL94V-0, Beige)
- Material (Contact/Terminal/Wafer): Phosphor bronze
- Plating: Gold Plating (Fu~3")
Technical Specifications
| Item | Description | Requirement |
| General | Product Description | Needle Seat / 1.25mm Pitch / Wafer / Ultra-thin / Gold Plating |
| Customer Part No. | W-1253MXXP-0420 | |
| Use Condition | Ambient Temperature Range | -25+85 |
| Applicable Wire Sizes | AWG#28#32 | |
| Applicable PC Board Thickness | 0.6~1.2mm | |
| Electrical Performance | Rated Current | 1A (AC/DC) |
| Rated Voltage | 125V (AC/DC) | |
| Contact Resistance (Initial) | 20 m | |
| Withstand Voltage | 500V AC (rms) for 1 minute, leakage current 0.5mA, no breakdown/flashover | |
| Insulation Resistance | 100 M (at 500V DC for 1 minute) | |
| Mechanical Performance | Terminal Crimping Wire Strength | AWG#28: 13N, AWG#30: 8N, AWG#32: 6N |
| Fixed Terminals and Hole Seat Force | 8N (per contact) | |
| Single Contact Insertion Force | 3N | |
| Single Contact Withdrawal Force | 0.3N | |
| Pin Retention Force | 10N (per contact) | |
| Durability (Cycles) | 30 cycles, Contact Resistance 30 m | |
| Environmental Performance | Thermal Aging | 852 for 96 hours, Contact Resistance 30 m |
| Temperature Rise | 30 Max (at rated current) | |
| Humidity (Constant) | 402, 90-95%RH for 96 hours, Contact Resistance 30m, Insulation Resistance 50M, No breakdown/flashover | |
| Temperature Cycling | 5 cycles (-55 to 85), Same requirements as Humidity | |
| Salt Spray | 353, 51% solution, 8 hours (post-plate) or 48 hours (pre-plate), Contact Resistance 30 m | |
| Solderability | Solder Temp: 2455, Immersion: 30.5S, Soldering Area: 90% | |
| Resistance to Soldering Heat (Manual) | Soldering Time: 30.5S, Soldering Pot: 3055 | |
| Resistance to Soldering Heat (Reflow) | Soldering Time: Max 20S, Soldering Pot: 2555 (Refer to 9.1 curve) | |
| Packaging | Terminal Packaging | Reel packaging |
| Housing Packaging | Plastic bags | |
| Wafer Packaging | Reel or bag packaging | |
| Exterior Packaging | Carton with packing list | |
| Transportation | Temperature Range | -20~+50 |
| Storage | Temperature Range | -20~+40, Relative Humidity 80% |
| Re-qualification | Required if stored > 6 months |
2512161445_Ckmtw-W-1253M03P-0420_C53184482.pdf
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