Durable wire to board connector Ckmtw W 0800N12P R000 featuring 0.8 millimeter pitch for connections
Manufacturer:
Ckmtw
Description:
1x12P Tin 0.8mm 50V 12 1 Surface Mount,Vertical -25℃~+85℃ SMD,P=0.8mm Headers, Male Pins RoHS
Category:
Free Hanging, Panel Mount/Headers, Male Pins
Specifications
Pins Structure:
1x12P
Contact Plating:
锡
Pitch:
0.8mm
Contact Material:
磷铜;LCP
Voltage Rating (Max):
50V
Number Of PINs Per Row:
12
Number Of Rows:
1
Z-Height Of The Board:
2.75mm
Mounting Type:
立贴
Operating Temperature:
-25℃~+85℃
Mfr. Part #:
W-0800N12P-R000
Package:
SMD,P=0.8mm
Model Number:
W-0800N12P-R000
Introduction
Product Overview
This specification applies to the SUH0.8 series of pressure-type bar connectors with a 0.8mm pitch, designed for wire-to-board connections. These connectors offer a compact solution for various electronic applications.
Product Attributes
- Brand: SHENZHEN CANKEMENG INDUSTRIAL CO.LTD / SHENZHEN CHANKEMENG INDUSTRY CO. LTD
- Origin: Made in China (Production base: JIANGXI CANKEMENG ELECTRONICS CO.LTD)
- Product Name: Wire-to-board connector / SUH0.8 / 0.8mm pitch
- Customer Part No: W-0800NXXP-R000
- Housing Material: LCP (Natural Color)
- Contact Material: Phosphor Copper
- Welding Slice Material: Phosphor Copper
- Contact Plating: Nickel Base, High Tin
Technical Specifications
| Item | Specification/Requirement | Test Condition |
|---|---|---|
| Ratings and Applicable Wires | ||
| Rated Voltage (MAX) | 50V [AC (rms) / DC] | - |
| Rated Current (MAX) | 0.5A (AWG#30, AWG#32) | - |
| Insulation O.D. | 0.5-0.6mm | - |
| Ambient Temperature Range | -25 +85 | - |
| Performance | ||
| Contact Resistance | 20 milliohms MAX | Dry circuit, 20mV MAX, 10mA |
| Insulation Resistance | 100 Megohms MIN | 100V DC between adjacent terminals or ground |
| Dielectric Strength | No Breakdown | 200V AC (rms) for 1 minute between adjacent terminals or ground |
| Contact Resistance On Crimped Portion | 5 milliohms MAX | Dry circuit, 20mV MAX, 10mA |
| Mechanical Performance | ||
| Contact Retention Force (Min.) | 4-7N MIN | Axial pull out at 253mm/minute |
| Terminal/Housing Retention Force | 4-7N MIN | Axial pull out at 253mm/minute |
| Contact Insertion Force | 1-2N/PIN | Manual insertion |
| Contact Withdrawal Force | 0.3N/PIN | Manual withdrawal |
| Environmental Performance and Others | ||
| Repeated Insertion and Withdrawal | Contact Resistance: 60 mMAX | 20 cycles at < 10 cycles/minute (no power) |
| Temperature Rise | 30 MAX | Carrying rated current load (UL 498) |
| Vibration | Appearance: No Damage Contact Resistance: 60 mMAX Discontinuity: 1 ms.MAX. | Amplitude: 5mm P-P, Sweep: 10-55-10Hz/min, Duration: 2 hours in X,Y,Z axes (DC 1mA) |
| Shock | Appearance: No Damage Discontinuity: 1 ms.MAX. | 490m/s {50G}, 3 strokes in each X,Y,Z axes (DC 1mA) |
| Heat Resistance | Appearance: No Damage Contact Resistance: 60 mMAX | 852 for 96 hours, then return to room temp for 1-2 hours |
| Cold Resistance | Appearance: No Damage Contact Resistance: 60 mMAX | -402 for 96 hours, then return to room temp for 1-2 hours |
| Humidity | Appearance: No Damage Contact Resistance: 60 mMAX Dielectric Strength: Must meet 4.1.3 Insulation Resistance: 20 M MIN | 402, 90-94% RH for 96 hours, then return to room temp for 0.5 hours |
| Temperature Cycling | Appearance: No Damage Contact Resistance: 60 mMAX | 5 cycles of: -253 (30 min) -> 852 (30 min), with room temp transitions |
| Salt Spray | Appearance: No Damage, Corrosion Contact Resistance: 60 mMAX | 24 hours exposure to 51% salt solution at 352, then wash and dry |
| SO2 Gas Resistance | Contact Resistance: 60 mMAX | 24 hours exposure to 505ppm SO2 gas at 402 |
| NH3 Gas Resistance | Appearance: No Damage Contact Resistance: 60 mMAX | 40 minutes exposure to NH3 gas from 28% Ammonia solution |
| Solderability | Solder Wetting: More Than 95% Area | Immersion in 2355 tin bath for 20.5 sec, 0.2mm from tip |
| Resistance to Soldering Heat | Appearance: No Damage, Deformation | Immersion in 2555 tin bath for 50.5 sec, 0.2mm from tip |
| Conditions for Soldering (Pb-free) | ||
| Preheating Average Temperature Gradient | 2.5C/s | - |
| Soak Time (tsoak) | 2-3 minutes | Time above 150C |
| Time above 150C (T1) | 60s | - |
| Time above 180C (T2) | 50s | - |
| Time above 250C (T3) | 2-5s | - |
| Peak Temperature (Tpeak) | 255C (0/+5C) | - |
| Cooling Temperature Gradient | Max -5C/s | - |
| Time above 230C | 2010 sec | - |
| Pre-Heat Time | 9030 sec | - |
2508121550_Ckmtw-W-0800N12P-R000_C50314174.pdf
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