08mm pitch wire to board connector surface mount type Ckmtw W 0800N04P R000 for 05 to 06mm insulation
Manufacturer:
Ckmtw
Description:
1x4P Tin 0.8mm 50V 4 1 Surface Mount,Vertical -25℃~+85℃ SMD,P=0.8mm Headers, Male Pins RoHS
Category:
Free Hanging, Panel Mount/Headers, Male Pins
Specifications
Pins Structure:
1x4P
Contact Plating:
锡
Pitch:
0.8mm
Contact Material:
磷铜;LCP
Voltage Rating (Max):
50V
Number Of PINs Per Row:
4
Number Of Rows:
1
Z-Height Of The Board:
2.75mm
Mounting Type:
立贴
Operating Temperature:
-25℃~+85℃
Mfr. Part #:
W-0800N04P-R000
Package:
SMD,P=0.8mm
Model Number:
W-0800N04P-R000
Introduction
Product Overview
This specification applies to 0.8mm spacing pressure type bar connectors (SUH0.8). These connectors are designed for wire-to-board connections.
Product Attributes
- Brand: SHENZHEN CANKEMENG INDUSTRIAL CO.LTD
- Product Name: Wire-to-board connector / SUH0.8 / 0.8mm pitch / Surface Mount
- Customer Part No: W-0800NXXP-R000
- Manufacturing Base: JIANGXI CANKEMENG ELECTRONICS CO.LTD
- Company Address (Jiangxi): Putian Industrial Zone, Zhajin Town, Xiushui County, Jiujiang City, Jiangxi Province
- Company Address (Shenzhen): Building 5, No. 36, Ligongsi Road, Lihu Community, Xinhua Street, Guangming District, Shenzhen
- Contact Tel: 0755-81488157
- Contact Fax: 0755-83425987
- Email: ckm-tw168@163.com, ckm-scb@ckmtw.com.cn
Technical Specifications
| Item | Requirement | Test Condition | Specification |
|---|---|---|---|
| 1. Ratings and Applicable Wires | |||
| Rated Voltage (MAX) | 50V [AC(rms)/DC] | ||
| Insulation O.D. | 0.5-0.6mm | ||
| Rated Current (MAX) | AWG#30: 0.5A, AWG#32: 0.5A | ||
| Ambient temperature Range | -25 +85 | ||
| 2. Performance | |||
| Contact Resistance | 20 milliohms MAX | Dry circuit, 20mV MAX, 10mA | |
| 5 milliohms MAX (Crimped Portion) | Dry circuit, 20mV MAX, 10mA | ||
| Insulation Resistance | 100 Megohms MIN | 100V DC between adjacent terminals or ground | |
| Dielectric Strength | No Breakdown | 200V AC (rms) for 1 minute between adjacent terminals or ground | |
| Contact Retention Force (Min.) | 4-7N MIN | Axial pull out at 253mm/minute | |
| Terminal/Housing Retention Force (Min.) | 4-7N MIN | Axial pull out at 253mm/minute | |
| Contact Insertion Force | 1-2N/PIN | Insert with hand | |
| Contact Withdrawal Force | 0.3N/PIN | Withdraw with hand | |
| 3. Environmental and Other Performance | |||
| Repeated Insertion and Withdrawal | Contact Resistance: 60 mMAX | 20 cycles at < 10 cycle/minute (No power) | |
| Temperature Rise | 30 MAX | Carrying rated current load (UL 498) | |
| Vibration | Appearance: No Damage | Amplitude: 5mm P-P, Sweep: 10-55-10Hz/min, Duration: 2 hours in each X,Y,Z axes (DC 1mA) | |
| Contact Resistance: 60 mMAX | |||
| Discontinuity: 1 ms.MAX. | |||
| Shock | Appearance: No Damage | 490m/s {50G}, 3 strokes in each X,Y,Z axes (DC 1mA) | |
| Discontinuity: 1 ms.MAX. | |||
| Heat Resistance | Appearance: No Damage | 852, 96 hours, then room temp 1-2 hours | |
| Contact Resistance: 60 mMAX | |||
| Cold Resistance | Appearance: No Damage | -402, 96 hours, then room temp 1-2 hours | |
| Contact Resistance: 60 mMAX | |||
| Humidity | Appearance: No Damage | 402, 90-94% RH, 96 hours, then room temp 0.5 hours | |
| Contact Resistance: 60 mMAX | |||
| Dielectric Strength | Must meet 4.1.3 | Temp: 402, RH: 90-94%, Duration: 96 Hours | |
| Insulation Resistance | 20 M MIN | Temp: 402, RH: 90-94%, Duration: 96 Hours | |
| Temperature Cycling | Appearance: No Damage | 5 cycles of: a) -253 30 min b) 852 30 min (with room temp transitions) | |
| Contact Resistance: 60 mMAX | |||
| Salt Spray | Appearance: No Damage, Corrosion | 24 hours exposure to 51% salt spray at 352. Rinse with water, dry at room temp. | |
| Contact Resistance: 60 mMAX | |||
| SO2 Gas Resistance | Contact Resistance: 60 mMAX | 24 hours exposure to 505ppm SO2 gas at 402. | |
| NH3 Gas Resistance | Appearance: No Damage | 40 minutes exposure to NH3 gas evaporating from 28% Ammonia solution. | |
| Contact Resistance: 60 mMAX | |||
| Solderability | Solder Wetting: More Than 95% Apply Area | Soldering Time: 20.5 sec, Temp: 2355, 0.2 mm from terminal tip | |
| Resistance to Soldering Heat | Appearance: No Damage, Deformation | Soldering Time: 50.5 sec, Temp: 2555, 0.2 mm from terminal tip | |
| 4. Conditions for Soldering (Pb-free) | |||
| Parameter | Specification | Reference | |
| Average temperature gradient in preheating | 2.5C/s | ||
| Soak time tsoak | 2-3 minutes | Time above 150C (T1) | 60s |
| Time above 180C (T2) | 50s | ||
| Time above 250C (T3) | 2-5s | ||
| Peak temperature in reflow (Tpeak) | 255C (0/+5C) | ||
| Temperature gradient in cooling | Max -5C/s | ||
| 230C MIN | 2010 sec | ||
| Pre-Heat | 9030 sec | ||
| 5. Product Shape, Dimensions and Materials | |||
| NAME | MATERIALS | REMARK | |
| Housing | LCP (Natural Color) | ||
| Contact | Phosphor Copper | Metal surface nickel base, high tin | |
| Welding Slice | Phosphor Copper | Metal surface nickel base, high tin | |
2508121550_Ckmtw-W-0800N04P-R000_C50314166.pdf
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