0.8mm pitch wire to board connector Ckmtw W-0800M11P-R000 rated 50V 0.5A suitable for AWG30 AWG32 wires
Specifications
Pins Structure:
1x11P
Contact Plating:
锡
Pitch:
0.8mm
Contact Material:
磷铜;LCP
Voltage Rating (Max):
50V
Number Of PINs Per Row:
11
Number Of Rows:
1
X-Length Of Bottom Edge On Board (Spacing Line):
11.07mm
Mounting Type:
卧贴
Operating Temperature:
-25℃~+85℃
Mfr. Part #:
W-0800M11P-R000
Package:
SMD,P=0.8mm,Surface Mount,Right Angle
Model Number:
W-0800M11P-R000
Introduction
Product Overview
The SUH0.8 is a 0.8mm pitch pressure-type bar connector designed for wire-to-board connections. It offers a rated voltage of 50V and a rated current of 0.5A, suitable for wire gauges AWG#30 and AWG#32. The operating temperature range is -25 to +85. This connector is ideal for applications requiring reliable and compact wire-to-board termination.
Product Attributes
- Brand: SHENZHEN CANKEMENG INDUSTRIAL CO.LTD
- Product Name: SUH0.8
- Part Number: W-0800MXXP-R000
- Origin: Shenzhen, China
- Manufacturing Base: JIANGXI CANKEMENG ELECTRONICS CO.LTD
- Housing Material: LCP (Natural Color)
- Contact Material: Phosphor Copper
- Welding Slice Material: Phosphor Copper
- Surface Treatment: Nickel Base, High Tin
Technical Specifications
| Item | Specification | Requirement |
| Ratings and Applicable Wires | ||
| Rated Voltage (MAX) | [AC(rms)/DC] | 50V |
| Insulation O.D. | 0.5-0.6mm | |
| Rated Current (MAX) | AWG#30 | 0.5A |
| Rated Current (MAX) | AWG#32 | 0.5A |
| Ambient temperature Range | -25 +85 | |
| Performance | ||
| Contact Resistance | Dry circuit, 20mV MAX, 10mA | 20 milliohms MAX |
| Insulation Resistance | 100V DC between adjacent terminal or ground | 100 Megohms MIN |
| Dielectric Strength | 200V AC (rms) for 1 minute between adjacent terminal or ground | No Breakdown |
| Contact Resistance On Crimped Portion | Dry circuit, 20mV MAX, 10mA | 5 milliohms MAX |
| Mechanical Performance | ||
| Contact Retention Force (Min.) | Axial pull out force at 253mm/minute | 4-7N MIN |
| Terminal /Housing Retention Force | Axial pull out force at 253mm/minute | 4-7N MIN |
| Contact Insertion Force | Per pin | 1-2N/PIN |
| Contact Withdrawal Force | Per pin | 0.3N/PIN |
| Environmental Performance and Others | ||
| Repeated Insertion and Withdrawal | 20 cycles at < 10 cycles/minute | Contact Resistance: 60 mMAX |
| Temperature Rise | Carrying rated current load (UL 498) | 30 MAX |
| Vibration | Amplitude: 5mm P-P, Sweep: 10-55-10Hz/min, 2 hours each X,Y,Z axes, DC 1mA | Appearance: No Damage, Contact Resistance: 60 mMAX, Discontinuity: 1 ms.MAX. |
| Shock | 490m/s{50G}, 3 strokes each X,Y,Z axes, DC 1mA | Appearance: No Damage, Discontinuity: 1 ms.MAX. |
| Heat Resistance | 852, 96 hours, then room temp 1-2 hours | Appearance: No Damage, Contact Resistance: 60 mMAX |
| Cold Resistance | -402, 96 hours, then room temp 1-2 hours | Appearance: No Damage, Contact Resistance: 60 mMAX |
| Humidity | 402, 90-94% RH, 96 hours, then room temp 0.5 hours | Appearance: No Damage, Contact Resistance: 60 mMAX, Dielectric Strength: Must meet 4.1.3, Insulation Resistance: 20 M MIN |
| Temperature Cycling | 5 cycles: -253 (30 min) -> 852 (30 min) | Appearance: No Damage, Contact Resistance: 60 mMAX |
| Salt Spray | 352, 51% salt solution, 24 hours, then wash and dry | Appearance: No Damage, Corrosion, Contact Resistance: 60 mMAX |
| SO2 Gas Resistance | 402, 505ppm SO2 gas, 24 hours | Contact Resistance: 60 mMAX |
| NH3 Gas Resistance | 40 minutes exposure to NH3 gas from 28% Ammonia solution | Appearance: No Damage, Contact Resistance: 60 mMAX |
| Solderability | 2355 solder bath, 20.5 sec, 0.2 mm from terminal tip | Solder Wetting Area: More Than 95% |
| Resistance to Soldering Heat | 2555 solder bath, 50.5 sec, 0.2 mm from terminal tip | Appearance: No Damage, Deformation |
| Conditions for soldering (Pb-free) | ||
| Preheating Average temperature gradient | 2.5C/s | |
| Soak time (tsoak) | Time above 150C (T1) | 2-3 minutes / 60s |
| Time above 180C (T2) | 50s | |
| Time above 250C (T3) | 2-5s | |
| Peak temperature (Tpeak) | 255C (0/+5C) | |
| Cooling Temperature gradient | Max -5C/s | |
| Conditions | 230C MIN, 2010sec; Pre-Heat 9030sec | |
2508121550_Ckmtw-W-0800M11P-R000_C50314162.pdf
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