Wire to Board 0.8mm Pitch Pressure Bar Connector Rated Current 0.5A Voltage 50V Ckmtw W-0800M10P-R000
Manufacturer:
Ckmtw
Description:
1x10P Tin 0.8mm 50V 10 1 Surface Mount, Right Angle -25℃~+85℃ SMD,P=0.8mm,Surface Mount,Right Angle Headers, Male Pins RoHS
Category:
Free Hanging, Panel Mount/Headers, Male Pins
Specifications
Pins Structure:
1x10P
Contact Plating:
锡
Pitch:
0.8mm
Contact Material:
磷铜;LCP
Voltage Rating (Max):
50V
Number Of PINs Per Row:
10
Number Of Rows:
1
X-Length Of Bottom Edge On Board (Spacing Line):
10.7mm
Mounting Type:
卧贴
Operating Temperature:
-25℃~+85℃
Mfr. Part #:
W-0800M10P-R000
Package:
SMD,P=0.8mm,Surface Mount,Right Angle
Model Number:
W-0800M10P-R000
Introduction
Product Overview
This specification applies to 0.8mm spacing pressure type bar connectors, designed for wire-to-board connections. The product is manufactured by Shenzhen Cankemeng Industrial Co., Ltd. and is suitable for applications requiring a rated voltage of up to 50V and a rated current of 0.5A for AWG#30 and AWG#32 wires. The operating temperature range is -25 to +85.
Product Attributes
- Brand: Cankemeng
- Origin: Shenzhen, China
- Manufacturing Base: Jiangxi Cankemeng Electronics Co., Ltd.
- Material (Housing): LCP (Natural Color)
- Material (Contact): Phosphor Copper
- Material (Welding Slice): Phosphor Copper (Nickel Plated, High Tin)
Technical Specifications
| Item | Specification | Requirement |
| 3 Ratings and Applicable Wires | ||
| Rated Voltage (MAX) | [AC(rms)/DC] | 50V |
| Insulation O.D. | External Diameter: 0.5-0.6mm | AWG#30: 0.5A AWG#32: 0.5A |
| Rated Current (MAX) | ||
| Ambient temperature Range | -25 +85 | |
| 4 Performance | ||
| 4.1 Performance | ||
| Contact Resistance | Measure by dry circuit, 20mV MAX, 10mA | 20 milliohms MAX |
| Insulation Resistance | Apply 100V DC between adjacent terminals or ground | 100 Megohms MIN |
| Dielectric Strength | Apply 200V AC (rms) for 1 minute between adjacent terminals or ground | No Breakdown |
| Contact Resistance On Crimped Portion | Measure by dry circuit, 20mV MAX, 10mA | 5 milliohoms MAX |
| 4.2 Mechanical Performance | ||
| Contact Retention Force (Min.) | Apply axial pull out force at a speed of 253mm/minute on the contact assembled in the housing | 4-7N MIN |
| Terminal /Housing Retention Force | Apply axial pull out force at a speed of 253mm/minute on the contact assembled in the housing | 4-7N MIN |
| Contact Insertion and Withdrawal Force | Insert and withdraw connectors with hand | Insert force: 1-2N/PIN Pull output: 0.3N/PIN |
| 4.3 Environmental Performance and Others | ||
| Repeated Insertion and Withdrawal | Insertion and withdrawal up to 20 cycles at a speed rate of less than 10 cycles/minute | Contact Resistance: 60 mMAX |
| Temperature Rise | Carrying rated current load (UL 498) | 30 MAX |
| Vibration | DC 1mA energized; Amplitude: 5mm P-P; Sweep time: 10-55-10Hz/min; Duration: 2 hours in each X, Y, Z axes | Appearance: No Damage Contact Resistance: 60 mMAX Discontinuity: 1 ms.MAX. |
| Shock | DC 1mA energized; 490m/s {50G}, 3 strokes in each X, Y, Z axes | Appearance: No Damage Discontinuity: 1 ms.MAX. |
| Heat Resistance | 852 for 96 hours; then return to room temperature for 1-2 hours | Appearance: No Damage Contact Resistance: 60 mMAX |
| Cold Resistance | -402 for 96 hours; then return to room temperature for 1-2 hours | Appearance: No Damage Contact Resistance: 60 mMAX |
| Humidity | 402, 90-94% RH for 96 hours; then return to room temperature for 0.5 hours | Appearance: No Damage Contact Resistance: 60 mMAX Dielectric Strength: Must meet 4.1.3 Insulation Resistance: 20 M MIN |
| Temperature Cycling | 5 cycles of: a) -253 30 minutes; b) 852 30 minutes | Appearance: No Damage Contact Resistance: 60 mMAX |
| Salt Spray | 24 hours exposure to a salt spray from 51% solution at 352. After test, wash with room temperature water and dry at room temperature. | Appearance: No Damage, Corrosion Contact Resistance: 60 mMAX |
| SO2 Gas | 24 hours exposure to 505ppm SO2 gas at 402. | Contact Resistance: 60 mMAX |
| NH3 Gas | 40 minutes exposure to NH3 gas evaporating from 28% Ammonia solution. | Appearance: No Damage Contact Resistance: 60 mMAX |
| Solderability | Soldering Time: 20.5 sec. Soldering Temperature: 2355 0.2 mm from terminal tip | Solder Wetting: Apply Area More Than 95% |
| Resistance to Soldering Heat | Soldering Time: 50.5 sec. Soldering Temperature: 2555 0.2 mm from terminal tip | Appearance: No Damage, Deformation |
| 5 Conditions for Soldering | ||
| Pb-free Reflow Profile Requirements | Average temperature gradient in preheating: 2.5C/s Soak time (tsoak): 2-3 minutes Time above 150C (T1): 60s Time above 180C (T2): 50s Time above 250C (T3): 2-5s Peak temperature in reflow (Tpeak): 255C (0/+5C) Temperature gradient in cooling: Max -5C/s | |
2508121550_Ckmtw-W-0800M10P-R000_C50314161.pdf
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