Compact 0.8mm pitch pressure type bar connector Ckmtw W 0800M06P R000 for wire to board connections
Manufacturer:
Ckmtw
Description:
1x6P Tin 0.8mm 50V 6 1 Surface Mount, Right Angle -25℃~+85℃ SMD,P=0.8mm,Surface Mount,Right Angle Headers, Male Pins RoHS
Category:
Free Hanging, Panel Mount/Headers, Male Pins
Specifications
Pins Structure:
1x6P
Contact Plating:
锡
Pitch:
0.8mm
Contact Material:
磷铜;LCP
Voltage Rating (Max):
50V
Number Of PINs Per Row:
6
Number Of Rows:
1
X-Length Of Bottom Edge On Board (Spacing Line):
7.06mm
Mounting Type:
卧贴
Operating Temperature:
-25℃~+85℃
Mfr. Part #:
W-0800M06P-R000
Package:
SMD,P=0.8mm,Surface Mount,Right Angle
Model Number:
W-0800M06P-R000
Introduction
Product Overview
The SUH0.8 is a 0.8mm pitch pressure-type bar connector designed for wire-to-board connections. It offers a compact solution for applications requiring reliable electrical connections.
Product Attributes
- Brand: SHENZHEN CANKEMENG INDUSTRIAL CO.LTD
- Product Name: SUH0.8 (0.8mm)
- Part Number: W-0800MXXP-R000
- Origin: Made in China (Shenzhen Cankemeng Industrial Co., Ltd / Jiangxi Cankemeng Electronics Co., Ltd)
- Housing Material: LCP (Natural Color)
- Contact Material: Phosphor Copper
- Welding Slice Material: Phosphor Copper
- Plating: Nickel Base, High Tin
Technical Specifications
| Item | Specification | Requirement |
| Ratings and Applicable Wires | ||
| Rated Voltage (MAX) | 50V [AC (rms) / DC] | |
| Rated Current (MAX) | AWG#30: 0.5A AWG#32: 0.5A | |
| Insulation O.D. | 0.5-0.6mm | |
| Ambient Temperature Range | -25 +85 | |
| Performance | ||
| Contact Resistance | Measure by dry circuit, 20mV MAX, 10mA | 20 milliohms MAX |
| Insulation Resistance | Apply 100V DC between adjacent terminals or ground | 100 Megohms MIN |
| Dielectric Strength | Apply 200V AC (rms) for 1 minute between adjacent terminals or ground | No Breakdown |
| Contact Resistance on Crimped Portion | Measure by dry circuit, 20mV MAX, 10mA | 5 milliohms MAX |
| Mechanical Performance | ||
| Contact Retention Force (Min.) | Apply axial pull out force at a speed of 253mm/minute | 4-7N MIN |
| Terminal / Housing Retention Force (Min.) | Apply axial pull out force at a speed of 253mm/minute | 4-7N MIN |
| Contact Insertion Force | Insert and withdraw connectors with hand | 1-2N/PIN |
| Contact Withdrawal Force | Insert and withdraw connectors with hand | 0.3N/PIN |
| Environmental Performance and Others | ||
| Repeated Insertion and Withdrawal | Up to 20 cycles at a speed rate of less than 10 cycles/minute | Contact Resistance: 60 mMAX |
| Temperature Rise | Carrying rated current load (UL 498) | 30 MAX |
| Vibration | Amplitude: 5mm P-P, Sweep time: 10-55-10Hz/min, Duration: 2 hours in each X,Y,Z axes (DC 1mA) | Appearance: No Damage, Contact Resistance: 60 mMAX, Discontinuity: 1 ms.MAX. |
| Shock | 490m/s {50G}, 3 strokes in each X,Y,Z axes (DC 1mA) | Appearance: No Damage, Discontinuity: 1 ms.MAX. |
| Heat Resistance | 852 for 96 hours, then return to room temperature for 1-2 hours | Appearance: No Damage, Contact Resistance: 60 mMAX |
| Cold Resistance | -402 for 96 hours, then return to room temperature for 1-2 hours | Appearance: No Damage, Contact Resistance: 60 mMAX |
| Humidity | 402, 90-94% RH for 96 hours, then measure at room temperature within 0.5 hours | Appearance: No Damage, Contact Resistance: 60 mMAX, Dielectric Strength: Must meet 4.1.3, Insulation Resistance: 20 M MIN |
| Temperature Cycling | 5 cycles of: -253 for 30 minutes; 852 for 30 minutes | Appearance: No Damage, Contact Resistance: 60 mMAX |
| Salt Spray | 24 hours exposure to a salt spray from 51% solution at 352. After test, wash with room temperature water and dry. | Appearance: No Damage, Corrosion, Contact Resistance: 60 mMAX |
| SO2 Gas Resistance | 24 hours exposure to 505ppm SO2 gas at 402. | Contact Resistance: 60 mMAX |
| NH3 Gas Resistance | 40 minutes exposure to NH3 gas evaporating from 28% Ammonia solution. | Appearance: No Damage, Contact Resistance: 60 mMAX |
| Solderability | Immersion at 2355 for 20.5 sec, 0.2 mm from terminal tip. | Solder Wetting: More Than 95% Apply Area |
| Resistance to Soldering Heat | Immersion at 2555 for 50.5 sec, 0.2 mm from terminal tip. | Appearance: No Damage, Deformation |
Soldering Conditions
| Parameter | Specification |
| Pb-free Reflow Profile Requirements | |
| Average temperature gradient in preheating | 2.5C/s |
| Soak time (tsoak) | 2-3 minutes |
| Time above 150C (T1) | 60s |
| Time above 180C (T2) | 50s |
| Time above 250C (T3) | 2-5s |
| Peak temperature in reflow (Tpeak) | 255C (0/+5C) |
| Temperature gradient in cooling | Max -5C/s |
| Pre-Heat | 9030sec |
| 230C MIN 2010sec |
2508121550_Ckmtw-W-0800M06P-R000_C50314157.pdf
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