Wire to board connectors pressure type bar 0.8mm pitch Ckmtw W-0800M02P-R000 for electrical contact
Manufacturer:
Ckmtw
Description:
1x2P Tin 0.8mm 50V 2 1 Surface Mount, Right Angle -25℃~+85℃ SMD,P=0.8mm,Surface Mount,Right Angle Headers, Male Pins RoHS
Category:
Free Hanging, Panel Mount/Headers, Male Pins
Specifications
Pins Structure:
1x2P
Contact Plating:
锡
Pitch:
0.8mm
Contact Material:
磷铜;LCP
Voltage Rating (Max):
50V
Number Of PINs Per Row:
2
Number Of Rows:
1
X-Length Of Bottom Edge On Board (Spacing Line):
3.86mm
Mounting Type:
卧贴
Operating Temperature:
-25℃~+85℃
Mfr. Part #:
W-0800M02P-R000
Package:
SMD,P=0.8mm,Surface Mount,Right Angle
Model Number:
W-0800M02P-R000
Introduction
Product Overview
0.8mm pitch pressure type bar connectors for wire-to-board connections. Designed for applications requiring reliable electrical connections between wires and circuit boards.
Product Attributes
- Brand: SHENZHEN CANKEMENG INDUSTRAIAL CO.LTD
- Origin: China
- Product Name: SUH0.8 (0.8mm pitch)
- Part Number: W-0800MXXP-R000
- Base Material: LCP (Natural Color)
- Contact Material: Phosphor Copper
- Welding Slice Material: Phosphor Copper
- Plating: Nickel Base, High Tin
Technical Specifications
| Item | Specification | Requirement |
| Ratings and Applicable Wires | ||
| Rated Voltage (MAX) | 50V [AC(rms)/DC] | |
| Insulation O.D. | 0.5-0.6mm | |
| Rated Current (MAX) | AWG#30 | 0.5A |
| Rated Current (MAX) | AWG#32 | 0.5A |
| Ambient Temperature Range | -25 +85 | |
| Performance | ||
| Contact Resistance | Measure by dry circuit, 20mV MAX, 10mA | 20 milliohms MAX |
| On Crimped Portion (measure by dry circuit, 20mV MAX, 10mA) | 5 milliohoms MAX | |
| Insulation Resistance | Apply 100V DC between adjacent terminal or ground | 100Megohms MIN |
| Dielectric Strength | Apply 200V AC (min) for 1 minute between adjacent terminal or ground | No Breakdown |
| Mechanical Performance | ||
| Contact Retention Force (Min.) | Apply axial pull out force at a speed of 253mm/minute | 4-7N MIN |
| Terminal /Housing Retention Force | Apply axial pull out force at a speed of 253mm/minute | 4-7N MIN |
| Contact Insertion and Withdrawal Force | Insert force | 1-2N/PIN |
| Pull output | 0.3N/PIN | |
| Environmental Performance and Others | ||
| Repeated Insertion and Withdrawal | Insertion and withdrawal actuator up to 20 cycles at a speed rate of less than 10 cycles/minute | |
| Contact Resistance | 60 mMAX | |
| Temperature Rise | Carrying rated current load (UL 498) | 30 MAX |
| Vibration | Amplitude: 5mm P-P, Sweep time: 10-55-10Hz/min, Duration: 2 hours in each X.Y.Z. axes, DC 1mA energized | |
| Contact Resistance | 60 mMAX | |
| Discontinuity | 1 ms.MAX. | |
| Shock | 490m/s{50G}, 3 strokes in each X.Y.Z. axes, DC 1mA energized | |
| Discontinuity | 1 ms.MAX. | |
| Heat Resistance | 852, 96 hours, then return to room temperature for 1-2 hours | |
| Contact Resistance | 60 mMAX | |
| Cold Resistance | -402, 96 hours, then return to room temperature for 1-2 hours | |
| Contact Resistance | 60 mMAX | |
| Humidity | Temperature: 402, Relative Humidity: 90-94%, Duration: 96 Hours, then measure at room temperature within 0.5 hours | |
| Contact Resistance | 60 mMAX | |
| Dielectric Strength | Must meet 4.1.3 | |
| Insulation Resistance | 20 M MIN | |
| Temperature Cycling | 5 cycles of: a) -253 30 minutes b) 852 30 minutes, with 10-15 minutes at room temp/humidity between cycles | |
| Contact Resistance | 60 mMAX | |
| Salt Spray | 24 hours exposure to a salt spray from the 51% solution at 352. After test, wash with room temp water and dry at room temp. | |
| Contact Resistance | 60 mMAX | |
| SO2 Gas Resistance | 24 hours exposure to 505ppm SO2 gas at 402. | Contact Resistance: 60 mMAX |
| NH3 Gas Resistance | 40 minutes exposure to NH3 gas evaporating from 28% Ammonia solution | |
| Contact Resistance | 60 mMAX | |
| Solderability | Soldering Time: 20.5 sec, Soldering Temperature: 2355, 0.2 mm from terminal tip | |
| Solder Wetting Area | More Than 95% | |
| Resistance to Soldering Heat | Soldering Time: 50.5 sec, Soldering Temperature: 2555, 0.2 mm from terminal tip | Appearance: No Damage, Deformation |
| Conditions for Soldering (Pb-free) | ||
| Parameter | Specification | |
| Average temperature gradient in preheating | 2.5C/s | |
| Soak time (tsoak) | 2-3 minutes | |
| Time above 150C (T1) | 60s | |
| Time above 180C (T2) | 50s | |
| Time above 250C (T3) | 2-5s | |
| Peak temperature in reflow (Tpeak) | 255C (+0/-5C) | |
| Temperature gradient in cooling | Max -5C/s | |
2508121550_Ckmtw-W-0800M02P-R000_C50314153.pdf
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