Durable pressure type bar connector Ckmtw W-0800M03P-R000 designed for AWG30 AWG32 wire connections
Specifications
Pins Structure:
1x3P
Contact Plating:
锡
Pitch:
0.8mm
Contact Material:
磷铜;LCP
Voltage Rating (Max):
50V
Number Of PINs Per Row:
3
Number Of Rows:
1
X-Length Of Bottom Edge On Board (Spacing Line):
4.66mm
Mounting Type:
卧贴
Operating Temperature:
-25℃~+85℃
Mfr. Part #:
W-0800M03P-R000
Package:
SMD,P=0.8mm,Surface Mount,Right Angle
Model Number:
W-0800M03P-R000
Introduction
Product Overview
The SUH0.8 is a 0.8mm pitch pressure-type bar connector designed for wire-to-board connections. It operates within a voltage rating of 50V and a current rating of 0.5A (AWG#30, AWG#32), with an ambient temperature range of -25 to +85. This connector is suitable for applications requiring reliable and compact wire termination.
Product Attributes
- Brand: SHENZHEN CANKEMENG INDUSTRIAL CO.LTD
- Origin: Made in China (Production Base: JIANGXI CANKEMENG ELECTRONICS CO.LTD)
- Material: Housing: LCP (Natural Color); Contact: Phosphor Copper; Welding Slice: Phosphor Copper
- Surface Treatment: Metal Surface Nickel Base, High Tin
- Certifications: UL 498 (referenced for temperature rise)
Technical Specifications
| Item | Specification | Requirement |
| Ratings and Applicable Wires | ||
| Rated Voltage (MAX) | 50V [AC(rms)/DC] | |
| Insulation O.D. | 0.5-0.6mm | |
| Rated Current (MAX) | AWG#30: 0.5A AWG#32: 0.5A | |
| Ambient Temperature Range | -25 +85 | |
| Performance | ||
| Electrical Performance | ||
| Contact Resistance | Measure by dry circuit, 20mV MAX, 10mA | 20 milliohms MAX |
| Insulation Resistance | Apply 100V DC between adjacent terminal or ground | 100 Megohms MIN |
| Dielectric Strength | Apply 200V AC (min) for 1 minute between adjacent terminal or ground | No Breakdown |
| Contact Resistance On Crimped Portion | Measure by dry circuit, 20mV MAX, 10mA | 5 milliohms MAX |
| Mechanical Performance | ||
| Contact Retention Force (Min.) | Apply axial pull out force at a speed of 253mm/minute | 4-7N MIN |
| Terminal /Housing Retention Force | Apply axial pull out force at a speed of 253mm/minute | 4-7N MIN |
| Contact Insertion and Withdrawal Force | Insert and withdraw connectors with hand | Insert force: 1-2N/PIN Pull output: 0.3N/PIN |
| Environmental Performance and Others | ||
| Repeated Insertion and Withdrawal | Insertion and withdrawal actuator up to 20 cycles at a speed rate of less than 10 cycles/minute | Contact Resistance: 60 mMAX |
| Temperature Rise | Carrying rated current load (UL 498) | 30 MAX |
| Vibration | DC 1mA energized; Amplitude: 5mm P-P; Sweep time: 10-55-10Hz/min; Duration: 2 hours in each X.Y.Z. axes | Appearance: No Damage Contact Resistance: 60 mMAX Discontinuity: 1 ms.MAX. |
| Shock | DC 1mA energized; 490m/s2{50G}, 3 strokes in each X.Y.Z. axes | Appearance: No Damage Discontinuity: 1 ms.MAX. |
| Heat Resistance | 852, 96 hours; then return to room temperature for 1-2 hours | Appearance: No Damage Contact Resistance: 60 mMAX |
| Cold Resistance | -402, 96 hours; then return to room temperature for 1-2 hours | Appearance: No Damage Contact Resistance: 60 mMAX |
| Humidity | Temperature: 402, Relative Humidity: 90-94%, Duration: 96 Hours; then return to room temperature for 0.5 hours | Appearance: No Damage Contact Resistance: 60 mMIN Dielectric Strength: Must meet 4.1.3 |
| Temperature Cycling | 5 cycles of: a) -253 30 minutes b) 852 30 minutes | Appearance: No Damage Contact Resistance: 60 mMAX |
| Salt Spray | 24 hours exposure to a salt spray from the 51% solution at 352. | Appearance: No Damage, Corrosion Contact Resistance: 60 mMAX |
| SO2 Gas Resistance | 24 hours exposure to 505ppm SO2 gas at 402. | Contact Resistance: 60 mMAX |
| NH3 Gas Resistance | 40 minutes exposure to NH3 gas evaporating from 28% Ammonia solution | Appearance: No Damage Contact Resistance: 60 mMAX |
| Solderability | Soldering Time: 20.5 sec. Soldering Temperature: 2355 0.2 mm from terminal tip | Solder Wetting: More Than 95% Apply Area |
| Resistance to Soldering Heat | Soldering Time: 50.5 sec. Soldering Temperature: 2555 0.2 mm from terminal tip | Appearance: No Damage, Deformation |
| Conditions for Soldering (Pb-free) | ||
| Parameter | Specification | |
| Average temperature gradient in preheating | 2.5C/s | |
| Soak time (tsoak) | 2-3 minutes | |
| Time above 150C (T1) | 60s | |
| Time above 180C (T2) | 50s | |
| Time above 250C (T3) | 2-5s | |
| Peak temperature in reflow (Tpeak) | 255C (0/+5C) | |
| Temperature gradient in cooling | Max -5C/s | |
| Time above 230C | 2010sec | |
| Pre-Heat | 9030sec | |
2508121550_Ckmtw-W-0800M03P-R000_C50314154.pdf
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