Home > Products > FFC, FPC (Flat Flexible) Connector Assemblies >FFC, FPC (Flat Flexible) Connector Assemblies > back locking 1.0mm pitch FFC FPC connector DIANWEI 8.04A0.008200 for 0.3mm thick flexible flat cables

back locking 1.0mm pitch FFC FPC connector DIANWEI 8.04A0.008200 for 0.3mm thick flexible flat cables

Manufacturer:
DIANWEI
Description:
FFC/FPC Connector 8 Position 1mm Pitch Double-Sided Contacts, Top and Bottom Entry -40℃~+80℃
Category:
FFC, FPC (Flat Flexible) Connector Assemblies/FFC, FPC (Flat Flexible) Connector Assemblies
Specifications
Operating Temperature:
-40℃~+80℃
Number Of Contacts:
8P
Pitch:
1mm
Contact Type:
双侧触点/上下接
FFC, FCB Thickness:
0.3mm
Contact Plating:
Contact Material:
铜合金
Mfr. Part #:
8.04A0.008200
Package:
SMD,P=1mm,Surface Mount,Right Angle
Model Number:
8.04A0.008200
Introduction

Product Overview

The DIANWEI 8.04A series is a 1.0mm pitch FFC/FPC dual contact side connector with a height of 2.0mm. It is designed for 0.3mm thick FFC/FPC cables and features a back-locking mechanism. This connector is suitable for various applications requiring reliable and compact interconnect solutions.

Product Attributes

  • Brand: DIANWEI
  • Origin: DONGGUAN DIANWEI ELECTRONIC TECHNOLOGY CO.,LTD
  • Certifications: IATF16949, ISO9001:2015, ISO14001,

Technical Specifications

SpecificationDetails
Product Name1.0mm FFC/FPC dual contact side connector (H=2.0mm)
Series8.04A
Pitch1.0mm
Height (H)2.0mm
Applicable FFC/FPC Thickness0.3mm 0.02mm
Contact TypeDual contact side connector
Locking MechanismBack-locked (Rotary lock)
Housing MaterialLCP Nature Color (UL 94V-0)
Cover MaterialLCP Black (UL 94V-0)
Terminal MaterialCopper Alloy
Stator MaterialCopper Alloy
Plating SpecificationContact area and solder area: Gold plating 1~3u" (See drawing)
Coplanarity0.10mm MAX
Operation Temperature-40 ~ +85 (without ice or dew)
Operation Humidity20-85% RH
Storage Temperature-10 ~ +50 (without ice or dew)
Storage Humidity20-85% RH
Rated Voltage50V (AC/DC) at 20 ambient temperature
Rated Current0.5A / PIN at 20 ambient temperature
Contact Resistance30m Max (Mate applicable FPC, 100mA, 20mV Max DC)
Insulation Resistance500M MIN (Apply 250V DC for 1 minute between adjacent terminals)
Dielectric StrengthNo breakdown or short circuit (Apply 250V AC for 1 minute between adjacent terminals)
Retention Force of Single Pin0.2N / PIN MIN (Axial pull out force at 25~100mm/Min)
Retention Force of GND Pin0.3N / PIN MIN (Axial pull out force at 25~100mm/Min)
Retention Force of FFC/FPC0.3N Min/Pin (Insert FFC, axial pull out force at 20~100mm/Min)
Shock ResistanceAcceleration 490m/s, 11ms, 3 times per 6 directions. 1sec Max discontinuity, 50m MAX Contact resistance after test.
Vibration ResistanceAmplitude: 1.52mm, Frequency: 10~55~10Hz/min, 2 hours per axis (X/Y/Z). FPC mated state.
Durability (Lock/Dis-lock)20 times with loading. 50m MAX Contact resistance, No Damage after test.
Heat Resistance852 for 96H. 1H conditioning at ambient. 1sec Max discontinuity, 50m MAX Contact resistance, No damage, Retention force above 0.3N/Pin after test.
Humidity Resistance403, 90~95% RH for 96H. 1H conditioning at ambient. 1sec Max discontinuity, 50m Max Contact Resistance, 500 M Min Insulation Resistance, No damage Dielectric, Visual ok after test.
High/Low Temperature Cycle5 cycles based on table. 1H conditioning at ambient. 1sec Max discontinuity, 50 m Max Contact Resistance, Visual ok, Retention force above 0.3N/Pin after test.
Salt Spray (Gold Plating)5% salt water density, 351 for 48H. No corrosion after test.
SolderabilityDip soldering tail into Tin oven at 2455 for 3sec. Easy wetting, Tin cover over 90% of dipping area.
Resistance to Soldering HeatPreheating: 150~180 60~120Sec. Soldering: Peak temp 260, over 230 last 305Sec. Contact resistance 50m Max., no damage, Retention force above 0.3N/Pin after test.
Recommended Soldering ProfilePreheating: 150~180 60~120Sec. Soldering: Peak temp 2505, over 225 last 305Sec. Lock cover shall be opened during SMT. (Reference only)

2410121336_DIANWEI-8-04A0-008200_C19188838.pdf

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