back locking 1.0mm pitch FFC FPC connector DIANWEI 8.04A0.008200 for 0.3mm thick flexible flat cables
Specifications
Operating Temperature:
-40℃~+80℃
Number Of Contacts:
8P
Pitch:
1mm
Contact Type:
双侧触点/上下接
FFC, FCB Thickness:
0.3mm
Contact Plating:
金
Contact Material:
铜合金
Mfr. Part #:
8.04A0.008200
Package:
SMD,P=1mm,Surface Mount,Right Angle
Model Number:
8.04A0.008200
Introduction
Product Overview
The DIANWEI 8.04A series is a 1.0mm pitch FFC/FPC dual contact side connector with a height of 2.0mm. It is designed for 0.3mm thick FFC/FPC cables and features a back-locking mechanism. This connector is suitable for various applications requiring reliable and compact interconnect solutions.
Product Attributes
- Brand: DIANWEI
- Origin: DONGGUAN DIANWEI ELECTRONIC TECHNOLOGY CO.,LTD
- Certifications: IATF16949, ISO9001:2015, ISO14001,
Technical Specifications
| Specification | Details |
|---|---|
| Product Name | 1.0mm FFC/FPC dual contact side connector (H=2.0mm) |
| Series | 8.04A |
| Pitch | 1.0mm |
| Height (H) | 2.0mm |
| Applicable FFC/FPC Thickness | 0.3mm 0.02mm |
| Contact Type | Dual contact side connector |
| Locking Mechanism | Back-locked (Rotary lock) |
| Housing Material | LCP Nature Color (UL 94V-0) |
| Cover Material | LCP Black (UL 94V-0) |
| Terminal Material | Copper Alloy |
| Stator Material | Copper Alloy |
| Plating Specification | Contact area and solder area: Gold plating 1~3u" (See drawing) |
| Coplanarity | 0.10mm MAX |
| Operation Temperature | -40 ~ +85 (without ice or dew) |
| Operation Humidity | 20-85% RH |
| Storage Temperature | -10 ~ +50 (without ice or dew) |
| Storage Humidity | 20-85% RH |
| Rated Voltage | 50V (AC/DC) at 20 ambient temperature |
| Rated Current | 0.5A / PIN at 20 ambient temperature |
| Contact Resistance | 30m Max (Mate applicable FPC, 100mA, 20mV Max DC) |
| Insulation Resistance | 500M MIN (Apply 250V DC for 1 minute between adjacent terminals) |
| Dielectric Strength | No breakdown or short circuit (Apply 250V AC for 1 minute between adjacent terminals) |
| Retention Force of Single Pin | 0.2N / PIN MIN (Axial pull out force at 25~100mm/Min) |
| Retention Force of GND Pin | 0.3N / PIN MIN (Axial pull out force at 25~100mm/Min) |
| Retention Force of FFC/FPC | 0.3N Min/Pin (Insert FFC, axial pull out force at 20~100mm/Min) |
| Shock Resistance | Acceleration 490m/s, 11ms, 3 times per 6 directions. 1sec Max discontinuity, 50m MAX Contact resistance after test. |
| Vibration Resistance | Amplitude: 1.52mm, Frequency: 10~55~10Hz/min, 2 hours per axis (X/Y/Z). FPC mated state. |
| Durability (Lock/Dis-lock) | 20 times with loading. 50m MAX Contact resistance, No Damage after test. |
| Heat Resistance | 852 for 96H. 1H conditioning at ambient. 1sec Max discontinuity, 50m MAX Contact resistance, No damage, Retention force above 0.3N/Pin after test. |
| Humidity Resistance | 403, 90~95% RH for 96H. 1H conditioning at ambient. 1sec Max discontinuity, 50m Max Contact Resistance, 500 M Min Insulation Resistance, No damage Dielectric, Visual ok after test. |
| High/Low Temperature Cycle | 5 cycles based on table. 1H conditioning at ambient. 1sec Max discontinuity, 50 m Max Contact Resistance, Visual ok, Retention force above 0.3N/Pin after test. |
| Salt Spray (Gold Plating) | 5% salt water density, 351 for 48H. No corrosion after test. |
| Solderability | Dip soldering tail into Tin oven at 2455 for 3sec. Easy wetting, Tin cover over 90% of dipping area. |
| Resistance to Soldering Heat | Preheating: 150~180 60~120Sec. Soldering: Peak temp 260, over 230 last 305Sec. Contact resistance 50m Max., no damage, Retention force above 0.3N/Pin after test. |
| Recommended Soldering Profile | Preheating: 150~180 60~120Sec. Soldering: Peak temp 2505, over 225 last 305Sec. Lock cover shall be opened during SMT. (Reference only) |
2410121336_DIANWEI-8-04A0-008200_C19188838.pdf
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