Home > Products > FFC, FPC (Flat Flexible) Connector Assemblies >FFC, FPC (Flat Flexible) Connector Assemblies > FFC FPC dual contact side connector 1.0mm pitch height 2.0mm DIANWEI 8.04A0.012200 suitable for 0.3mm thick cables

FFC FPC dual contact side connector 1.0mm pitch height 2.0mm DIANWEI 8.04A0.012200 suitable for 0.3mm thick cables

Manufacturer:
DIANWEI
Description:
FFC/FPC Connector 12 Position 1mm Pitch Double-Sided Contacts, Top and Bottom Entry -40℃~+80℃
Category:
FFC, FPC (Flat Flexible) Connector Assemblies/FFC, FPC (Flat Flexible) Connector Assemblies
Specifications
Operating Temperature:
-40℃~+80℃
Number Of Contacts:
12P
Pitch:
1mm
Contact Type:
双侧触点/上下接
FFC, FCB Thickness:
0.3mm
Contact Plating:
Contact Material:
铜合金
Mfr. Part #:
8.04A0.012200
Package:
SMD,P=1mm,Surface Mount,Right Angle
Model Number:
8.04A0.012200
Introduction

Product Overview

This specification applies to the 8.04A series of 1.0mm pitch FFC/FPC dual contact side connectors with a height of 2.0mm. These connectors feature a back-locking mechanism and are designed for use with 0.3mm thick FFC/FPC cables, supporting 4 to 40 pins. They are suitable for SMT processes and offer dual contact for reliable electrical connections.

Product Attributes

  • Brand: DIANWEI (DONGGUAN DIANWEI ELECTRONIC TECHNOLOGY CO.,LTD)
  • Origin: Dongguan, China
  • Certifications: IATF16949, ISO9001:2015, ISO14001, National High-Tech Enterprise

Technical Specifications

CategorySpecificationDetails
Product Name1.0mm FFC/FPC dual contact side connector (H=2.0mm)
Series8.04A
Pitch1.0mm
HeightH=2.0mm
Applicable Cable Thickness0.3mm 0.02mm
Pin Count4-40pin
Contact TypeDual contact side connector
Locking MechanismBack-locked (Rotary lock)Special caution: Lock cover must be opened before SMT soldering or FPC insertion.
Housing MaterialLCP Nature Color (UL 94V-0)
Cover MaterialLCP Black (UL 94V-0)
Terminal MaterialCopper Alloy
Stator MaterialCopper Alloy
PlatingContact area and solder area: Gold plating 1~3uSee drawing for details.
Coplanarity0.10mm MAX
Operation Temperature-40 ~ +85Without ice or dew
Operation Humidity20-85RH
Storage Temperature-10 ~ +50Without ice or dew
Storage Humidity2085%RH
Rated Voltage50V (AC/DC)At ambient temperature 20
Rated Current0.5A / PINAt ambient temperature 20
Contact Resistance30m MaxMate applicable FPC, measure by dry circuit, 20mV Max. DC, 100mA.
Insulation Resistance500M MINApply 250V DC for 1 Minute between adjacent terminals.
Dielectric StrengthNo breakdown, no short circuitApply 250V AC for 1 Minute between adjacent terminals.
Retention Force of Single Pin0.2N / PIN MINApply axial pull out force at the rate of 25~100mm/Min.
Retention Force of GND Pin0.3N / PIN MINApply axial pull out force at the rate of 25~100mm/Min.
Retention Force of FFC/FPC0.3N Min/PinInsert FFC into connector, apply axial pull out force at the rate of 20~100mm/Min. (Total: PIN Count X 0.3N Min)
Shock ResistanceDiscontinuity 1sec Max. Contact resistance 50m MAX. No damage.Test speed 490m/s, lasting 11ms, 3 times each of 6 directions. FPC mated state.
Vibration ResistanceContact resistance 50m MAX. No damage.Amplitude: 1.52mm, Frequency: 10~55~10Hz in 1 minute. X/Y/Z directions, 2 hours each. FPC mated state.
Durability (Lock/Unlock)Contact resistance 50m MAX. No damage.20 times with loading.
Heat ResistanceDiscontinuity 1sec Max. Contact resistance 50m MAX. No damage. Retention force 0.3N/Pin.Expose to 852 for 96H. Conditioned at ambient for 1H. FPC mated state.
Humidity ResistanceDiscontinuity 1sec Max. Contact Resistance 50m Max. Insulation Resistance 500M Min. Dielectric: No damage, Shorting. Visual ok.Expose to 403, 90~95% RH for 96H. Conditioned at ambient for 1H. FPC mated state.
High/Low Temperature CycleDiscontinuity 1sec Max. Contact Resistance 50 m Max. Visual ok. Retention force 0.3N/Pin.5 cycles based on table. Conditioned at ambient for 1H. FPC mated state.
Salt Spray (Gold Plating)No CorrosionExpose to 5% salt water density at 351 for 48H.
SolderabilitySoldering tail easy wetting by melted tin, Tin coverage 90% of dipping area.Dip soldering tail into Tin oven at 2455 for 3 sec.
Resistance to Soldering HeatContact resistance 50m Max., no damage. Retention force 0.3N/Pin.Preheating: 150~180 60~120Sec. Soldering: Peak temp 260, over 230 last 305Sec.
Recommended Soldering ProfileRefer to profile for reference. Lock cover shall be opened.Preheating: 150~180 60~120Sec. Soldering: Peak temp 2505, over 225 last 305Sec.

2410121336_DIANWEI-8-04A0-012200_C19188840.pdf

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