FFC FPC connector with 4 to 60 pins DIANWEI 8.01A0.022200 dual contact side 0.5mm pitch rear locking
Manufacturer:
DIANWEI
Description:
FFC/FPC Connector 22 Position 0.5mm Pitch Double-Sided Contacts, Top and Bottom Entry -40℃~+80℃
Category:
FFC, FPC (Flat Flexible) Connector Assemblies/FFC, FPC (Flat Flexible) Connector Assemblies
Specifications
Operating Temperature:
-40℃~+80℃
Number Of Contacts:
22P
Pitch:
0.5mm
Contact Type:
双侧触点/上下接
FFC, FCB Thickness:
0.3mm
Contact Plating:
金
Contact Material:
铜合金
Mfr. Part #:
8.01A0.022200
Package:
SMD,P=0.5mm,Surface Mount,Right Angle
Model Number:
8.01A0.022200
Introduction
Product Overview
This specification applies to the 8.01A series, a 0.5mm pitch dual contact side connector for FFC/FPC with a height of 2.0mm. It features a rear-locking mechanism and is designed for 0.3mm thick cables, supporting 4 to 60 pins. The connector is suitable for SMT soldering and offers dual-sided contact for reliable electrical connections.
Product Attributes
- Brand: DIANWEI
- Origin: DONGGUAN DIANWEI ELECTRONIC TECHNOLOGY CO.,LTD, China
- Certifications: IATF16949, ISO9001:2015, ISO14001, National High-tech Enterprise
- Housing Material: LCP Nature Color (UL 94V-0)
- Cover Material: LCP Black (UL 94V-0)
- Terminal Material: Copper Alloy
- Stator Material: Copper Alloy
Technical Specifications
| Specification | Details |
|---|---|
| Product Series | 8.01A |
| Pitch | 0.5mm |
| Connector Type | FFC/FPC Dual Contact Side Connector |
| Height (H) | 2.0mm |
| Applicable Cable Thickness | 0.3mm |
| Pin Count | 4-60pin |
| Locking Mechanism | Rear-locking |
| Contact Type | Double sides contact |
| Soldering Type | SMT |
| Plating Specification | Contact area and solder area gold plating 1~3u |
| Coplanarity | 0.10mm MAX |
| Operation Temperature | -40 ~ +85 |
| Operation Humidity | 20-85RH |
| Storage Temperature | -10+50 |
| Storage Humidity | 2085%RH |
| Rated Voltage | 50V (AC/DC) at 20 ambient |
| Rated Current | 0.5A / PIN at 20 ambient |
| Contact Resistance (Max) | 30m (mated) |
| Insulation Resistance (Min) | 500M (DC 250V, 1 min) |
| Dielectric Strength | No Damage/Shorting (AC 250V, 1 min) |
| Retention Force of Single Pin (Min) | 0.2N / PIN |
| Retention Force of GND Pin (Min) | 0.3N / PIN |
| Retention Force of FFC/FPC (Min) | 0.3N Min/Pin (PIN Count X 0.3N Min) |
| Shock Test | Acceleration 490m/s, 11ms, 3 times/6 directions; Contact resistance 50m, No Damage after test. |
| Vibration Test | 1.52mm Amplitude, 10~55~10Hz, 2 hours/axis (X/Y/Z); Contact resistance 50m, No Damage after test. |
| Durability (Lock/Dis-lock) | 20 times; Contact resistance 50m, No Damage after test. |
| Heat Resistance Test | 852 for 96H; Contact resistance 50m, No damage, Retention force 0.3N/Pin after test. |
| Humidity Test | 403, 90~95% RH for 96H; Contact resistance 50m, Insulation resistance 500M, No damage after test. |
| High/Low Temperature Cycle | 5 cycles; Contact resistance 50m, Retention force 0.3N/Pin after test. |
| Salt Spray Test (Gold Plating) | 351, 5% salt water density for 48H; No Corrosion after test. |
| Solderability | Wetting by melted tin 90% of dipping area at 2455 for 3sec. |
| Resistance to Soldering Heat | Peak temp: 2505, over 230 for 305Sec.; Contact resistance 50m, No Damage, Retention force 0.3N/Pin after test. |
| Recommended Soldering Profile | Preheating: 150180 (60~120s), Peak temp: 2505, over 225 (305s). Lock cover must be opened during IR reflow. |
2410121336_DIANWEI-8-01A0-022200_C19188800.pdf
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