FFC FPC Dual Contact Side Connector DIANWEI 8.01A0.010200 with 0.5mm Pitch and Back Locking Feature
Manufacturer:
DIANWEI
Description:
FFC/FPC Connector 10 Position 0.5mm Pitch Double-Sided Contacts, Top and Bottom Entry -40℃~+80℃
Category:
FFC, FPC (Flat Flexible) Connector Assemblies/FFC, FPC (Flat Flexible) Connector Assemblies
Specifications
Operating Temperature:
-40℃~+80℃
Number Of Contacts:
10P
Pitch:
0.5mm
Contact Type:
双侧触点/上下接
FFC, FCB Thickness:
0.3mm
Contact Plating:
金
Contact Material:
铜合金
Mfr. Part #:
8.01A0.010200
Package:
SMD,P=0.5mm,Surface Mount,Right Angle
Model Number:
8.01A0.010200
Introduction
Product Overview
This specification covers the 0.5mm pitch dual contact side connector with a height of 2.0mm, designed for 0.3mm thick FFC/FPC cables. It features a back-locking mechanism and dual-sided contact for reliable connections. The connector is suitable for a wide range of applications requiring secure and compact interconnect solutions.
Product Attributes
- Brand: DIANWEI
- Origin: DONGGUAN, CHINA
- Certifications: IATF16949, ISO9001:2015, ISO14001, National High-Tech Enterprise
Technical Specifications
| Attribute | Specification |
|---|---|
| Product Series | 8.01A |
| Pitch | 0.5mm |
| Connector Type | FFC/FPC Dual Contact Side Connector |
| Height (H) | 2.0mm |
| Applicable FFC/FPC Thickness | 0.3mm (4-60pin) |
| Mechanism | Back-locking |
| Housing Material | LCP Nature Color (UL 94V-0) |
| Cover Material | LCP Black (UL 94V-0) |
| Terminal Material | Copper Alloy |
| Stator Material | Copper Alloy |
| Contact Type | Double sides contact |
| Soldering Type | SMT |
| PCB Thickness Compatibility | T=0.30.02mm |
| Plating Specification | Contact area and solder area gold plating 1~3u" |
| Coplanarity | 0.10mm MAX |
| Operation Temperature | -40 ~ +85 |
| Operation Humidity | 20-85RH |
| Storage Temperature | -10+50 |
| Storage Humidity | 2085%RH |
| Rating Voltage | 50V (AC/DC) at 20 ambient temperature |
| Rating Current | 0.5A / PIN at 20 ambient temperature |
| Contact Resistance | 30m Max |
| Insulation Resistance | 500M MIN |
| Dielectric Strength | 250V AC 1Minute between adjacent terminal (No Damage/Shorting) |
| Retention Force of single Pin | 0.2N / PIN MIN |
| Retention Force of GND Pin | 0.3N / PIN MIN |
| Retention Force of FFC/FPC | 0.3N Min/Pin (PIN X 0.3N Min) |
| Shock Test | Acceleration 490m/s, 11ms, 3 times per 6 directions. Discontinuity 1sec, Contact Resistance 50m MAX, No Damage after test. |
| Vibration Test | Amplitude: 1.52mm, Frequency: 10~55~10Hz. Discontinuity 1sec, Contact Resistance 50m MAX, No Damage after test. |
| Durability (Lock/Dis-lock) | 20 times. Contact Resistance 50m MAX, No Damage. |
| Heat Resistance Test | 852 for 96H. Discontinuity 1sec, Contact Resistance 50m MAX, No damage, Retention force 0.3N/Pin. |
| Humidity Test | 403, 90~95% RH for 96H. Discontinuity 1sec, Contact Resistance 50m Max, Insulation Resistance 500 M Min, Dielectric: No damage, Shorting, Visual ok. |
| High/Low Temperature Cycle Test | 5 cycles. Discontinuity 1sec, Contact Resistance 50 m Max, Visual ok, Retention force 0.3N/Pin. |
| Salt Spray Test (Gold Plating) | 5% salt water density, 351 for 48H. No Corrosion. |
| Solderability | Dip 3sec in 2455 tin oven. Easy wetting, Tin coverage >90%. |
| Resistance to Soldering Heat | Preheat: 150~180 (60~120s). Peak temp: 2505, over 230 for 305s. Contact resistance 50m Max, No damage, Retention force 0.3N/Pin. |
| Recommended Soldering Profile | Preheat: 150~180 (60~120s). Peak temp: 2505, over 225 for 305s. (Lock cover shall be opened during IR reflow) |
2410121336_DIANWEI-8-01A0-010200_C19188793.pdf
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