Home > Products > FFC, FPC (Flat Flexible) Connector Assemblies >FFC, FPC (Flat Flexible) Connector Assemblies > Swing Cover Connector for Flexible Flat Cable 0.3mm Thickness Featuring DIANWEI 8.15A0.080200 Model

Swing Cover Connector for Flexible Flat Cable 0.3mm Thickness Featuring DIANWEI 8.15A0.080200 Model

Manufacturer:
DIANWEI
Description:
-40℃~+85℃ Hinged Lid 80P 0.5mm 500mA 50V Bottom Contact Surface Mount, Right Angle SMD,P=0.5mm,Surface Mount,Right Angle FFC, FPC (Flat Flexible) Connector Assemblies RoHS
Category:
FFC, FPC (Flat Flexible) Connector Assemblies/FFC, FPC (Flat Flexible) Connector Assemblies
Specifications
Operating Temperature:
-40℃~+85℃
Locking Feature:
翻盖式
Number Of Contacts:
80P
Pitch:
0.5mm
Current Rating:
500mA
Voltage Rating (Max):
50V
Contact Type:
下接
Mounting Type:
卧贴
FFC, FCB Thickness:
0.3mm
Contact Plating:
Contact Material:
铜合金
Mfr. Part #:
8.15A0.080200
Package:
SMD,P=0.5mm,Surface Mount,Right Angle
Model Number:
8.15A0.080200
Introduction

Product Overview

The DIANWEI 0.5mm FFC/FPC Swing Cover Connector (H=1.8mm) is designed for 0.3mm thick cables and supports 4 to 128 pins. It features a swing cover mechanism for secure FFC/FPC insertion and is suitable for applications requiring reliable electrical, mechanical, and environmental performance.

Product Attributes

  • Brand: DIANWEI
  • Origin: DONGGUAN DIANWEI Electronic Technology CO.,LTD, China
  • Certifications: IATF16949, ISO9001:2015, ISO14001, National High-tech Enterprise
  • Packaging: PE bag vacuum packaging per reel

Technical Specifications

Spec. Item Description Material Dimensions Electrical Ratings Environmental Mechanical
Product Series 0.5mm FFC/FPC Swing Cover Connector Housing: LCP (UL 94V-0)
Cover: LCP (UL 94V-0)
Terminal: Copper Alloy
Stator: Copper Alloy
H=1.8mm Rating Voltage: 50V (AC/DC)
Rating Current: 0.5A / PIN
Operation Temperature: -40 ~ +85
Operation Humidity: 20-85RH
Storage Temperature: -10+50
Storage Humidity: 2085%RH
Applicable for 0.3mm thick cable (4-128pin)
Contact Type: Single side under the contact
TML Soldering: SMT
PCB Thickness: T=0.30.02mm
Plating: Gold plating 1~3u" (contact & solder area)
Coplanarity: 0.10mm MAX
Testing Item Visual Inspection - - - - Comply with drawing and Spec. No Damage
Testing Item Electrical Characters - - Contact Resistance: 30m Max
Insulation Resistance: 500M MIN
Dielectric withstand voltage: 250V AC 1Min (No Damage/Shorting)
- -
Testing Item Mechanic Parameter - - - - Retention Force of single Pin: 0.2N/ PIN MIN
Retention force of GND Pin: 0.3N / PIN MIN
Retention force of FFC/FPC: 0.3N Min/Pin (PIN X 0.3N Min)
Testing Item Vibration - - - Amplitude: 1.52mm, Frequency: 10~55~10Hz FPC
Testing Item Duration - - - 20 times lock/dis-lock Contact resistance: 50mMAX, No Damage
Testing Item Heat Resistance - - - 852 for 96H Contact resistance: 50mMAX, No Damage. Retention force: above 0.3N/Pin
Testing Item Humidity - - Contact Resistance: 50m Max, Insulation Resistance: 500 M Min, Dielectric: No damage, Shorting 403, 90~95% RH for 96H Visual ok
Testing Item High/Low temperature - - Contact Resistance: 50 m Max 5 cycles Retention force: above 0.3N/Pin. Visual ok
Testing Item Salt Spray (Gold Plating) - - - 5% salt water, 351, 48H No Corrosion
Testing Item Solderability - - - Tin oven: 2455, 3sec Soldering tail shall be easy wetting by melted tin, Tin shall cover over 90% of dipping area
Testing Item Resistance to soldering heat - - Contact resistance: 50m Max. Heating profile: 150-180(60-120s), Peak: 2505, >230(305s) Retention force: above 0.3N/Pin. No damage

2410121646_DIANWEI-8-15A0-080200_C20626049.pdf

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