FFC FPC dual contact side connector 1.0mm pitch 2.0mm height DIANWEI 8.04A0.015200 designed for SMT soldering and 4 to 40 pins
Manufacturer:
DIANWEI
Description:
FFC/FPC Connector 15 Position 1mm Pitch Double-Sided Contacts, Top and Bottom Entry -40℃~+80℃
Category:
FFC, FPC (Flat Flexible) Connector Assemblies/FFC, FPC (Flat Flexible) Connector Assemblies
Specifications
Operating Temperature:
-40℃~+80℃
Number Of Contacts:
15P
Pitch:
1mm
Contact Type:
双侧触点/上下接
FFC, FCB Thickness:
0.3mm
Contact Plating:
金
Contact Material:
铜合金
Mfr. Part #:
8.04A0.015200
Package:
SMD,P=1mm,Surface Mount,Right Angle
Model Number:
8.04A0.015200
Introduction
1.0mm FFC/FPC Dual Contact Side Connector (H=2.0mm)
This product is a 1.0mm pitch FFC/FPC dual contact side connector with a height of 2.0mm, designed for 0.3mm thick cables (4-40 pins). It features a back-locking mechanism and is suitable for SMT soldering. The connector offers dual contact for reliable electrical connections.
Product Attributes
- Brand: DIANWEI
- Origin: DONGGUAN DIANWEI ELECTRONIC TECHNOLOGY CO.,LTD
- Certifications: IATF16949, ISO9001:2015, ISO14001, UL 94V-0
Technical Specifications
| Attribute | Specification |
|---|---|
| Series | 8.04A |
| Pitch | 1.0mm |
| Connector Type | FFC/FPC Dual Contact Side Connector |
| Height (H) | 2.0mm |
| Applicable Cable Thickness | 0.3mm 0.02mm |
| Pin Count | 4-40pin |
| Locking Mechanism | Back-locked (Rotary) |
| Housing Material | LCP Nature Color (UL 94V-0) |
| Cover Material | LCP Black (UL 94V-0) |
| Terminal Material | Copper Alloy |
| Stator Material | Copper Alloy |
| Contact Type | Dual contact |
| Soldering Type | SMT |
| Plating Specification | Contact area and solder area gold plating 1~3u |
| Coplanarity | 0.10mm MAX |
| Operation Temperature | -40 ~ +85 (Non-condensing) |
| Operation Humidity | 20-85RH |
| Storage Temperature | -10 ~ +50 (Non-condensing) |
| Storage Humidity | 20 ~ 85%RH |
| Rating Voltage | 50V (AC/DC) at 20 |
| Rating Current | 0.5A / PIN at 20 |
| Contact Resistance | 30m Max (mated) |
| Insulation Resistance | 500M MIN (between adjacent terminals) |
| Dielectric Strength | 250V AC for 1 minute (between adjacent terminals, no breakdown) |
| Retention Force of single Pin | 0.2N / PIN MIN |
| Retention Force of GND Pin | 0.3N / PIN MIN |
| Retention Force of FFC/FPC | 0.3N Min/Pin |
| Shock Resistance | 490m/s, 11ms, 3 times per axis (no discontinuity > 1sec, Contact Resistance 50m, no damage) |
| Vibration Resistance | 1.52mm amplitude, 10~55~10Hz, 2 hours per axis (no discontinuity > 1sec, Contact Resistance 50m, no damage) |
| Durability (Lock/Dis-lock) | 20 times (Contact Resistance 50m, no damage) |
| Heat Resistance | 96H at 852 (Contact Resistance 50m, Retention Force 0.3N/Pin, no damage) |
| Humidity Resistance | 96H at 403, 90~95% RH (Contact Resistance 50m, Insulation Resistance 500 M, Dielectric: no damage/shorting, Visual ok) |
| High/Low Temperature Cycle | 5 cycles (Contact Resistance 50 m, Retention Force 0.3N/Pin, Visual ok) |
| Salt Spray (Gold Plating) | 48H in 5% salt water at 351 (No corrosion) |
| Solderability | Dip at 2455 for 3sec (easy wetting, >90% coverage) |
| Resistance to Soldering Heat | Peak temp: 260, >230 for 305 sec (Contact resistance 50m, Retention Force 0.3N/Pin, no damage) |
| Recommended Soldering Profile | Pre-heat: 150180 60~120Sec., Peak temp: 2505, >225 for 305Sec. (Lock cover shall be opened) |
2410121336_DIANWEI-8-04A0-015200_C19188843.pdf
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